Patents by Inventor Hidetoshi Kawai

Hidetoshi Kawai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968785
    Abstract: A mounting device includes a mounting head, having a rotating body, which turns multiple pickup members by rotating the rotating body, in which the rotating body holds multiple pickup members, each of which being configured to pick up a component, the multiple pickup members being disposed at predetermined intervals along a predetermined circumference of the rotating body, and executes a forward rotation pickup processing of causing the pickup members to pick up the components from a supply section for supplying the components, and rotates the rotating body forwards, and when at least one of the pickup members is vacant resulting from an error of not holding the component, executes a backward rotation pickup processing which includes a processing of causing the rotating body to rotate backwards and a processing of causing the vacant pickup member to pick up the component from the supply section.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: April 23, 2024
    Assignee: FUJI CORPORATION
    Inventor: Hidetoshi Kawai
  • Patent number: 11943870
    Abstract: An automatic exchanging device moves along a front face of component mounting line in an arrangement direction of multiple component mounters to automatically exchange a feeder with respect to feeder setting section of each component mounter. A production management computer of the component mounting line or control device of each component mounter monitors an arrangement status of the feeder set in the feeder setting section of each component mounter, and when it is determined that an empty space of the feeder setting section of any one of the component mounters is equal to or larger than a predetermined value based on a monitoring result, controls an operation of the automatic exchanging device, such that an automatically exchangeable unit is set in the empty space of the feeder setting section of the component mounter.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: March 26, 2024
    Assignee: FUJI CORPORATION
    Inventor: Hidetoshi Kawai
  • Publication number: 20240074131
    Abstract: A mounting work system includes at least one feeder automatic exchange work machine configured to mount a component, which is supplied by a tape feeder mounted on a mounting stand, on a board conveyed by a conveyance device, the tape feeder mounted on the mounting stand being configured to be automatically exchanged by an operation of a tape feeder exchange device, at least one feeder manual exchange work machine configured to mount a component, which is supplied by a tape feeder mounted on a mounting stand, on the board conveyed by a conveyance device, the tape feeder mounted on the mounting stand being configured to be manually exchanged by an operator, and a housing formed with a housing space for housing at least one tape feeder, arranged in a conveyance direction of the conveyance devices, and disposed adjacent to the at least one feeder automatic exchange work machine.
    Type: Application
    Filed: January 19, 2021
    Publication date: February 29, 2024
    Applicant: FUJI CORPORATION
    Inventors: Mizuho NOZAWA, Hidetoshi KAWAI, Masataka IWASAKI
  • Patent number: 11871521
    Abstract: A component mounting machine includes a mark imaging camera that images a board mark of a circuit board and has a function of identifying an identification target, such as a character attached to an upper surface of a component supplied by a component supply device. An illumination light source illuminates the identification target on the upper surface of the component imaged by the mark imaging camera and is attached to a lower portion of an electric component holding frame provided to protrude to the side of the mounting head. As the identification target on the upper surface of the component, which is illuminated by the illumination light source from obliquely above, is imaged by the mark imaging camera from above and the image is processed, the identification target on the upper surface of the component is identified.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: January 9, 2024
    Assignee: FUJI CORPORATION
    Inventors: Yusuke Yamakage, Hidetoshi Kawai
  • Patent number: 11718708
    Abstract: A curable composition is provided that includes an alkenyl phenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and a thermosetting resin E, in which the thermosetting resin E contains one or more selected from the group consisting of a maleimide compound, a cyanate ester compound, a phenolic compound, an alkenyl-substituted nadimide compound, and an epoxy compound.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: August 8, 2023
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Mayumi Kikuchi, Hidetoshi Kawai
  • Patent number: 11702504
    Abstract: A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: July 18, 2023
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Shohei Yamaguchi, Katsuya Tomizawa, Norihiro Shida, Hidetoshi Kawai
  • Publication number: 20230217637
    Abstract: A component mounting system includes a mounting machine configured to perform a mounting process of a component on a board by an operation of a unit for the mounting process, an inspector configured to perform an inspection process by using an image of the board after the mounting process and output abnormality information capable of specifying a defective board having an abnormality detected in the inspection process, a camera configured to image the operation of the unit in the mounting machine during the mounting process in a video to store image data in a memory, and a data output section configured to extract image data during the mounting process of the defective board from the memory based on the abnormality information and output the image data to an outside.
