Abstract: To present a scintillation crystal containing a fluorescent component with excellent luminous efficiency and short decay time while the wavelength of the emitted light being in the visible light region or very near the visible light region and a radiation detection device using the scintillation crystal having an excellent timing resolution capability. Barium chloride (BaCl2) is used as the scintillation crystal. A radiation detection device comprising a barium chloride (BaCl2) crystal as a scintillator and a photomultiplier tube to receive the light from the scintillator wherein the wavelength of the light emitted from the scintillator is between 250 nm and 350 nm and the scintillator is located in a low humidity atmosphere.

Abstract: The present invention has an object to provide a producing method and producing apparatus of multilayered printed-circuit board that has eliminated the resin flow and resolved the problems of board thickness discrepancy and misregistration. A producing method of multilayered printed-circuit board, comprising steps of stacking up a laminated sheet covered with conductive foil or conductor for outer layer, a prepreg and a laminated sheet covered with conductor for inner layer and, thereafter, setting the prepreg by pressurizing/heating, wherein, before conducting the pressurizing/heating, gas is sprayed to the surface of the laminated shoot covered with conductive foil or conductor for outer layer, a prepreg and a laminated sheet covered with conductor for inner layer to eliminate impurities from the surface.

Abstract: A gamma ray detector having a very high time resolution. By using CsBr (cesium bromide) as a scintillator crystal and a MCP built-in photoelectron multiplier tube as a photoelectron multiplier, much larger time resolution are obtained in detecting gamma rays than conventional detectors.

Abstract: A wiring board includes a predetermined wiring section disposed on an insulation board, and an electromagnetic shielding film is placed at a position close to the wiring section. A semiconductor device includes an electromagnetic shielding film disposed on a surface, on which an integrated circuit of a semiconductor chip has been formed, through an insulative film, a lead is provided on the electromagnetic shielding film through an insulative film, the lead is electrically connected to an external terminal of the semiconductor chip, and the resulting structured material is sealed with a sealing material; and a circuit board for electronic parts composed of a circuit board prepared by forming a plurality of leads on an insulating material, and a conductor disposed on the plurality of leads through an insulating material and reducing a self inductance of the plurality of leads by flowing an eddy current through the conductor.

Abstract: There are provided a wiring board, wherein a predetermined wiring section is disposed on an insulation board, and an electromagnetic shielding film is placed at a position close to the wiring section; a semiconductor device, wherein an electromagnetic shielding film is disposed on a surface, on which an integrated circuit of a semiconductor chip has been formed, through an insulative film, a lead is provided on the electromagnetic shielding film through an insulative film, the lead is electrically connected to an external terminal of the semiconductor chip, and the resulting structured material is sealed with a sealing material; and a circuit board for electronic parts composed of a circuit board prepared by forming a plurality of leads on an insulating material, and a conductor disposed on the plurality of leads through an insulating material and reducing a self inductance of the plurality of leads by flowing an eddy current through the conductor.