Patents by Inventor Hidetoshi Takeyama

Hidetoshi Takeyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10124992
    Abstract: An endless handrail manufacturing method includes: a first step of cutting the dorsal part on one end side and the dorsal part on the other end side of a belt-like molded product to expose a tension member from the end portions; a second step of heating the product on the one end side, then removing the softened resin member, and then exposing a canvas from the end portion; a third step of heating the product with a heating jig to dent the abdominal part; a fourth step of applying an adhesive to the terminal on the one end side or the terminal on the other end side of the product, then fitting the former terminal to the latter terminal of the product; and a fifth step of supplementing a resin to the fitting portion, then hot pressing the fitting portion to fusion-bond the terminals.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: November 13, 2018
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hidetoshi Takeyama, Atsuhiko Yoshida, Fumiya Murata
  • Publication number: 20170166420
    Abstract: An endless handrail manufacturing method includes: a first step of cutting the dorsal part on one end side and the dorsal part on the other end side of a belt-like molded product to expose a tension member from the end portions; a second step of heating the product on the one end side, then removing the softened resin member, and then exposing a canvas from the end portion; a third step of heating the product with a heating jig to dent the abdominal part; a fourth step of applying an adhesive to the terminal on the one end side or the terminal on the other end side of the product, then fitting the former terminal to the latter terminal of the product; and a fifth step of supplementing a resin to the fitting portion, then hot pressing the fitting portion to fusion-bond the terminals.
    Type: Application
    Filed: May 29, 2015
    Publication date: June 15, 2017
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hidetoshi TAKEYAMA, Atsuhiko YOSHIDA, Fumiya MURATA
  • Patent number: 9478879
    Abstract: A socket (female connector) used for a connector assembly includes a film substrate constituted by a flexible thin board made of insulation material. The film substrate is provided with connection through holes adapted to be inserted therein connection posts of a header (male connector). Connection pads are formed on a first surface of the film substrate around respective connection through holes. The connection pads include a first pad and a second pad. The film substrate is provided on the first surface with a first patterned conductor connected to the first pad and a third patterned conductor connected to the second pad. The third patterned conductor is connected to a second patterned conductor formed on a second surface of the film substrate by means of a blind via that is formed by boring the film substrate from the second surface so as to reach the third patterned conductor.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: October 25, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroshi Iwano, Mitsuru Iida, Daisuke Sato, Hidetoshi Takeyama
  • Publication number: 20160200023
    Abstract: A method of manufacturing an escalator handrail of the invention is characterized by including: a metallic steel-wire producing step of placing a center elemental wire and a plurality of strands so that the plurality of strands surrounds the center elemental wire, and applying tension to them so that each distance between the center elemental wire and each of the strands becomes the same, to thereby produce the metallic steel wire; a preheating step of heating the metallic steel wire to a temperature equal to or more than that of a thermoplastic resin in a molten state; a composite-material forming step of integrating the metallic steel wire heated with the thermoplastic resin in a molten state, and extruding them through a die finished into a cross-section shape of the escalator handrail to thereby form the composite material; and a cooling step of forcibly cooling the composite material.
    Type: Application
    Filed: September 19, 2014
    Publication date: July 14, 2016
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yoshitomo NISHIMURA, Tomoko HADA, Hidetoshi TAKEYAMA
  • Patent number: 9290360
    Abstract: The endless escalator handrail is made up of a thermoplastic resin member having a first and a second curved portions and a joint section; a flat woven fabric bonded to an inner surface of the thermoplastic resin member; a first patch cloth having a base portion and a divergent portion, for being placed on the first curved portion side in the joint section; and a second patch cloth having a base portion and a divergent portion, for being placed on the second curved portion side in the joint section. The divergent potion of the first patch cloth is bonded onto the flat woven fabric at an inward side of the first curved portion, and the divergent potion of the second patch cloth is bonded onto the flat woven fabric at an inward side of the second curved portion.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: March 22, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hidetoshi Takeyama, Tomoko Hada, Atsushi Kawasaki, Yoshitomo Nishimura
  • Publication number: 20150336774
    Abstract: The endless escalator handrail is made up of a thermoplastic resin member having a first and a second curved portions and a joint section; a flat woven fabric bonded to an inner surface of the thermoplastic resin member; a first patch cloth having a base portion and a divergent portion, for being placed on the first curved portion side in the joint section; and a second patch cloth having a base portion and a divergent portion, for being placed on the second curved portion side in the joint section. The divergent potion of the first patch cloth is bonded onto the flat woven fabric at an inward side of the first curved portion, and the divergent potion of the second patch cloth is bonded onto the flat woven fabric at an inward side of the second curved portion.
