Patents by Inventor Hidetoshi Yasutake
Hidetoshi Yasutake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20130283611Abstract: A thermoelectric module may include a first substrate having a mounting portion and an extension portion and a second substrate facing to the mounting portion. First electrodes are disposed on the mounting portion and have a first surface layer of gold. Second electrodes are disposed on the second substrate and have a second surface layer of gold. Thermoelectric elements are electrically bonded between the first and second arrays of electrodes by solder. A bonding layer is disposed on the extension portion and has a third surface layer of gold. The first surface layer of gold is distanced by a gap from the first surface layer of gold. A metal layer underlies the gap. The metal layer has a solder-wettability that is lower than that of the first and third surface layers of gold.Type: ApplicationFiled: May 16, 2013Publication date: October 31, 2013Applicant: Yamaha CorporationInventor: Hidetoshi Yasutake
-
Patent number: 8084191Abstract: A thermoelectric module and method of manufacture thereof, capable of preventing short-circuits between electrodes due to solder without causing increases in size or cost. A thermoelectric module is configured with lower electrodes formed on the inside surface of a lower substrate, placed in opposition to an upper substrate, on the inside surface of which are formed upper electrodes; the end faces of thermoelectric elements are soldered to the lower electrodes and upper electrodes. Each of the electrodes is configured from three layers, which are a copper layer, a nickel layer formed on one face of the copper layer, and a gold layer formed on one face of the nickel layer; a visor portion, protruding outward, is formed in the nickel layer, so that when positioning the thermoelectric elements above the electrodes and soldering the electrodes to the thermoelectric elements, the flowing of solder 18a from the side portions of electrodes to the insulating substrate is prevented.Type: GrantFiled: October 15, 2009Date of Patent: December 27, 2011Assignee: Japan CorporationInventor: Hidetoshi Yasutake
-
Patent number: 7943844Abstract: A thermoelectric module and method of manufacture thereof, capable of preventing short-circuits between electrodes due to solder without causing increases in size or cost. A thermoelectric module is configured with lower electrodes formed on the inside surface of a lower substrate, placed in opposition to an upper substrate, on the inside surface of which are formed upper electrodes; the end faces of thermoelectric elements are soldered to the lower electrodes and upper electrodes. Each of the electrodes is configured from three layers, which are a copper layer, a nickel layer formed on one face of the copper layer, and a gold layer formed on one face of the nickel layer; a visor portion, protruding outward, is formed in the nickel layer, so that when positioning the thermoelectric elements above the electrodes and soldering the electrodes to the thermoelectric elements, the flowing of solder 18a from the side portions of electrodes to the insulating substrate is prevented.Type: GrantFiled: February 10, 2006Date of Patent: May 17, 2011Assignee: Yamaha CorporationInventor: Hidetoshi Yasutake
-
Publication number: 20100096357Abstract: A thermoelectric module and method of manufacture thereof, capable of preventing short-circuits between electrodes due to solder without causing increases in size or cost. A thermoelectric module is configured with lower electrodes formed on the inside surface of a lower substrate, placed in opposition to an upper substrate, on the inside surface of which are formed upper electrodes; the end faces of thermoelectric elements are soldered to the lower electrodes and upper electrodes. Each of the electrodes is configured from three layers, which are a copper layer, a nickel layer formed on one face of the copper layer, and a gold layer formed on one face of the nickel layer; a visor portion, protruding outward, is formed in the nickel layer, so that when positioning the thermoelectric elements above the electrodes and soldering the electrodes to the thermoelectric elements, the flowing of solder 18a from the side portions of electrodes to the insulating substrate is prevented.Type: ApplicationFiled: October 15, 2009Publication date: April 22, 2010Applicant: YAMAHA CORPORATIONInventor: HIDETOSHI YASUTAKE
-
