Patents by Inventor Hidetoshi Yamamoto

Hidetoshi Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6297942
    Abstract: A metal terminal includes a central portion having a cross section with a relatively large internal diameter and an approximately circular shape and cylindrical portions having a relatively a smaller diameter are extended from both sides of the central portion. The approximately circular shape portion is inserted into a through hole of a through hole type capacitor and disposed in contact with and elastically pressing against the inner wall of the through hole.
    Type: Grant
    Filed: August 31, 1998
    Date of Patent: October 2, 2001
    Assignee: Morata Manufacturing Co., LTD
    Inventors: Takahiro Azuma, Hidetoshi Yamamoto, Kunio Okumura, Tadahiro Nakagawa
  • Patent number: 6133809
    Abstract: An LC filter is disclosed which exhibits excellent attenuation characteristics in a high-frequency range and substantially preserves its self-inductance and Q-factor. The LC filter is constructed of a laminated block formed by laminating insulating sheets each provided with a coil conductor. The coil conductors are connected in series to each other through via-holes to form a coil. Input/output external electrodes and ground external electrodes are disposed on the surfaces of the laminated block. The insulating sheets are laminated in a direction perpendicular to the input/output external electrodes and parallel to the mounting surface. The coil is axially placed perpendicular to the input/output external electrodes and parallel to the ground external electrodes and the mounting surface. A distributed capacitance is generated between the coil and each of the ground external electrodes to form a capacitor.
    Type: Grant
    Filed: April 21, 1997
    Date of Patent: October 17, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takashi Tomohiro, Takahiro Azuma, Hidetoshi Yamamoto, Toshimi Kaneko, Yasuhiro Nakata
  • Patent number: 5878132
    Abstract: A noise elimination scheme is disclosed which enables the prior established telephones or telephone exchange modules linked thereto to eliminate high-frequency noises as applied from outside portable radiotelephone transceiver units. A choke coil (15) is arranged on a circuit board (2) of a telephone main body (1) at a respective one of several nodes for connection with external communication lines (5). Another choke coil (15) is provided at each interconnection node between the circuit board (2) and signal transmission lines (6) of a telephone handset (10). Respective choke coils (15) have a specific stray capacitance of 0.3 pF or below to insure successful elimination of high frequency noises of at or above 800 MHz.
    Type: Grant
    Filed: June 14, 1996
    Date of Patent: March 2, 1999
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yukio Sakamoto, Yoshihiro Kurokawa, Hidetoshi Yamamoto
  • Patent number: 5484174
    Abstract: Pipe fittings for joining piping materials have a main body with a substantially equal diameter to that of the piping materials to be joined, an annular expanded portion formed at least at one end portion thereof and enlarged diameter portions on each side of the annular expanded portion. The piping materials are joined by inserting them into the pipe fittings and by pressing the outer enlarged diameter portion along the circumference at an end portion thereof to subject the enlarged diameter portion and the piping materials to plastic deformation. By virtue of recesses formed at the pressed portions, the pipe fittings and the piping materials are firmly fixed together. A tapered portion provided at the end of the pipe fittings effectively increases the slip-off checking force, and also the Joint can be perfectly sealed by the sealing material received in the internal space of the annular expanded portion, having been deformed by the application of pressing.
    Type: Grant
    Filed: June 3, 1994
    Date of Patent: January 16, 1996
    Assignee: Mie Horo Co., Ltd.
    Inventors: Taiji Gotoh, Hidetoshi Yamamoto, Kiyokazu Iwama, Kiyoshi Yamada
  • Patent number: 5159300
    Abstract: A noise filter of a monolithic type in which a common electrode is formed in a sintered body having varistor characteristics so as to extend from a first portion to a second portion of side surfaces of the sintered body, and at least one through electrode is formed in a position at a height spaced apart from the common electrode through a sintered body layer in the direction of thickness so as to extend from a third portion to a fourth portion of the side surfaces of the sintered body and to intersect the common electrode.
    Type: Grant
    Filed: July 6, 1990
    Date of Patent: October 27, 1992
    Assignee: Murata Manufacturing Co. Ltd.
    Inventors: Kazutaka Nakamura, Yasunobu Yoneda, Yukio Sakabe, Yukio Sakamoto, Hidetoshi Yamamoto, Seiji Sakai
  • Patent number: 5025546
    Abstract: Disclosed is a method of joining piping materials which comprises, forming at an end portion of one piping material to be joined a socket composed of a tapered portion which is diametrally enlarged gradually toward the pipe end and a maximum diameter portion extending from the tapered portion with the maximum diameter thereof, then fitting an intermediary inserting member along the internal peripheral surface of the tapered portion in the socket to be in intimate contact therewith and thereafter inserting an end portion of the other piping material thereto, further pressurizing the external peripheral of the socket with two clamping members having a lateral cross-sectional shape with the center position as the deepest portion and tapered planes of clamping action on both sides thereof in the radial direction, thereby effecting plastic deformation of the maximum diameter portion in the diameter shrinking direction.
    Type: Grant
    Filed: January 8, 1990
    Date of Patent: June 25, 1991
    Assignee: Mie Hooro Co., Ltd.
