Abstract: A mounting head is configured to be detachably attached to a mounting device main body. This mounting head includes a storage section having multiple storage areas, and a storage control section configured to acquire multiple operation data relating to an operation of the mounting head individually at different timings and store the multiple operation data individually in the multiple storage areas in such a state that the mounting head is attached to the mounting device main body.

Abstract: A component mounting system includes a head to revolve multiple suction nozzles in a circumferential direction, a lifting and lowering device configured to lift and lower a suction nozzle at a predetermined revolving position, a storage device configured to store any one of multiple pieces of directionality information in association with identification information of the suction nozzle, and a control device configured to acquire corresponding directionality information from the storage device based on the acquired identification information of the suction nozzle and to perform pickup of the component supplied from the component supply device at the spinning position in accordance with the directionality information.

Abstract: A component mounting machine includes multiple component supplying devices, a head, a head moving device, and a nozzle lifting and lowering device. The component supplying device feeds out a component to a component supply position. The head includes multiple nozzles configured to suction a component. The head moving device moves the head to cause the nozzles to face the respective component supply positions with two or more thereof. The nozzle lifting and lowering device lifts and lowers the nozzle located to face the component supply positions. In positioning the nozzles to face the respective component supply positions, the head is moved so as to prioritize a positional correction of a nozzle facing a smallest sized component over positional corrections of the other nozzles, and in this state, the nozzles facing the respective component supply positions are lifted and lowered simultaneously to suction corresponding components.

Abstract: The pick-up tool is a tool used in a mounting device configured to mount a component on a board supported by backup pins disposed on a backup plate. The pick-up tool includes an attaching portion configured to be attached to a moving head moving the backup pin; a slit formed in an insertion direction in which an engaging portion formed on the distal end of the backup pin is inserted; and a groove, being formed orthogonally to the slit, into which the engaging portion enters.

Abstract: A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to use a component mounting tool to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a remaining detecting section to detect whether the component remains at the supply position in a case in which it is detected by the holding detecting section that the component is not being held by the component mounting tool; and a dropped determining section to determine whether the component has dropped.

Abstract: An analysis device is a device for use for a component mounting device including a pickup member configured to be moved relative to a board by means of a moving device and a contact detection sensor configured to detect that a component picked up by the pickup member is brought into contact with the board to analyze a mounting state of the component mounting device. The analysis device includes a storage device configured to store multiple detection result data relating to detection results obtained by the contact detection sensor when the component is mounted on the board in association with mounting conditions when the detection results are obtained by the contact detection sensor, and an output device configured to count the multiple detection result data stored in the storage device by at least two conditions in the mounting conditions and output the multiple detection result data so counted.

Abstract: A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a retry performing section to determine whether to perform a retry operation of attempting to pick up the component again using the component mounting tool based on a detection result of the component detecting section and a detection result of the holding detecting section, and to perform the retry operation in accordance with a result of the determining of whether to perform the retry operation.

Abstract: A mounting head is configured to be detachably attached to a mounting device main body. This mounting head includes a storage section having multiple storage areas, and a storage control section configured to acquire multiple operation data relating to an operation of the mounting head individually at different timings and store the multiple operation data individually in the multiple storage areas in such a state that the mounting head is attached to the mounting device main body.

Abstract: A component mounting machine including a head unit that has a head main body configured to hold multiple pickup members each capable of picking up a component at a predetermined interval along a predetermined circumference and to be capable of rotating forward and reverse directions; a moving device configured to move the head unit; a lifting and lowering device configured to lift and lower a pickup member; a component supply device configured to be capable of supplying the component to the pickup member; and a control device configured to control those described above. The control device performs a control such that the pickup members pick up the components supplied by the component supply device, and each component is mounted on a board after a completion of the pickup, while performing an operation of rotating the head main body and an operation of moving the head unit together.

Abstract: A component mounter including a mounting head having multiple holding bodies, a revolving mechanism configured to revolve the multiple holding bodies along a revolution trajectory, a rotating mechanism configured to cause the multiple holding bodies to rotate on their axes in synchronism with each other, a detection section configured to detect a component located in one or more component detection positions which are different from the component pickup positions on the revolution trajectory from a side thereof; and a control section. The control section performs component pickup processing for causing the mounting head to cause at least one of the holding bodies located in the component pickup position to pick up and hold the component and holding body revolving processing for causing the revolving mechanism to locate the holding body that does not hold the component.

Abstract: A component mounter of the present disclosure including a mounting head configured to pick up components and mount the components onto a substrate; a head moving device configured to move the mounting head in parallel to a horizontal plane; and a conveyance device configured to convey the substrate in a conveyance direction parallel to the horizontal plane. The mounting head includes multiple nozzles configured to pick up and hold the components by a negative pressure, multiple switching valves provided corresponding to each of the multiple nozzles and configured to switch whether the negative pressure is supplied to the corresponding nozzle, a nozzle moving device configured to change which nozzle is positioned at each of a first nozzle position and a second nozzle position for moving the multiple nozzles and performing at least one of picking up and mounting of the components, a first driving device, and a second driving device.