    Type: Application
    Filed: April 7, 2014
    Publication date: November 26, 2015
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hidetoshi TAKEYAMA, Tomoko HADA, Atsushi KAWASAKI, Yoshitomo NISHIMURA
  • Patent number: 9077127
    Abstract: A film substrate with flexibility includes connection through holes and combining through holes into which connection posts and combining posts of the header are inserted, respectively. Each connection pad is formed around a corresponding connection through hole and adapted to be electrically connected to a corresponding connection post. Each combining pad is formed around a corresponding combining through hole and adapted to be electrically connected to a corresponding combining post. The film substrate includes slots each of which is formed to extend along a plane of the film substrate with a first end side thereof connected to a corresponding through hole. The film substrate includes pad-free parts with neither connection pad nor combining pad each of which is present at a second end side of a corresponding slot on the surface of the film substrate.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: July 7, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroshi Iwano, Mitsuru Iida, Daisuke Sato, Hidetoshi Takeyama
  • Publication number: 20140017938
    Abstract: A socket (female connector) used for a connector assembly includes a film substrate constituted by a flexible thin board made of insulation material. The film substrate is provided with connection through holes adapted to be inserted therein connection posts of a header (male connector). Connection pads are formed on a first surface of the film substrate around respective connection through holes. The connection pads include a first pad and a second pad. The film substrate is provided on the first surface with a first patterned conductor connected to the first pad and a third patterned conductor connected to the second pad. The third patterned conductor is connected to a second patterned conductor formed on a second surface of the film substrate by means of a blind via that is formed by boring the film substrate from the second surface so as to reach the third patterned conductor.
    Type: Application
    Filed: July 3, 2013
    Publication date: January 16, 2014
    Inventors: Hiroshi IWANO, Mitsuru IIDA, Daisuke SATO, Hidetoshi TAKEYAMA
  • Publication number: 20140017953
    Abstract: A film substrate with flexibility includes connection through holes and combining through holes into which connection posts and combining posts of the header are inserted, respectively. Each connection pad is formed around a corresponding connection through hole and adapted to be electrically connected to a corresponding connection post. Each combining pad is formed around a corresponding combining through hole and adapted to be electrically connected to a corresponding combining post. The film substrate includes slots each of which is formed to extend along a plane of the film substrate with a first end side thereof connected to a corresponding through hole. The film substrate includes pad-free parts with neither connection pad nor combining pad each of which is present at a second end side of a corresponding slot on the surface of the film substrate.
    Type: Application
    Filed: July 3, 2013
    Publication date: January 16, 2014
    Inventors: Hiroshi IWANO, Mitsuru IIDA, Daisuke SATO, Hidetoshi TAKEYAMA
  • Patent number: 7357661
    Abstract: Provided is a pressure coupling connector which can decrease the number of components for coping with various electric wire diameters, prevent problems due to difference in product kind, and reduce the stock. The pressure coupling connector includes a wire holding block for holding electric wires and a contact block for holding a connection terminal to which the electric wire is coupled with pressure by inserting the wire holding block into the contact block. The connection terminal of the contact block includes a U-shaped blade rising toward an opening surface into which the wire holding block is inserted. The wire holding block includes a wire holding portion in which a holding hole for transmitting the electric wire from the rear side thereof and holding the electric wire is formed and a reception groove for receiving the U-shaped blade of the connection terminal.
    Type: Grant
    Filed: January 26, 2006
    Date of Patent: April 15, 2008
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Toshihiro Yamamoto, Norimasa Kaji, Hirohisa Tanaka, Hidetoshi Takeyama, Shuji Katou, Mitsuhiro Kadowaki
  • Publication number: 20070232124
    Abstract: Provided is a pressure coupling connector which can decrease the number of components for coping with various electric wire diameters, prevent problems due to difference in product kind, and reduce the stock. The pressure coupling connector includes a wire holding block for holding electric wires and a contact block for holding a connection terminal to which the electric wire is coupled with pressure by inserting the wire holding block into the contact block. The connection terminal of the contact block includes a U-shaped blade rising toward an opening surface into which the wire holding block is inserted. The wire holding block includes a wire holding portion in which a holding hole for transmitting the electric wire from the rear side thereof and holding the electric wire is formed and a reception groove for receiving the U-shaped blade of the connection terminal.
