Patents by Inventor Hidetoshi Awata

Hidetoshi Awata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COF flexible printed wiring board and method of producing the wiring board
    Patent number: 7382042
    Abstract: The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, and which exhibits no drop in bonding strength during panel bonding carried out after mounting of semiconductor chips, whereby reliability and productivity of a semiconductor chip mounting line is enhanced. The invention also provides a method of producing the COF flexible printed wiring board.
    Type: Grant
    Filed: September 27, 2005
    Date of Patent: June 3, 2008
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Hidetoshi Awata, Yasuhiro Kiridoshi
  • COF flexible printed wiring board and method of producing the wiring board
    Publication number: 20060065956
    Abstract: The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, and which exhibits no drop in bonding strength during panel bonding carried out after mounting of semiconductor chips, whereby reliability and productivity of a semiconductor chip mounting line is enhanced. The invention also provides a method of producing the COF flexible printed wiring board.
    Type: Application
    Filed: September 27, 2005
    Publication date: March 30, 2006
    Inventors: Hidetoshi Awata, Yasuhiro Kiridoshi