Publication number: 20070175506Abstract: A method of forming thermoelectric elements includes introducing a molten thermoelectric-material in a plurality of holes of a mold, and solidifying the molten thermoelectric-material in the plurality of holes, thereby forming a plurality of thermoelectric elements in the plurality of holes without wafer-slicing process or chip-dicing process.Type: ApplicationFiled: January 17, 2007Publication date: August 2, 2007Applicant: YAMAHA CORPORATIONInventors: Yuma Horio, Hidetoshi Yasutake
-
Publication number: 20070125411Abstract: A thermoelectric module may include a first substrate having a mounting portion and an extension portion and a second substrate facing to the mounting portion. First electrodes are disposed on the mounting portion and have a first surface layer of gold. Second electrodes are disposed on the second substrate and have a second surface layer of gold. Thermoelectric elements are electrically bonded between the first and second arrays of electrodes by solder. A bonding layer is disposed on the extension portion and has a third surface layer of gold. The first surface layer of gold is distanced by a gap from the first surface layer of gold. A metal layer underlies the gap. The metal layer has a solder-wettability that is lower than that of the first and third surface layers of gold.Type: ApplicationFiled: December 5, 2006Publication date: June 7, 2007Inventor: HIDETOSHI YASUTAKE
-
Publication number: 20060180191Abstract: A thermoelectric module and method of manufacture thereof, capable of preventing short-circuits between electrodes due to solder without causing increases in size or cost. A thermoelectric module is configured with lower electrodes formed on the inside surface of a lower substrate, placed in opposition to an upper substrate, on the inside surface of which are formed upper electrodes; the end faces of thermoelectric elements are soldered to the lower electrodes and upper electrodes. Each of the electrodes is configured from three layers, which are a copper layer, a nickel layer formed on one face of the copper layer, and a gold layer formed on one face of the nickel layer; a visor portion, protruding outward, is formed in the nickel layer, so that when positioning the thermoelectric elements above the electrodes and soldering the electrodes to the thermoelectric elements, the flowing of solder 18a from the side portions of electrodes to the insulating substrate is prevented.Type: ApplicationFiled: February 10, 2006Publication date: August 17, 2006Inventor: Hidetoshi Yasutake
-
Patent number: 6942399Abstract: An optical fiber coupler reinforcing member comprises an approximately rectangular member formed by a hard material, and has a flat surface along the longitudinal direction thereof. In addition, the shape thereof in cross-section is a hexagonal shape which inscribes a cylindrical member. Furthermore, a recess having a U-shaped cross-section is formed in the longitudinal direction of the above-mentioned approximately rectangular member and houses coupling section. The coupling section housed within the recess is fixed at both ends of the recess by an adhesive or the like. In addition, both ends of the inner wall surface of the recess have been given bevel sections. As a result, the optical fiber coupler reinforcing member having high reliability at low cost, with which the strength with respect to external force is improved and with which processability and the assembly operations of the optical fiber coupler are easy, are provided.Type: GrantFiled: June 26, 2003Date of Patent: September 13, 2005Assignees: Yamaha Corporation, Richstone LimitedInventors: Nanayuki Takeuchi, Toshiharu Hoshi, Kenzaburou Iijima, Hidetoshi Yasutake, Yoshikazu Ishii, Satoru Tomaru, BooSeok Hwang
-
Publication number: 20040071415Abstract: An optical fiber coupler reinforcing member comprises an approximately rectangular member formed by a hard material, and has a flat surface along the longitudinal direction thereof. In addition, the shape thereof in cross-section is a hexagonal shape which inscribes a cylindrical member. Furthermore, a recess having a U-shaped cross-section is formed in the longitudinal direction of the above-mentioned approximately rectangular member and houses coupling section. The coupling section housed within the recess is fixed at both ends of the recess by an adhesive or the like. In addition, both ends of the inner wall surface of the recess have been given bevel sections. As a result, the optical fiber coupler reinforcing member having high reliability at low cost, with which the strength with respect to external force is improved and with which processability and the assembly operations of the optical fiber coupler are easy, are provided.Type: ApplicationFiled: June 26, 2003Publication date: April 15, 2004Inventors: Nanayuki Takeuchi, Toshiharu Hoshi, Kenzaburou Iijima, Hidetoshi Yasutake, Yoshikazu Ishii, Satoru Tomaru, BooSeok Hwang