Abstract: A non-volatile storage apparatus that comprises a plurality of planes of non-volatile memory cells is capable of concurrently programming memory cells in multiple planes. In order to screen for failure of the programming process in a subset of planes, the completion of programming of a fastest plane to a particular data state is used as a trigger to test for program failure of other planes to a different data state. In one embodiment, the test for program failure of other planes to the different data state comprises determining if the memory cells of the other planes that are targeted for programming to the different data state have successfully completed verification of programming for the different data state. The programming process is stopped for those planes that fail the test.

Abstract: A non-volatile memory device, described herein, comprises: a plurality of memory strings and at least one control circuit in communication with the non-volatile memory cell array. The at least one control circuit is configured to perform, for the plurality of memory strings, one erase-verify iteration in an erase operation including determining whether at least one memory string of the plurality of memory strings passes an erase-verify test. The at least one control circuit is configured to, if the at least one memory string passes the erase-verify test, inhibit the at least one memory string for erase including ramping up, to an erase voltage, of a voltage applied to a gate of a SGD transistor of the at least one memory string and to perform a next erase-verify iteration in the erase operation for remaining memory strings of the plurality of memory strings other than the at least one memory string.

Abstract: A non-volatile storage apparatus that comprises a plurality of planes of non-volatile memory cells is capable of concurrently programming memory cells in multiple planes. In order to screen for failure of the programming process in a subset of planes, the completion of programming of a fastest plane to a particular data state is used as a trigger to test for program failure of other planes to a different data state. In one embodiment, the test for program failure of other planes to the different data state comprises determining if the memory cells of the other planes that are targeted for programming to the different data state have successfully completed verification of programming for the different data state. The programming process is stopped for those planes that fail the test.

Abstract: A non-volatile memory device, described herein, comprises: a plurality of memory strings and at least one control circuit in communication with the non-volatile memory cell array. The at least one control circuit is configured to perform, for the plurality of memory strings, one erase-verify iteration in an erase operation including determining whether at least one memory string of the plurality of memory strings passes an erase-verify test. The at least one control circuit is configured to, if the at least one memory string passes the erase-verify test, inhibit the at least one memory string for erase including ramping up, to an erase voltage, of a voltage applied to a gate of a SGD transistor of the at least one memory string and to perform a next erase-verify iteration in the erase operation for remaining memory strings of the plurality of memory strings other than the at least one memory string.

Abstract: In order to have different subsets of memory cells of a non-volatile memory system erase at the same speed, it is proposed to perform erasing by separately controlling the speed of erase for the different subsets in response to observing speed information for the subsets during the erasing.

Abstract: In order to have different subsets of memory cells of a non-volatile memory system erase at the same speed, it is proposed to perform erasing by separately controlling the speed of erase for the different subsets in response to observing speed information for the subsets during the erasing.

Abstract: A memory device includes memory cells arranged in NAND strings between select gate transistors. A threshold voltage (Vth) distribution of the select gate transistors is evaluated, such as in response to a program, erase or read command involving a block or sub-block of memory cells. For example, a lower tail and an upper tail of the Vth distribution can be evaluated using read voltages. If the Vth is out-of-range, such as due to read disturb, data retention loss or defects in the memory device, the block or sub-block is marked as being bad and previously-programmed data in the block or sub-block can be copied to another location. If the Vth is in range, the command can be executed. Also, a control gate voltage for the select gate transistors can be set based on a Vth metric which is obtained from the evaluation.

Abstract: A memory device includes memory cells arranged in NAND strings between select gate transistors. A threshold voltage (Vth) distribution of the select gate transistors is evaluated, such as in response to a program, erase or read command involving a block or sub-block of memory cells. For example, a lower tail and an upper tail of the Vth distribution can be evaluated using read voltages. If the Vth is out-of-range, such as due to read disturb, data retention loss or defects in the memory device, the block or sub-block is marked as being bad and previously-programmed data in the block or sub-block can be copied to another location. If the Vth is in range, the command can be executed. Also, a control gate voltage for the select gate transistors can be set based on a Vth metric which is obtained from the evaluation.

Abstract: To propose a new channel structure suitable for high efficiency source side injection, and provide a non-volatile semiconductor memory device and a charge injection method using the same. The non-volatile memory device includes a first conductivity type semiconductor substrate (SUB), a first conductivity type inversion layer-forming region (CH1), second conductivity type accumulation layer-forming regions (ACLa, ACL2b), second conductivity type regions (S/D1, S/D2), an insulating film (GD0) and a first conductive layer (CL) formed on the inversion layer-forming region (CH1). A charge accumulation film (GD) and a second conductive layer (WL) are stacked on an upper surface and side surface of the first conductive layer (CL), an exposure surface of the inversion layer-forming region (CH1), and an upper surface of the accumulation layer-forming regions (ACLa, ACLb) and the second conductivity type regions (S/D1, S/D2).

