Patents by Inventor Hidetoshi Katou

Hidetoshi Katou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10675962
    Abstract: A hybrid vehicle driving system includes: a generator; a motor; a case which accommodates the generator and the motor; and a power control unit for controlling the generator and the motor, the generator and the motor being disposed side by side on a same axis within the case. The power control unit is mounted on the case by connecting a unit-side generator connector and a unit-side motor connector which are provided on a bottom surface of the power control unit with a case-side generator connector and a case-side motor connector which are disposed on the case, directly and respectively. The case is fixed to a vehicle framework member via a mount member, and a fixing point where the case and the mount member are fixed together is disposed near the case-side generator connector and the case-side motor connector.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: June 9, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Eiichirou Urabe, Hiroshi Takei, Takashi Fukuda, Hidetoshi Katou, Hitoshi Saika, Tsukasa Aiba, Takahiro Hagimoto, Jun Masuda
  • Publication number: 20180022202
    Abstract: A hybrid vehicle driving system includes: a generator; a motor; a case which accommodates the generator and the motor; and a power control unit for controlling the generator and the motor, the generator and the motor being disposed side by side on a same axis within the case. The power control unit is mounted on the case by connecting a unit-side generator connector and a unit-side motor connector which are provided on a bottom surface of the power control unit with a case-side generator connector and a case-side motor connector which are disposed on the case, directly and respectively. The case is fixed to a vehicle framework member via a mount member, and a fixing point where the case and the mount member are fixed together is disposed near the case-side generator connector and the case-side motor connector.
    Type: Application
    Filed: January 28, 2015
    Publication date: January 25, 2018
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Eiichirou Urabe, Hiroshi Takei, Takashi Fukuda, Hidetoshi Katou, Hitoshi Saika, Tsukasa Aiba, Takahiro Hagimoto, Jun Masuda
  • Patent number: 8263490
    Abstract: A formation method of a metallic electrode of a semiconductor device is disclosed. The method includes: acquiring data about surface shape of a surface part of a semiconductor substrate; and causing a deformation device to deform the semiconductor substrate based on the data so that a distance between a cutting plane and the surface part falls within a required accuracy in cutting amount. In deforming the semiconductor substrate, multiple actuators are used as the deformation device. A pitch of the multiple actuators is set to a value that is greater than one-half of wavelength of spatial frequency of a thickness distribution of the semiconductor substrate and that is less than or equal to the wavelength.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: September 11, 2012
    Assignee: DENSO CORPORATION
    Inventors: Manabu Tomisaka, Hidetoshi Katou, Yutaka Fukuda, Akira Tai, Kazuo Akamatsu, Yoshiko Fukuda, Yuji Fukuda, Mika Ootsuki
  • Publication number: 20110207241
    Abstract: A formation method of a metallic electrode of a semiconductor device is disclosed. The method includes: acquiring data about surface shape of a surface part of a semiconductor substrate; and causing a deformation device to deform the semiconductor substrate based on the data so that a distance between a cutting plane and the surface part falls within a required accuracy in cutting amount. In deforming the semiconductor substrate, multiple actuators are used as the deformation device. A pitch of the multiple actuators is set to a value that is greater than one-half of wavelength of spatial frequency of a thickness distribution of the semiconductor substrate and that is less than or equal to the wavelength.
    Type: Application
    Filed: September 28, 2010
    Publication date: August 25, 2011
    Applicant: DENSO CORPORATION
    Inventors: Manabu Tomisaka, Hidetoshi Katou, Yutaka Fukuda, Yoshiko Fukuda, Akira Tai, Kazuo Akamatsu
  • Publication number: 20090033934
    Abstract: A droplet formation apparatus is provided for calibrating a particle size measurement apparatus. A vessel stores sample liquid. A pressure unit applies predetermined pressure to the sample liquid in the vessel. An oscillator is provided to one surface of the vessel for applying oscillation, which has a predetermined frequency, to the sample liquid in the vessel. An orifice is provided to an other surface of the vessel. The orifice has at least one discharge hole. The orifice is configured to form a droplet, which has a predetermined particle size, from the sample liquid and configured to discharge the droplet in accordance with the predetermined pressure and the predetermined frequency applied to the sample liquid in the vessel.
    Type: Application
    Filed: July 2, 2008
    Publication date: February 5, 2009
    Applicant: DENSO CORPORATION
    Inventors: Hidetoshi Katou, Makoto Yamaguchi, Yoshinori Yamashita