Patents by Inventor Hidetoshi Yoshitake
Hidetoshi Yoshitake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8531406Abstract: A transparent conductive film comprising a transparent film base material, a resin layer having a fine uneven geometrical structure, and a transparent conductive thin film laminated on the film base material through the resin layer, wherein the surface of the transparent conductive thin film has an average centerline roughness (Ra) of 0.11 to 0.18 ?m, the maximum height (Ry) of 0.9 to 1.6 ?m and the average distance between peaks (S) of 0.05 to 0.11 mm. The film can prevent the formation of a Newton's ring and shows satisfactory durability (particularly, pen input durability) and satisfactory display property without buzzing.Type: GrantFiled: August 30, 2006Date of Patent: September 10, 2013Assignee: Nitto Denko CorporationInventors: Tomotake Nashiki, Hidetoshi Yoshitake, Hideo Sugawara
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Patent number: 8481150Abstract: A transparent conductive multilayer body of the invention comprises a transparent film substrate with a thickness of 2 to 120 ?m; a first transparent dielectric thin film, a second transparent dielectric thin film and a transparent conductive thin film laminated in this order on one side of the transparent film substrate; and a transparent substrate bonded to the other side of the film substrate through a transparent pressure-sensitive adhesive layer, wherein the second dielectric thin film is made of an inorganic material or a mixture of an organic material and an inorganic material, and the conductive thin film contains a crystalline material in which the content of crystal particles whose maximum particle sizes are at most 300 nm is higher than 50% by area. Such a transparent conductive multilayer body fully satisfies the pen input bending durability for a touch panel.Type: GrantFiled: November 7, 2011Date of Patent: July 9, 2013Assignee: Nitto Denko CorporationInventors: Tomotake Nashiki, Hidetoshi Yoshitake, Hideo Sugawara
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Patent number: 8173246Abstract: The transparent conductive laminate of the present invention is a transparent conductive laminate, comprising: a transparent film substrate; a transparent conductive thin film provided on one side of the transparent film substrate with a dielectric thin film interposed therebetween; and a transparent substrate bonded to another side of the transparent film substrate with a transparent pressure-sensitive adhesive layer interposed therebetween, wherein the transparent substrate comprises at least two transparent base films laminated with the transparent pressure-sensitive adhesive layer interposed therebetween, and the dielectric thin film comprises a first transparent dielectric thin film consisting of a SiOx (x is from 1.5 to less than 2) film having a relative refractive index of 1.6 to 1.9, and a second transparent dielectric thin film consisting of a SiO2 film. This feature can improve the surface contact pressure durability.Type: GrantFiled: May 20, 2011Date of Patent: May 8, 2012Assignee: Nitto Denko CorporationInventors: Tomotake Nashiki, Hideo Sugawara, Hidetoshi Yoshitake
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Publication number: 20120052278Abstract: A transparent conductive multilayer body of the invention comprises a transparent film substrate with a thickness of 2 to 120 ?m; a first transparent dielectric thin film, a second transparent dielectric thin film and a transparent conductive thin film laminated in this order on one side of the transparent film substrate; and a transparent substrate bonded to the other side of the film substrate through a transparent pressure-sensitive adhesive layer, wherein the second dielectric thin film is made of an inorganic material or a mixture of an organic material and an inorganic material, and the conductive thin film contains a crystalline material in which the content of crystal particles whose maximum particle sizes are at most 300 nm is higher than 50% by area. Such a transparent conductive multilayer body fully satisfies the pen input bending durability for a touch panel.Type: ApplicationFiled: November 7, 2011Publication date: March 1, 2012Applicant: NITTO DENKO CORPORATIONInventors: Tomotake Nashiki, Hidetoshi Yoshitake, Hideo Sugawara
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Patent number: 8097330Abstract: A transparent conductive multilayer body of the invention comprises a transparent film substrate with a thickness of 2 to 120 ?m; a first transparent dielectric thin film, a second transparent dielectric thin film and a transparent conductive thin film laminated in this order on one side of the transparent film substrate; and a transparent substrate bonded to the other side of the film substrate through a transparent pressure-sensitive adhesive layer, wherein the second dielectric thin film is made of an inorganic material or a mixture of an organic material and an inorganic material, and the conductive thin film contains a crystalline material in which the content of crystal particles whose maximum particle sizes are at most 300 nm is higher than 50% by area. Such a transparent conductive multilayer body fully satisfies the pen input bending durability for a touch panel.Type: GrantFiled: April 22, 2005Date of Patent: January 17, 2012Assignee: Nitto Denko CorporationInventors: Tomotake Nashiki, Hidetoshi Yoshitake, Hideo Sugawara
