Abstract: An air-conditioning apparatus includes: a centrifugal air-sending device including a fan and a scroll casing having a tongue portion and a discharge portion, and a housing having a housing suction port and a discharge portion. A trailing edge of a blade located closest to a wall portion of the housing is a first trailing edge portion, and a leading edge of a blade located closest to the tongue portion is a first leading edge portion. In a first region, a boundary portion located closest to the tongue portion is located between first and second straight lines. The first straight line passes through a rotation axis of the fan and the first trailing edge portion, the second straight line is parallel to the first straight line and passes through the first leading edge portion, and the first region forms part of the housing suction port close to the tongue portion.

Abstract: A centrifugal air-sending device has blades that each have a vane length in a first region that is greater than a vane length in a second region, and are each formed such that a proportion for which a turbo vane portion accounts is higher in a radial direction than a proportion for which a sirocco vane portion accounts in the first region and the second region. The blades that are located closer to an outer circumference than is a blade inner diameter of inner circumferential ends of the blades at end portions of the blades that are close to a side plate in an axial direction are defined as a blade outer circumferential portion that is formed such that a vane thickness of each of the blades in decreased in the radial direction from an inner circumference toward the outer circumference.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: An endoscope capable of preventing the cover member from being damaged and also preventing the airtight failure from being caused is disclosed. A projection 172 can reparably join with an opening 137. It becomes possible for the cover fitting member 170 and the cover member 130 to rotate together as one body when they join with each other. When they enter in this state, the cover fitting member 170 is screw-joined with a sleeve 120, thereby fitting the cover member 130 thereto. After this, the cover member 130 is moved in the axial direction to separate the projection from the opening, thereby it becoming for the cover member 130 to turn round the axis. On one hand, the movement of the cover member 130 in the axial direction is restrained by the cover fitting member 170 and the slide restraint member 180 as well.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: An endoscopic manual control knob which has a knob body proper in the form of a synthetic resin molding. The knob body is largely composed of a ring-like top plate and a peripheral side wall portion fringed along outer periphery of the top plate. The top plate is provided with an aperture to be fitted on a rotatable shaft, and a number of lever portions projecting radially outward from the outer periphery of the top plate at angularly spaced positions. The knob body has an implant block embedded in each one of the lever portions by insert molding.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip containing (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: An endoscopic manual control knob which has a knob body proper in the form of a synthetic resin molding. The knob body is largely composed of a ring-like top plate and a peripheral side wall portion fringed along outer periphery of the top plate. The top plate is provided with an aperture to be fitted on a rotatable shaft, and a number of lever portions projecting radially outward from the outer periphery of the top plate at angularly spaced positions. The knob body has an implant block embedded in each one of the lever portions by insert molding.

Abstract: An endoscopic manual control knob which has a knob body proper in the form of a synthetic resin molding. The knob body is largely composed of a ring-like top plate and a peripheral side wall portion fringed along outer periphery of the top plate. The top plate is provided with an aperture to be fitted on a rotatable shaft, and a number of lever portions projecting radially outward from the outer periphery of the top plate at angularly spaced positions. The knob body has an implant block embedded in each one of the lever portions by insert molding.

Abstract: An endoscope capable of preventing the cover member from being damaged and also preventing the airtight failure from being caused is disclosed. A projection 172 can reparably join with an opening 137. It becomes possible for the cover fitting member 170 and the cover member 130 to rotate together as one body when they join with each other. When they enter in this state, the cover fitting member 170 is screw-joined with a sleeve 120, thereby fitting the cover member 130 thereto. After this, the cover member 130 is moved in the axial direction to separate the projection from the opening, thereby it becoming for the cover member 130 to turn round the axis. On one hand, the movement of the cover member 130 in the axial direction is restrained by the cover fitting member 170 and the slide restraint member 180 as well.

Abstract: An endoscopic manual control knob which has a knob body proper in the form of a synthetic resin molding. The knob body is largely composed of a ring-like top plate and a peripheral side wall portion fringed along outer periphery of the top plate. The top plate is provided with an aperture to be fitted on a rotatable shaft, and a number of lever portions projecting radially outward from the outer periphery of the top plate at angularly spaced positions. The knob body has an implant block embedded in each one of the lever portions by insert molding.

Abstract: A cleaned pulling room installed with a plurality of single crystal pulling apparatuses, having a plurality of operation floors and supplied with clean air as a down flow from a ceiling or an upper position neighboring the ceiling, wherein at least three operation floors are provided depending on degrees of cleanness required for operations performed on each of the floors. Thus, there is provided a pulling room that can separate dusting operations such as operations of dismantlement and cleaning of the furnace body and structural members in the furnace body and operations requiring highly clean environment such as charging of raw material into the furnace body as preparation for starting running of the pulling apparatuses, and can secure safety of the operations even when the pulling apparatuses become larger.

Abstract: A method for growing an antimony-doped silicon single crystal having an oxygen concentration of 12 ppma or more is employed wherein the pressure of an atmospheric inert gas within the furnace is set at a range between 10 and 50 millibars (1000-5000 Pa), and also the reference rate of rotation of the quartz crucible is set at 5 rpm or more while pulling an antimony-doped silicon single crystal having an antimony concentration of 6.times.10.sup.18 atom/cc or more from an antimony-doped silicon melt contained in a quartz crucible according to the Czochralski process. The reference rate of rotation can be increased in accordance with the increasing length of the pulled single crystal, and further a pulse-like change in rotation rate can be superimposed over the reference rate of rotation, so that the pulled single crystal can have a high and axially and radially uniform oxygen concentration throughout the entire length of the single crystal.

Abstract: A method for controlling a specific resistance of a single crystal in a Czochralski-method type single crystal pulling apparatus having a hermetical chamber in which the single crystal is pulled up from a polycrystal melt and an inert gas supply and exhaust system by means of which an inert gas is supplied to the hermetical chamber and exhausted therefrom; the method being characterized in that the pneumatic pressure in the hermetical chamber and the supply rate of the inert gas are controlled in accordance with a prepared control pattern with respect to the passage of pulling time.