Abstract: By using a conductive adhesive prepared by dispersing conductive particles such as a nickel filler in a thermally or optically curable adhesive comprising a base resin having heat resistance and flexibility after curing, such as EVA, PVB, acrylic resin or unsaturated polyester, as an adhesive for making the shielding conductive layer of a shielded flat cable conductive with the ground line of a cable body in a non-insulated portion and bonding the cable body to the shielding member, the heat resistance and connection reliability in a high temperature and high humidity condition of the shielded flat cable are ensured.

Abstract: An anisotropically electroconductive film, which has a high reliability in its capacity for conducting electricity and also a good adhesion under such an adhesive condition that the film is heated at a temperature of 130° C. or less for a short period of time, has a layer of an adhesive within which electroconductive particles are distributed. The adhesive is composed of a thermosetting resin composition including a base resin, a reactive compound, an organic peroxide and a reaction accelerating compound, and also the electroconductive particles incorporated into the thermosetting resin composition. The base resin is a polyacetalized resin which is obtained by acetalizing a polyvinyl alcohol. The reactive compound is at least one selected from a group consisting of acryloxy group-bearing compounds, methacryloxy group-bearing compounds and epoxy group-bearing compounds. The reaction accelerating compound is a compound which has a radically reactive group and alkali-reactive group as its end groups.