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Patent number: 8048512Abstract: The transparent conductive laminate of the present invention is a transparent conductive laminate, comprising: a transparent film substrate; a transparent conductive thin film provided on one side of the transparent film substrate with a dielectric thin film interposed therebetween; and a transparent substrate bonded to another side of the transparent film substrate with a transparent pressure-sensitive adhesive layer interposed therebetween, wherein the transparent substrate comprises at least two transparent base films laminated with the transparent pressure-sensitive adhesive layer interposed therebetween, and the dielectric thin film comprises a first transparent dielectric thin film consisting of a SiOx (x is from 1.5 to less than 2) film having a relative refractive index of 1.6 to 1.9, and a second transparent dielectric thin film consisting of a SiO2 film. This feature can improve the surface contact pressure durability.Type: GrantFiled: June 7, 2007Date of Patent: November 1, 2011Assignee: Nitto Denko CorporationInventors: Tomotake Nashiki, Hideo Sugawara, Hidetoshi Yoshitake
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Publication number: 20110217548Abstract: The transparent conductive laminate of the present invention is a transparent conductive laminate, comprising: a transparent film substrate; a transparent conductive thin film provided on one side of the transparent film substrate with a dielectric thin film interposed therebetween; and a transparent substrate bonded to another side of the transparent film substrate with a transparent pressure-sensitive adhesive layer interposed therebetween, wherein the transparent substrate comprises at least two transparent base films laminated with the transparent pressure-sensitive adhesive layer interposed therebetween, and the dielectric thin film comprises a first transparent dielectric thin film consisting of a SiOx (x is from 1.5 to less than 2) film having a relative refractive index of 1.6 to 1.9, and a second transparent dielectric thin film consisting of a SiO2 film. This feature can improve the surface contact pressure durability.Type: ApplicationFiled: May 20, 2011Publication date: September 8, 2011Applicant: NITTO DENKO CORPORATIONInventors: Tomotake NASHIKI, Hideo SUGAWARA, Hidetoshi YOSHITAKE
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Patent number: 8003200Abstract: A transparent electrically-conductive film of the present invention comprises a transparent film substrate, a hard coat layer formed on one side of the transparent film substrate, a SiOx layer with a thickness of 10 nm to 300 nm that is formed on the hard coat layer by a dry process, and a transparent electrically-conductive thin layer with a thickness of 20 nm to 35 nm that is formed on another side of the transparent film substrate. The transparent electrically-conductive film has good resistance to moisture and heat and high durability against pen-based input and can be prevented from cracking during a punching process and also prevented from waving or curling even in a high-temperature, high-humidity environment.Type: GrantFiled: September 27, 2005Date of Patent: August 23, 2011Assignee: Nitto Denko CorporationInventors: Tomotake Nashiki, Hideo Sugawara, Hidehiko Andou, Hidetoshi Yoshitake
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Patent number: 7968185Abstract: A transparent conductive laminated body comprising: a transparent film substrate having a thickness of 2 to 200 ?m, and a first transparent dielectric thin film, a second transparent dielectric thin film and a transparent conductive thin film that are formed on one side of the substrate in this order from the side of the substrate, wherein the first transparent dielectric thin film is formed by vacuum deposition, sputtering or ion plating and comprises a complex oxide containing 0 to 20 parts by weight of tin oxide and 10 to 40 parts by weight of cerium oxide relative to 100 parts by weight of indium oxide, and the relationship: n2<n3?n1 is satisfied, where n1 is the refractive index of the first transparent dielectric thin film, n2 is the refractive index of the second transparent dielectric thin film, and n3 is the refractive index of the transparent conductive thin film, suppresses coloration of transmitted light and is produced with high productivity.Type: GrantFiled: February 22, 2011Date of Patent: June 28, 2011Assignee: Nitto Denko CorporationInventors: Tomonori Noguchi, Hideo Sugawara, Tomotake Nashiki, Hidetoshi Yoshitake