    Inventors: Taiji Gotoh, Hidetoshi Yamamoto, Kiyoshi Yamada
  • Patent number: 5023578
    Abstract: A filter array includes a dielectric unit with a plurality of individual electrodes formed on one main surface and a common electrode on the other main surface. The individual electrodes are formed at predetermined intervals so as to extend across the dielectric unit in a direction of a width of the dielectric unit. Since each of the individual electrodes and the common electrode face each other, they form with the dielectric unit, a plurality of capacitance elements. To both ends of each of the individual electrodes, input and output terminals are respectively connected. The input and output terminals project outward from the dielectric unit. A conductive plate is joined to the common electrode, and common terminals are integrally formed on the conductive plate so as to extend outward in a direction of the width of the dielectric unit. Each of the pairs of input and output terminals are inserted and connected to respective signal lines and the common terminals are connected to ground.
    Type: Grant
    Filed: February 14, 1990
    Date of Patent: June 11, 1991
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Toshimi Kaneko, Hidetoshi Yamamoto, Takayuki Hirotsuji
  • Patent number: 4956904
    Abstract: This invention relates to a device for joining piping materials such as a piping material and a pipe coupling.The piping materials are joined together by inserting one end of a piping material into a pipe coupling having a tapered and expanded diameter portion, and by causing the joint of these piping materials where they are overlapped with each other to be plastically deformed with a pair of processing dies which are movable in a direction parallel to the axis of the piping materials.The half-die members can be kept in parallel to each other when they are moved closer to each other, thereby to provide uniform and rigid junction therebetween.
    Type: Grant
    Filed: August 15, 1989
    Date of Patent: September 18, 1990
    Assignee: Mie Horo Co., Ltd.
    Inventors: Hidetoshi Yamamoto, Taiji Gotoh, Yoshinori Katoh
  • Patent number: 4947286
    Abstract: Disclosed is a multilayer capacitor using a sintered body obtained by alternately laminating a plurality of ceramic green sheets each having first inner electrodes formed on its one major surface and a plurality of ceramic green sheets each having second inner electrodes extending in such a direction as to intersect the first inner electrodes formed on its one major surface and cofiring the same. The first inner electrodes are spaced apart from each other through a space region having a predetermined width in the same plane, and led out to first and second side surfaces of the sintered body. In addition, each of the second inner electrodes is let out to third and fourth side surfaces of the sintered body, and has a plurality of electrode portions for taking up capacitance overlapped with the first inner electrodes through a ceramic layer.
    Type: Grant
    Filed: August 3, 1989
    Date of Patent: August 7, 1990
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Toshimi Kaneko, Hidetoshi Yamamoto, Hiromichi Sakai
  • Patent number: 4880260
    Abstract: A method of joining a pair of pipes is disclosed. The method includes forming one of the pipes with an enlarged diameter near one end thereof. A radially-outwardly flared section widens from the enlarged diameter toward the end of the pipe. An elastic gasket and a C-shaped rigid ring are placed in the flared section. A second pipe is then inserted inside the enlarged section of the first pipe. The outer pipe is then inwardly deformed by the action of a pressure member, such as the die, applied to the exterior of the outer pipe in the region of the pipe overlap. The free end of the outer pipe deforms plastically inwardly toward the inserted pipe thereby compressing the gasket into sealing engagement between the two pipes and compressing the C-shaped ring. As the C-shaped ring is compressed, the outer pipe is deformed into the inserted pipe so that the ring is engaged by the inner wall of the outer pipe and is wedged into the outer wall of the inserted pipe.
    Type: Grant
    Filed: December 31, 1987
    Date of Patent: November 14, 1989
    Assignee: Mie Hooro Co., Ltd.
    Inventors: Taiji Gotoh, Hidetoshi Yamamoto, Kiyoshi Yamada
  • Patent number: 4850096
    Abstract: A method of joining first and second piping materials with a C ring. The C ring has a sharp annular rim along the internal peripheral surface thereof on the pipe end side, and the C ring also has a cross-section such that a first cornered edge formed along the internal peripheral surface of the C ring on the annular gasket side and a second cornered edge formed along the external peripheral surface of the C ring on the pipe end side each define an acute angle. An end portion of the second piping material is inserted into the socket and into the C ring. The piping material are held by means of a pair of clamping jaws each having a tapered plane of clamping action opposing each other, and the jaws are then moved closer to each other along the axis of the pipes, respectively, for pressurizing the piping materials to effect plastic deformation of at least the maximum diameter portion at the end of the first piping material to deform the gasket and clamp the piping materials together.
    Type: Grant
    Filed: March 9, 1988
    Date of Patent: July 25, 1989
    Assignee: Mie Hooro Co., Ltd.
    Inventors: Taiji Gotoh, Hidetoshi Yamamoto, Kiyoshi Yamada
  • Patent number: 4492787
    Abstract: The present invention relates to a process for producing a polypropylene-ethylene block copolymer by a continuous multi-stage polymerization comprising a first stage in which polypropylene is polymerized in a first polymerization vessel in the presence of a propylene polymerization catalyst, and a second stage in which propylene and ethylene are copolymerized in a second polymerization vessel, wherein the polypropylene slurry discharged from the first polymerization vessel is supplied to a concentrator to separate said slurry into a concentrated polypropylene slurry and a supernatant liquid, the concentrated polypropylene slurry is then introduced through an upper part of a hydraulic sedimentation classifier to be contacted with a countercurrent of the upward flowing of the supernatant fluid introduced through a lower part of said classifier to obtain hydraulically sedimented polypropylene, and non-hydraulically sedimented polypropylene; the thus obtained hydraulically-sedimented polypropylene is then supplie
    Type: Grant
    Filed: August 30, 1982
    Date of Patent: January 8, 1985
    Assignee: Mitsubishi Chemical Industries Limited
    Inventors: Ryokichi Takashima, Nobuaki Goko, Yumito Uehara, Yasuhiro Nishihara, Hidetoshi Yamamoto