Patents by Inventor Hidetoshi Odaka

Hidetoshi Odaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6777485
    Abstract: The present invention provides a novel sealant and a novel curable resin composition providing for sufficiently high mechanical strength, adhesive strength, rubber elasticity and good workability and a direct glazing method utilizing the composition, which comprises (I) a reactive silicon group-containing polyether oligomer such that the reactive silicon group exists exclusively at the molecular chain terminus and the introduction rate of the reactive silicon group into the molecular chain terminus is not less than 85% as determined by 1H-NMR analysis and (II) a reinforcing filler.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: August 17, 2004
    Assignee: Kaneka Corporation
    Inventors: Hiroshi Ito, Hidetoshi Odaka, Hiroshi Iwakiri, Fumio Kawakubo, Hideharu Jyono
  • Patent number: 6541593
    Abstract: A process for producing a reactive silicon group-containing polyether oligomer, which comprises reacting (a) a polyether oligomer the backbone chain of which comprises a polyether and which contains in a side chain or at a terminus of its molecule at least one unsaturated group of the following general formula (1): H2C═C(R1)—R2—O—  (1) (wherein R1 represents a hydrocarbon group of not more than 10 carbon atoms; R2 represents a divalent organic group of 1 to 20 carbon atoms which contains in a side chain or at a terminus of its molecule at least one atomic species selected from the group consisting of hydrogen, oxygen and nitrogen as its constituent atom or atoms) or the general formula (2): HC(R1)═CH—R2—O—  (2) (wherein R1 represents a hydrocarbon group of not more than 10 carbon atoms; R2 represents a divalent organic group of 1 to 20 carbon atoms which contains at least one atomic species selected from the group consisting of hydrogen, ox
    Type: Grant
    Filed: June 14, 2000
    Date of Patent: April 1, 2003
    Assignee: Kaneka Corporation
    Inventors: Hideharu Jyono, Hidetoshi Odaka, Hiroshi Ando, Hiroshi Iwakiri, Hiroshi Ito, Fumio Kawakubo
  • Patent number: 6444775
    Abstract: The present invention has its object to provide a curable composition showing a controlled initial curing rate and, hence, offering good workability by introducing a methyl group into the neighborhood of the reactive silicon group within an oligomer to indirectly lower the reactivity of the reactive silicon group within the oligomer.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: September 3, 2002
    Assignee: Kaneka Corporation
    Inventors: Hideharu Jyono, Hidetoshi Odaka, Hiroshi Ito, Hiroshi Iwakiri
  • Patent number: 6437072
    Abstract: The present invention has its object to provide a curable composition having good storage stability even when it contains a hydrolyzable silicon compound and/or an amino group-containing alkoxysilane or amino-substituted alkoxysilane derivative compound.
    Type: Grant
    Filed: March 29, 2000
    Date of Patent: August 20, 2002
    Assignee: Kaneka Corporation
    Inventors: Hideharu Jyono, Hidetoshi Odaka, Hiroshi Ito, Hiroshi Iwakiri
  • Patent number: 6437071
    Abstract: The present invention has its object to provide a curable composition giving cured products improved in residual tack (reduced in stickiness), with the physical properties insuring those tensile characteristics and rubber elasticity required of sealing compositions for general architectural use being retained. The present invention provides a curable composition which comprises (I) 100 parts by weight of a reactive silicon group-containing polyether oligomer with the percentage of the number of reactive silicon groups to the number of molecular chain terminals as determined by 1H-NMR analysis being not less than 85% and (II) 1 to 500 parts by weight of a plasticizer.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: August 20, 2002
    Assignee: Kaneka Corporation
    Inventors: Hidetoshi Odaka, Yuka Kanamori, Hiroshi Ito, Hideharu Jyono, Hiroshi Iwakiri, Fumio Kawakubo
  • Publication number: 20020103321
    Abstract: The present invention has its object to provide a curable composition having good storage stability even when it contains a hydrolyzable silicon compound and/or an amino group-containing alkoxysilane or amino-substituted alkoxysilane derivative compound.
    Type: Application
    Filed: March 29, 2000
    Publication date: August 1, 2002
    Inventors: Hideharu Jyono, Hidetoshi Odaka, Hiroshi Ito, Hiroshi Iwakiri
  • Patent number: 6248915
    Abstract: The invention provides a method of producing a reactive silicon group-containing polyether oligomer which comprises reacting (a) a polyether oligomer having main chain of a polyether and, in each molecule, at least one unsaturated group represented by the general formula (1): H2C═C(R1)—R2—O—  (1) (in the formula, R1 is a hydrocarbon group containing not more than 10 carbon atoms and R2 is a divalent organic group containing 1 to 20 carbon atoms and one or more species selected from the group consisting of hydrogen, oxygen and nitrogen atoms as a constituent atom) or the general formula (2): HC(R1)═CH—R2—O—  (2) on a side chain or at a terminus with (b) a reactive silicon group-containing compound in the presence of (c) a group VIII transition metal catalyst to introduce the reactive silicon group into said polyether oligomer (a), wherein the reaction is carried out in the presence of (d) a sulfur compound.
    Type: Grant
    Filed: December 28, 1999
    Date of Patent: June 19, 2001
    Assignee: Kaneka Corporation
    Inventors: Hiroshi Ito, Hidetoshi Odaka, Hideharu Jyono, Hiroshi Iwakiri, Fumio Kawakubo