    Type: Application
    Filed: June 29, 2020
    Publication date: July 6, 2023
    Applicant: FUJI CORPORATION
    Inventor: Hidetoshi KAWAI
  • Patent number: 11683922
    Abstract: A component mounting system includes multiple component mounting lines where multiple component mounters and a feeder storage are aligned along a board conveyance direction, a feeder exchange device configured to move along the board conveyance direction to exchange the feeder between the component mounter and the feeder storage of the component mounting line in charge, and a memory device. The feeder exchange device is configured to store an in-process feeder in the feeder storage of the component mounting line in charge, when it is determined, based on production information and feeder information, that there is the in-process feeder that was used in the component mounting line in charge and is scheduled to be used in another component mounting line.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: June 20, 2023
    Assignee: FUJI CORPORATION
    Inventor: Hidetoshi Kawai
  • Patent number: 11582891
    Abstract: A component mounting system that includes a component mounter in which multiple component supply units are detachably arranged in a supply area and mounts components on a board based on a job. The system performs a preparatory arrangement control for dividing the component supply units required for the job into multiple, and controlling the unit exchange device to make an arrangement of the component supply units in each group match an arrangement order in the supply area, and a supply arrangement control for controlling the unit exchange device to automatically exchange the component supply units, and to arrange the component supply units required for the job after switching in the supply area.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: February 14, 2023
    Assignee: FUJI CORPORATION
    Inventor: Hidetoshi Kawai
  • Publication number: 20220411185
    Abstract: A warehouse system includes a component container warehouse configured to store multiple component containers that accommodate multiple components, a component supply unit warehouse configured to store multiple component supply units used when supplying the components accommodated in the component container to a component mounter, a component container loader configured to load the component container into the component supply unit, and a conveyance robot configured to move between the component container warehouse, the component supply unit warehouse, and the component container loader to convey the component container and the component supply unit to the component container loader.
    Type: Application
    Filed: November 25, 2019
    Publication date: December 29, 2022
    Applicant: FUJI CORPORATION
    Inventors: Hidetoshi KAWAI, Fumitaka MAEDA
  • Patent number: 11499005
    Abstract: A curable composition containing an alkenyl phenol A, an epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: November 15, 2022
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Mayumi Kikuchi, Hidetoshi Kawai
  • Publication number: 20220325034
    Abstract: A curable composition is provided that includes an alkenyl phenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and a thermosetting resin E, in which the thermosetting resin E contains one or more selected from the group consisting of a maleimide compound, a cyanate ester compound, a phenolic compound, an alkenyl-substituted nadimide compound, and an epoxy compound.
    Type: Application
    Filed: June 21, 2022
    Publication date: October 13, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya TOMIZAWA, Mayumi KIKUCHI, Hidetoshi KAWAI
  • Patent number: 11464149
    Abstract: A component mounting includes an external monitoring camera that images an outside work area that is an area outside of the component mounting machine at which an operator performs work with respect to the component mounting machine. The outside work area of the component mounting machine includes at least an area where a feeder is set, and a monitoring target is at least a state during and after completion of setting the feeder on the component mounting machine and during and after completion of setting component supply tape on the feeder. By looking at a recorded image or a real time image displayed on a display device by using the external monitoring camera to capture an outside work area of the component mounting machine, it is possible to check the state of the monitoring target on which an operator performed work in the outside work area of the component mounter.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: October 4, 2022
    Assignee: FUJI CORPORATION
    Inventors: Hidetoshi Kawai, Fumitaka Maeda
  • Patent number: 11464151
    Abstract: An electronic component mounting machine including a board clamp device configured to clamp a circuit board conveyed by a conveyor by sandwiching side edge sections of the circuit board between a clamp member from below and a conveyor rail from above by raising the clamp member, the electronic component mounting machine being configured to mount electronic components on the circuit board clamped by the board clamp device; and a control device configured to control a clamping force that is a sandwiching force on the side edge sections of the circuit board sandwiched between the clamp member and the conveyor rail of the board clamp device. The control device is configured to acquire board information including at least a weight of the circuit board and to control the clamping force of the board clamp device based on the acquired board information.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: October 4, 2022
    Assignee: FUJI CORPORATION
    Inventors: Tomohisa Kanda, Hidetoshi Kawai
  • Publication number: 20220261981
    Abstract: A board work system includes a moving device configured to move over an XY-plane, a lighting device attached to the moving device, a monochromatic camera attached to the moving device, and an image processing device. The image processing device selects one or multiple monochromatic lights based on a target object and, when the image processing device selects one monochromatic light, the image processing device causes the lighting device and the monochromatic camera to capture a monochromatic image of the target object which is illuminated with the one monochromatic light and sets the monochromatic image of the target object as a target object inspection image. When the image processing device selects multiple monochromatic lights, the image processing device captures monochromatic images of the target object illuminated with the monochromatic lights and sets a composite image where the monochromatic images are combined as a target object inspection image.