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Publication number: 20110141065Abstract: A transparent conductive laminated body comprising: a transparent film substrate having a thickness of 2 to 200 ?m, and a first transparent dielectric thin film, a second transparent dielectric thin film and a transparent conductive thin film that are formed on one side of the substrate in this order from the side of the substrate, wherein the first transparent dielectric thin film is formed by vacuum deposition, sputtering or ion plating and comprises a complex oxide containing 0 to 20 parts by weight of tin oxide and 10 to 40 parts by weight of cerium oxide relative to 100 parts by weight of indium oxide, and the relationship: n2<n3?n1 is satisfied, where n1 is the refractive index of the first transparent dielectric thin film, n2 is the refractive index of the second transparent dielectric thin film, and n3 is the refractive index of the transparent conductive thin film, suppresses coloration of transmitted light and is produced with high productivity.Type: ApplicationFiled: February 22, 2011Publication date: June 16, 2011Applicant: NITTO DENKO CORPORATIONInventors: Tomonori Noguchi, Hideo Sugawara, Tomotake Nashiki, Hidetoshi Yoshitake
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Patent number: 7914883Abstract: A transparent conductive laminated body comprising: a transparent film substrate having a thickness of 2 to 200 ?m, and a first transparent dielectric thin film, a second transparent dielectric thin film and a transparent conductive thin film that are formed on one side of the substrate in this order from the side of the substrate, wherein the first transparent dielectric thin film is formed by vacuum deposition, sputtering or ion plating and comprises a complex oxide containing 0 to 20 parts by weight of tin oxide and 10 to 40 parts by weight of cerium oxide relative to 100 parts by weight of indium oxide, and the relationship: n2<n3?n1 is satisfied, where n1 is the refractive index of the first transparent dielectric thin film, n2 is the refractive index of the second transparent dielectric thin film, and n3 is the refractive index of the transparent conductive thin film, suppresses coloration of transmitted light and is produced with high productivity.Type: GrantFiled: June 8, 2006Date of Patent: March 29, 2011Assignee: Nitto Denko CorporationInventors: Tomonori Noguchi, Hideo Sugawara, Tomotake Nashiki, Hidetoshi Yoshitake
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Patent number: 7781048Abstract: A transparent conductive multilayer body of the present invention is characterized by having: a transparent film base; an SiOx film (x is no less than 1.5 and less than 2) which is provided on one surface of the above described film base in accordance with a dry process, and has a thickness of 1 nm to 30 nm and a relative index of refraction of 1.6 to 1.9; an SiO2 film which is provided on the above described SiOx film and has a thickness of 10 nm to 50 nm; and a transparent conductive thin film which is provided on the above described SiO2 film and has a thickness of 20 nm to 35 nm.Type: GrantFiled: August 16, 2006Date of Patent: August 24, 2010Assignee: Nitto Denko CorporationInventors: Tomotake Nashiki, Hideo Sugawara, Hidetoshi Yoshitake
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Patent number: 7763151Abstract: A process for producing a transparent conductive laminate having a completely crystallized, transparent conductive layer on a substrate comprising an organic polymer molding is provided. The transparent conductive layer is excellent in transparency and wet heat confidence, is not excessively low in specific resistivity, and has no variation on optical properties such as retardation characteristic. The transparent conductive laminate is obtained by sputter-film forming a transparent conductive layer on a substrate comprising an organic polymer molding under conditions of a substrate temperature of 80-150° C. and a degree of vacuum of 8×10?3 Pa or lower to form an amorphous transparent conductive layer comprising an In.Type: GrantFiled: August 26, 2004Date of Patent: July 27, 2010Assignee: Nitto Denko CorporationInventors: Tomonori Noguchi, Hidehiko Andou, Hidetoshi Yoshitake, Hideo Sugawara
