Patents by Inventor Hidetoshi Shimoda

Hidetoshi Shimoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for producing a printed wiring board
    Patent number: 5252195
    Abstract: A process for the production of a printed wiring board, which comprises preparing a copper-clad laminate having a through-hole formed by drilling; providing a first resist pattern on the surface of the copper-clad laminate so as to cover a portion to be formed as a conductor pattern; etching the copper-clad laminate; removing the first resist pattern; subjecting the whole laminate to an electroless copper plating; laminating a dry film resist on the copper-clad laminate; exposing and developing the dry film resist to form a second resist pattern in such a manner that the through-hole and a portion to be plated are exposed; subjecting the exposed portions to an electrolytic copper plating; removing the second resist pattern; and removing the exposed electroless copper plating through etching.
    Type: Grant
    Filed: October 28, 1992
    Date of Patent: October 12, 1993
    Assignee: Mitsubishi Rayon Company Ltd.
    Inventors: Tadashi Kobayashi, Hiroyuki Uchida, Hidetoshi Shimoda, Toshio Takahashi