    Type: Application
    Filed: July 26, 2019
    Publication date: August 18, 2022
    Applicant: FUJI CORPORATION
    Inventors: Mitsutaka INAGAKI, Hidetoshi KAWAI
  • Patent number: 11388849
    Abstract: A component mounting machine includes multiple component supplying devices, a head, a head moving device, and a nozzle lifting and lowering device. The component supplying device feeds out a component to a component supply position. The head includes multiple nozzles configured to suction a component. The head moving device moves the head to cause the nozzles to face the respective component supply positions with two or more thereof. The nozzle lifting and lowering device lifts and lowers the nozzle located to face the component supply positions. In positioning the nozzles to face the respective component supply positions, the head is moved so as to prioritize a positional correction of a nozzle facing a smallest sized component over positional corrections of the other nozzles, and in this state, the nozzles facing the respective component supply positions are lifted and lowered simultaneously to suction corresponding components.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: July 12, 2022
    Assignee: FUJI CORPORATION
    Inventors: Hidetoshi Kawai, Jun Iisaka, Hidetoshi Ito
  • Patent number: 11350550
    Abstract: A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to use a component mounting tool to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a remaining detecting section to detect whether the component remains at the supply position in a case in which it is detected by the holding detecting section that the component is not being held by the component mounting tool; and a dropped determining section to determine whether the component has dropped.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: May 31, 2022
    Assignee: FUJI CORPORATION
    Inventors: Rie Kito, Hidetoshi Kawai, Norio Hosoi, Mizuho Nozawa, Jun Iisaka, Hidetoshi Ito, Shingo Fujimura, Kenzo Ishikawa, Yusuke Yamakage
  • Patent number: 11324151
    Abstract: The measurement position determination device of the present disclosure is a measurement position determination device for determining a measurement position on a board, the measurement position being for measuring height of the board on which on which a component is mounted, and includes a measurement position determination section for acquiring one or more scheduled mounting positions of the component on the board at the time of measuring the board height and determining at least one of the acquired scheduled mounting positions as the measurement position of the board height.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: May 3, 2022
    Assignee: FUJI CORPORATION
    Inventors: Hiroyoshi Sugita, Jun Iisaka, Hidetoshi Kawai, Yusuke Yamakage
  • Patent number: 11317549
    Abstract: A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a retry performing section to determine whether to perform a retry operation of attempting to pick up the component again using the component mounting tool based on a detection result of the component detecting section and a detection result of the holding detecting section, and to perform the retry operation in accordance with a result of the determining of whether to perform the retry operation.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: April 26, 2022
    Assignee: FUJI CORPORATION
    Inventors: Rie Kito, Hidetoshi Kawai, Norio Hosoi, Mizuho Nozawa, Jun Iisaka, Hidetoshi Ito, Shingo Fujimura, Kenzo Ishikawa, Yusuke Yamakage
  • Patent number: 11291147
    Abstract: A component mounting system including multiple component mounting devices to collect components from feeders set at multiple feeder holding sections and mount the components on a board, the multiple feeder holding sections being provided on each of the multiple component mounting devices to removably hold the feeders; and a feeder exchanging device to move along a line along which the multiple component mounting devices are arranged and exchange feeders with respect to each of the component mounting devices. The component mounting system acquires a type and arrangement of each of the feeders set on the multiple component mounting devices, determines whether each of the feeders is set at a predetermined appropriate position, and upon determining that there is a feeder that is not set at the appropriate position, uses the feeder exchanging device to reset the feeder that is not set at the appropriate position.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: March 29, 2022
    Assignee: FUJI CORPORATION
    Inventor: Hidetoshi Kawai