Abstract: The Electronic Module includes body case 2 that comprises a plurality of case members 3, 4 by abutting each other and that has an internal space (S) where the first opening P1 is formed on one side surface of the internal space (S) and the second opening P2 that opens in a direction different from that of the first opening P1 is in an exposed state when a plurality of the case members 3, 4 are separated each other, a substrate 5 on which a sensor IC 51 is mounted and that is housed in the internal space (S) of the body case 2, and a resin body 6 that covers the substrate 5 by being filled in the internal space (S) of the body case 2 and solidified or hardened, and is characterized by that a plurality of the case members 3, 4.

Abstract: The Electronic Module includes body case 2 that comprises a plurality of case members 3, 4 by abutting each other and that has an internal space (S) where the first opening P1 is formed on one side surface of the internal space (S) and the second opening P2 that opens in a direction different from that of the first opening P1 is in an exposed state when a plurality of the case members 3, 4 are separated each other, a substrate 5 on which a sensor IC 51 is mounted and that is housed in the internal space (S) of the body case 2, and a resin body 6 that covers the substrate 5 by being filled in the internal space (S) of the body case 2 and solidified or hardened, and is characterized by that a plurality of the case members 3, 4.

Abstract: The Electronic Module has a body case 2, including a plurality of case members 3, 4 and that has an internal space (S) where a first opening P1 is formed on one side surface of the internal space and a second opening P2 that opens in a direction different from that of the first opening P1 is in an exposed state when a plurality of the case members are separated each other, a substrate 5 on which a sensor IC 51 is mounted and that is housed in the internal space of the body case, and a resin body 6 that covers the substrate 5 by being filled in the internal space of the body case and solidified or hardened, and is characterized by that a plurality of the case members and the substrate 5 are integrated by the use of the resin body 6 as an accouplement.

Abstract: The Electronic Module has a body case 2, including a plurality of case members 3, 4 and that has an internal space (S) where a first opening P1 is formed on one side surface of the internal space and a second opening P2 that opens in a direction different from that of the first opening P1 is in an exposed state when a plurality of the case members are separated each other, a substrate 5 on which a sensor IC 51 is mounted and that is housed in the internal space of the body case, and a resin body 6 that covers the substrate 5 by being filled in the internal space of the body case and solidified or hardened, and is characterized by that a plurality of the case members and the substrate 5 are integrated by the use of the resin body 6 as an accouplement.

Abstract: An A/D conversion device includes a first A/D converter that receives an analog vibration signal corresponding to a vibration detected by a vibration detecting sensor and converts the analog vibration signal to a first digital value, an analog amplifier that amplifies the analog vibration signal and outputs an amplified signal, a second A/D converter that converts the amplified signal to a second digital value, a determiner that determines whether an amplitude of the amplified signal input to the second A/D converter exceeds a range of amplitude that is convertible by the second A/D converter, and a selector that receives the first digital value and the second digital value and output one of the first and second digital values based on the determination of the determiner.

Abstract: The present invention provides a vibration damping device which can enhance a vibration damping effect even in a case where a vibration damping target position and a vibration damping force generation position are different from each other.

Abstract: An A/D conversion device includes a first A/D converter that receives an analog vibration signal corresponding to a vibration detected by a vibration detecting sensor and converts the analog vibration signal to a first digital value, an analog amplifier that amplifies the analog vibration signal and outputs an amplified signal, a second A/D converter that converts the amplified signal to a second digital value, a determiner that determines whether an amplitude of the amplified signal input to the second A/D converter exceeds a range of amplitude that is convertible by the second A/D converter, and a selector that receives the first digital value and the second digital value and output one of the first and second digital values based on the determination of the determiner.

Abstract: A method of producing an electronic module having an electronic part and a mounting part for mounting the electric module to an external apparatus, includes a step of disposing the electronic part in a cavity of a die, a step of disposing the mounting part in the die with a first portion of the mounting part being positioned in the cavity and a second portion of the mounting part being outside of the cavity, a step of supplying a resin into the cavity of the die, a step of curing the resin while the electronic part and the first portion of the mounting part are immersed in the resin in the cavity of the die, and a step of extracting the resin from the cavity after the resin is cured in the step of curing.

Abstract: The present invention provides a vibration damping device which can enhance a vibration damping effect even in a case where a vibration damping target position and a vibration damping force generation position are different from each other.