Abstract: In a rotary head type component mounter, among a specified quantity of suction nozzles held by a rotary head, multiple suction nozzles are lowered simultaneously. When the rotary head is moved by a head moving mechanism to a nozzle exchange area and exchange of suction nozzles is performed, two station reference marks of the nozzle station are imaged by a mark imaging camera, image recognition is performed of the positions of the two station reference marks, and the position and angle of the nozzle station is calculated. Then, the position and angle of the rotary head is corrected to be aligned with the position and angle of the nozzle station, multiple of the suction nozzles held on the rotary head are lowered simultaneously by Z-axis driving mechanisms and simultaneously exchanged with multiple of the suction nozzles in the nozzle station.

Abstract: A component mounting system includes a head to revolve multiple suction nozzles in a circumferential direction, a lifting and lowering device configured to lift and lower a suction nozzle at a predetermined revolving position, a storage device configured to store any one of multiple pieces of directionality information in association with identification information of the suction nozzle, and a control device configured to acquire corresponding directionality information from the storage device based on the acquired identification information of the suction nozzle and to perform pickup of the component supplied from the component supply device at the spinning position in accordance with the directionality information.

Abstract: There is provided a component mounter for mounting a component on a mounting target object, including: a mounting head comprising a base section having, in the interior thereof, a first gas passage and a second gas passage that does not communicate with the first gas passage; a lifting and lowering mechanism for lifting and lowering the base section; a suction nozzle having a nozzle section disposed below the base section and configured to be lifted up and lowered, as the base section is lifted up and lowered, to pick up the component through a negative pressure supplied to the first gas passage; a biasing section for biasing the nozzle section downwards while permitting the nozzle section to be pushed in towards the base section; and a valve for switching between presence and absence of communication between the second gas passage and the outside depending on whether a push-in amount of the nozzle section has not yet reached or reached a predetermined value; and a detecting device for detecting at least one

Abstract: A component mounter includes a mounting head configured to revolve multiple nozzle holders to which multiple pickup nozzles can detachably be attached individually in a circumferential direction and to allow the multiple pickup nozzles to rotate on their own axes while being interlocked with each other and two Z-axis drive devices provided at two locations on a revolving orbit of the multiple pickup nozzles to raise and lower the pickup nozzles situated at the two locations. Then, when a component supplied from a component supply device can be picked up at any of multiple different nozzle angles of the pickup nozzle, the component mounter moves the pickup nozzle to a revolving angle at which the pickup nozzle can be raised and lowered and then lowers the pickup nozzle to pick up the component at a nozzle angle of the multiple nozzle angles which involves a smaller moving amount.

Abstract: In a rolled H-shape steel, at a (?)F position from an outer edge surface in a flange width-direction a microstructure at a depth of 100 ?m from an outer surface in the flange thickness-direction and a microstructure at a depth of (½)tf from the outer surface in the flange thickness-direction contain 95% or more of ferrite and pearlite and 5% or less of a residual structure by area ratio, the difference in Vickers hardness therebetween is 50 Hv or less, the yield strength is 385 to 505 N/mm2, the tensile strength is 550 to 670 N/mm2, the yield ratio is 0.80 or less, an elongation is 16.0% or more, the V-notch Charpy absorbed energy at 0° C. is 70 J or more, the height is 700 to 1000 mm, the flange width is 200 to 400 mm, the flange thickness is 22 to 40 mm, and the web thickness is 16 mm or more.

Abstract: A component mounting positional deviation amount measurement unit is set in a feeder setting section of a component mounting machine so as to be exchangeable with a cassette-type feeder, and includes measurement nozzle placement sections in which measurement nozzles exchangeably held in a mounting head of the component mounting machine are placed; measurement component placement sections in which measurement components are placed; and a measurement mounting table on which a measurement fiducial mark is provided.

Abstract: A rotary head, on which are arranged in a circumferential direction multiple nozzle holders each holding a suction nozzle, is provided with, separately to first negative pressure supply unit that supplies negative pressure to the suction openings of all the suction nozzles, second negative pressure supply unit that supplies negative pressure to the suction nozzle held by the nozzle holder that is lowerable when that nozzle holder is lowered. Accordingly, when performing pickup operation and mounting operation using the suction nozzle, the state of the suction nozzle is not affected by the state of the other suction nozzles.

Abstract: The pick-up tool is a tool used in a mounting device configured to mount a component on a board supported by backup pins disposed on a backup plate. The pick-up tool includes an attaching portion configured to be attached to a moving head moving the backup pin; a slit formed in an insertion direction in which an engaging portion formed on the distal end of the backup pin is inserted; and a groove, being formed orthogonally to the slit, into which the engaging portion enters.

Abstract: Provided is a steel H-shape for low temperature service including a predetermined chemical composition. A CEV obtained by CEV=C+Mn/6+(Cr+Mo+V)/5+(Ni+Cu)/15 is 0.40 or less. A sum of an area ratio of one or both of ferrite and bainite at a 1/4 position from an outer side across a thickness of a flange and a 1/6 position from an outer side across a flange width is 90% or more, and an area ratio of a hard phase is 10% or less. An effective grain size is 20.0 ?m or less, and a grain size of the hard phase is 10.0 ?m or less. 30 pieces/mm2 or more Ti oxides having an equivalent circle diameter ranging from 0.01 to 3.0 ?m are included. The thickness of the flange ranges from 12 to 50 mm.