Patents by Inventor Hidetoshi Hagihara

Hidetoshi Hagihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dummy interconnects for suppressing thermally generated stress cracks
    Patent number: 6570243
    Abstract: A semiconductor device formed of a first dummy interconnect, an interlayer insulating film and a second dummy interconnect which are formed on a semiconductor chip in this order and a plurality of dummy via holes formed in the interlayer insulating film between the first dummy interconnect and the second dummy interconnect; wherein at least one of the first dummy interconnect and the second dummy interconnect is connected with at least two of the dummy via holes.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: May 27, 2003
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Hidetoshi Hagihara