    Type: Application
    Filed: January 26, 2006
    Publication date: October 4, 2007
    Inventors: Toshihiro Yamamoto, Norimasa Kaji, Hirohisa Tanaka, Hidetoshi Takeyama, Shuji Katou, Mitsuhiro Kadowaki
  • Patent number: 7112091
    Abstract: A low-profile connector for connecting two circuit boards of a-mobile equipment is constituted by a header and a socket. The header comprises a resin molded header body and a plurality of pairs of posts (conductive terminals) provided on the header body. The socket comprises a resin molded socket body and a plurality of sets of contacts provided on the socket body corresponding to the posts of the header. The header body and the socket body respectively have reinforcing member made of metal thin plate for reinforcing the header and the socket with respect to contortion or crack. Top end of the post is rolled to be reverse U-shape for contacting with the contact at two portions, in which a first contact portion is formed a part of a fitting portion of the contact at which the contact is held on the socket body and a second contact portion is a top end of a plate spring portion of the contact incurved for facing the first contact portion.
    Type: Grant
    Filed: October 28, 2005
    Date of Patent: September 26, 2006
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Kenji Okura, Hirohisa Tanaka, Hidetoshi Takeyama, Hisanobu Tanaka, Masato Shinotani
  • Publication number: 20060051988
    Abstract: A low-profile connector for connecting two circuit boards of a-mobile equipment is constituted by a header and a socket. The header comprises a resin molded header body and a plurality of pairs of posts (conductive terminals) provided on the header body. The socket comprises a resin molded socket body and a plurality of sets of contacts provided on the socket body corresponding to the posts of the header. The header body and the socket body respectively have reinforcing member made of metal thin plate for reinforcing the header and the socket with respect to contortion or crack. Top end of the post is rolled to be reverse U-shape for contacting with the contact at two portions, in which a first contact portion is formed a part of a fitting portion of the contact at which the contact is held on the socket body and a second contact portion is a top end of a plate spring portion of the contact incurved for facing the first contact portion.
    Type: Application
    Filed: October 28, 2005
    Publication date: March 9, 2006
    Applicant: Matsushita Electric Works, Ltd.
    Inventors: Kenji Okura, Hirohisa Tanaka, Hidetoshi Takeyama, Hisanobu Tanaka, Masato Shinotani
  • Patent number: 6994573
    Abstract: In a connector used for connecting a memory card to an apparatus which processes the data stored in the memory card, a cover shell and a base shell which configure a box-shaped housing are respectively formed by a metal thin plate for increasing the mechanical strength of the housing and for grounding the housing with ease so that the connector can be tough with respect to static electricity and external noise. Contacts, which are to be contacted with I/O contacts of a memory card, are integrally held on a contact base by insert molding so that contacting portions and soldering terminals of the contacts can be aligned parallel to and on the same level. A slider is configured to move forward and backward in the housing to correspond to the insertion and withdrawal of the memory card. The slider is pressed by pressing forces of a pair of coil springs so that the movement of the slider is smooth.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: February 7, 2006
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Hirohisa Tanaka, Hidetoshi Takeyama
  • Patent number: 6986670
    Abstract: A low-profile connector for connecting two circuit boards of mobile equipment is constituted by a header and a socket. The header comprises a resin molded header body and a plurality of pairs of posts (conductive terminals) provided on the header body. The socket comprises a resin molded socket body and a plurality of sets of contacts provided on the socket body corresponding to the posts of the header. The header body and the socket body respectively have reinforcing member made of metal thin plate for reinforcing the header and the socket with respect to contortion or crack. Top end of the post is rolled to be reverse U-shape for contacting with the contact at two portions, in which a first contact portion is formed a part of a fitting portion of the contact at which the contact is held on the socket body and a second contact portion is a top end of a plate spring portion of the contact incurved for facing the first contact portion.