Abstract: A non-volatile semiconductor memory having a memory transistor including a stacked-layer film formed between a semiconductor substrate and a gate electrode and having a charge storage ability, a first conductivity type region of the semiconductor substrate in which a channel is formed under the control of the gate electrode via the stacked-layer film, and two second conductivity type regions formed at the semiconductor substrate sandwiching the first conductivity type region therebetween, the memory transistor having a channel length L which is between channel lengths L1 and L2. with the channel length L1 being estimated as the boundary of occurrence of a short channel effect at the time of a write operation and the channel length L2 the time of a read operation, with the channel length L1 being different from the channel length L2.

Abstract: A non-volatile semiconductor memory having a memory transistor including a stacked-layer film formed between a semiconductor substrate and a gate electrode and having a charge storage ability, a first conductivity type region of the semiconductor substrate in which a channel is formed under the control of the gate electrode via the stacked-layer film, and two second conductivity type regions formed at the semiconductor substrate sandwiching the first conductivity type region therebetween, the memory transistor having a channel length estimated as the boundary of occurrence of a short channel effect differing between the time of a write operation and the time of a read operation and has a channel length of the actual device between the different channel lengths.

Abstract: A nonvolatile semiconductor memory apparatus capable of attaining a low voltage when writing data, wherein charge injection into an unnecessary portion is not performed when reading, and capable of unifying a threshold voltage level when erasing, comprising a first conductive type semiconductor region, two source/drain regions made by a second conductive type semiconductor, a plurality of dielectric films stacked on a first conductive type semiconductor region between the two source/drain regions, and a gate electrode; wherein the first conductive type semiconductor region between the two source/drain regions includes a first region wherein a channel is formed by an inversion layer of a minority carrier and a second region formed between the first region and a source/drain region on one side of the first region and having higher concentration than that of the first region.

Abstract: To propose a new channel structure suitable for high efficiency source side injection, and provide a non-volatile semiconductor memory device and a charge injection method using the same. The non-volatile memory device includes a first conductivity type semiconductor substrate (SUB), a first conductivity type inversion layer-forming region (CH1), second conductivity type accumulation layer-forming regions (ACLa, ACL2b), second conductivity type regions (S/D1, S/D2), an insulating film (GD0) and a first conductive layer (CL) formed on the inversion layer-forming region (CH1). A charge accumulation film (GD) and a second conductive layer (WL) are stacked on an upper surface and side surface of the first conductive layer (CL), an exposure surface of the inversion layer-forming region (CH1), and an upper surface of the accumulation layer-forming regions (ACLa, ACLb) and the second conductivity type regions (S/D1, S/D2).

Abstract: To propose a new channel structure suitable for high efficiency source side injection, and provide a non-volatile semiconductor memory device and a charge injection method using the same. The non-volatile memory device includes a first conductivity type semiconductor substrate (SUB), a first conductivity type inversion layer-forming region (CH1), second conductivity type accumulation layer-forming regions (ACLa, ACL2b), second conductivity type regions (S/D1, S/D2), an insulating film (GD0) and a first conductive layer (CL) formed on the inversion layer-forming region (CH1). A charge accumulation film (GD) and a second conductive layer (WL) are stacked on an upper surface and side surface of the first conductive layer (CL), an exposure surface of the inversion layer-forming region (CH1), and an upper surface of the accumulation layer-forming regions (ACLa, ACLb) and the second conductivity type regions (S/D1, S/D2).

Abstract: A nonvolatile semiconductor memory apparatus capable of attaining a low voltage when writing data, wherein charge injection into an unnecessary portion is not performed when reading, and capable of unifying a threshold voltage level when erasing, comprising a first conductive type semiconductor region, two source/drain regions made by a second conductive type semiconductor, a plurality of dielectric films stacked on a first conductive type semiconductor region between the two source/drain regions, and a gate electrode; wherein the first conductive type semiconductor region between the two source/drain regions includes a first region wherein a channel is formed by an inversion layer of a minority carrier and a second region formed between the first region and a source/drain region on one side of the first region and having higher concentration than that of the first region.

Abstract: To propose a new channel structure suitable for high efficiency source side injection, and provide a non-volatile semiconductor memory device and a charge injection method using the same. The non-volatile memory device includes a first conductivity type semiconductor substrate (SUB), a first conductivity type inversion layer-forming region (CH1), second conductivity type accumulation layer-forming regions (ACLa, ACL2b), second conductivity type regions (S/D1, S/D2), an insulating film (GD0) and a first conductive layer (CL) formed on the inversion layer-forming region (CH1). A charge accumulation film (GD) and a second conductive layer (WL) are stacked on an upper surface and side surface of the first conductive layer (CL), an exposure surface of the inversion layer-forming region (CH1), and an upper surface of the accumulation layer-forming regions (ACLa, ACLb) and the second conductivity type regions (S/D1, S/D2).