    Type: Grant
    Filed: July 11, 2003
    Date of Patent: January 17, 2006
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Kenji Okura, Hirohisa Tanaka, Hidetoshi Takeyama, Hisanobu Tanaka, Masato Shinotani
  • Publication number: 20050101170
    Abstract: In a connector used for connecting a memory card to an apparatus which processes the data memorized in the memory card, a cover shell and a base shell which configure a box-shaped housing are respectively formed by a metal thin plate for increasing the mechanical strength of the hosing and easily for grounding the housing so that the connector can be tough with respect to the static electricity and the external noise. Contacts which are to be contacted with contacts of a memory card are integrally held on a contact base formed by insert molding so that contacting portions of and soldering terminals of the contacts can be aligned parallel to and on the same level as each other. A slider moving forward and backward in the housing corresponding to the insertion and drawing of the memory card are pressed by pressing forces of a pair of coil springs so that the movement of the slider can be made smooth.
    Type: Application
    Filed: November 15, 2002
    Publication date: May 12, 2005
    Inventors: Hirohisa Tanaka, Hidetoshi Takeyama
  • Publication number: 20050009383
    Abstract: A low-profile connector for connecting two circuit boards of a emobile equipment is constituted by a header and a socket. The header comprises a resin molded header body and a plurality of pairs of posts provided on the header body. The socket comprises a resin molded socket body and a plurality of sets of contacts provided on the socket body corresponding to the posts of the header. The header body and the socket body respectively have reinforcing member made of metal thin plate for reinforcing the header and the socket with respect to contortion or crack. Top end of the post is rolled to be reverse U-shape for contacting with the contact at two portions, in which a first contact portion is formed a part of a fitting portion of the contact at which the contact is held on the socket body and a second contact portion is a top end of a plate spring portion of the contact incurved for facing the first contact portion.
    Type: Application
    Filed: July 11, 2003
    Publication date: January 13, 2005
    Inventors: Kenji Okura, Hirohisa Tanaka, Hidetoshi Takeyama, Hisanobu Tanaka, Masato Shinotani
  • Patent number: 6821158
    Abstract: A connector has a connector plug and a connector receptacle for connecting a cable and a substrate. The connector plug has a shell made of a conductive material with both sides open, and an insulator made of a resin molding. The insulator has a first fitting part on a first side for mating with the connector receptacle, a second fitting part on the other side for mating with the cable, and a plurality of contacts disposed on the second fitting part side. The shell has flexible parts for flexibly contacting a connector receptacle shell mated with the first fitting part. The insulator is fit into the shell from an opening on one side of the shell.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: November 23, 2004
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Mitsuru Iida, Narutoshi Hoshino, Hirohisa Tanaka, Hidetoshi Takeyama
  • Publication number: 20030176111
    Abstract: A connector has a connector plug and a connector receptacle for connecting a cable and a substrate. The connector plug has a shell made of a conductive material with both sides open, and an insulator made of a resin molding. The insulator has a first fitting part on a first side for mating with the connector receptacle, a second fitting part on the other side for mating with the cable, and a plurality of contacts disposed on the second fitting part side. The shell has flexible parts for flexibly contacting a connector receptacle shell mated with the first fitting part. The insulator is fit into the shell from an opening on one side of the shell.
    Type: Application
    Filed: February 25, 2003
    Publication date: September 18, 2003
    Inventors: Mitsuru Iida, Narutoshi Hoshino, Hirohisa Tanaka, Hidetoshi Takeyama
  • Patent number: 6329891
    Abstract: A high frequency relay capable of effectively shielding a signal path, yet reducing a number of the parts forming the shield and the associated structure. The relay has a dielectric base mounting three fixed contacts arranged in a line and defined at upper ends of three contact terminals extending through the base. Two movable contact springs are utilized, each bridging the two adjacent fixed contacts for closing and opening a high frequency signal path between the two adjacent fixed contacts. Upstanding from the base is a pair of electromagnetic shield plates which define a shielded space therebetween for accommodating the three fixed contacts and the two movable contact springs. Each of the shield plates is configured to come into electrical contact with corresponding one of the movable contact springs moved in the contact opening position.
    Type: Grant
    Filed: November 22, 2000
    Date of Patent: December 11, 2001
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Tokatoshi Hayashi, Atsushi Nakahata, Takuji Yamashita, Hidetoshi Takeyama, Koji Sagawa, Tetsuya Yamada, Tomohiro Taguchi, Hisao Yabu