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Publication number: 20100003502Abstract: The transparent conductive laminate of the present invention is a transparent conductive laminate, comprising: a transparent film substrate; a transparent conductive thin film provided on one side of the transparent film substrate with a dielectric thin film interposed therebetween; and a transparent substrate bonded to another side of the transparent film substrate with a transparent pressure-sensitive adhesive layer interposed therebetween, wherein the transparent substrate comprises at least two transparent base films laminated with the transparent pressure-sensitive adhesive layer interposed therebetween, and the dielectric thin film comprises a first transparent dielectric thin film consisting of a SiOx (x is from 1.5 to less than 2) film having a relative refractive index of 1.6 to 1.9, and a second transparent dielectric thin film consisting of a SiO2 film. This feature can improve the surface contact pressure durability.Type: ApplicationFiled: June 7, 2007Publication date: January 7, 2010Applicant: NITTO DENKO CORPORATIONInventors: Tomotake Nashiki, Hideo Sugawara, Hidetoshi Yoshitake
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Publication number: 20090284475Abstract: A transparent conductive film comprising a transparent film base material, a resin layer having a fine uneven geometrical structure, and a transparent conductive thin film laminated on the film base material through the resin layer, wherein the surface of the transparent conductive thin film has an average centerline roughness (Ra) of 0.11 to 0.18 ?m, the maximum height (Ry) of 0.9 to 1.6 ?m and the average distance between peaks (S) of 0.05 to 0.11 mm. The film can prevent the formation of a Newton's ring and shows satisfactory durability (particularly, pen input durability) and satisfactory display property without buzzing.Type: ApplicationFiled: August 30, 2006Publication date: November 19, 2009Applicant: NITTO DENKO CORPORATIONInventors: Tomotake Nashiki, Hidetoshi Yoshitake, Hideo Sugawara
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Publication number: 20080096013Abstract: A transparent electrically-conductive film of the present invention comprises a transparent film substrate, a hard coat layer formed on one side of the transparent film substrate, a SiOx layer with a thickness of 10 nm to 300 nm that is formed on the hard coat layer by a dry process, and a transparent electrically-conductive thin layer with a thickness of 20 nm to 35 nm that is formed on another side of the transparent film substrate. The transparent electrically-conductive film has good resistance to moisture and heat and high durability against pen-based input and can be prevented from cracking during a punching process and also prevented from waving or curling even in a high-temperature, high-humidity environment.Type: ApplicationFiled: September 27, 2005Publication date: April 24, 2008Applicant: Nitto Denko CorporationInventors: Tomotake Nashiki, Hideo Sugawara, Hidehiko Andou, Hidetoshi Yoshitake
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Publication number: 20080020202Abstract: A transparent conductive multilayer body of the invention comprises a transparent film substrate with a thickness of 2 to 120 ?m; a first transparent dielectric thin film, a second transparent dielectric thin film and a transparent conductive thin film laminated in this order on one side of the transparent film substrate; and a transparent substrate bonded to the other side of the film substrate through a transparent pressure-sensitive adhesive layer, wherein the second dielectric thin film is made of an inorganic material or a mixture of an organic material and an inorganic material, and the conductive thin film contains a crystalline material in which the content of crystal particles whose maximum particle sizes are at most 300 nm is higher than 50% by area. Such a transparent conductive multilayer body fully satisfies the pen input bending durability for a touch panel.Type: ApplicationFiled: April 22, 2005Publication date: January 24, 2008Applicant: NITTO DENKO CORPORATIONInventors: Tomotake Nashiki, Hidetoshi Yoshitake, Hideo Sugawara
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Patent number: 7259803Abstract: A resin sheet that is unlikely to be affected by heat and allows prevention of the occurrence of a crack is provided. A glass fiber cloth-like material is dipped into an epoxy resin solution and subjected to curing, thereby obtaining an epoxy resin-based sheet including the glass fiber cloth-like material. The resin sheet has a haze value of 10% or lower, and preferably, has a light transmittance of 88% or higher, an in-plane retardation of not more than 2 nm, a retardation in a thickness direction of 40 nm, and a surface roughness of not more than 2 ?m.Type: GrantFiled: May 22, 2003Date of Patent: August 21, 2007Assignee: Nitto Denko CorporationInventors: Yuuzou Akada, Toshiyuki Umehara, Nobuyoshi Yagi, Tadaaki Harada, Yoshimasa Sakata, Hidetoshi Yoshitake
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Publication number: 20070091074Abstract: A transparent conductive multilayer body of the present invention is characterized by having: a transparent film base; an SiOx film (x is no less than 1.5 and less than 2) which is provided on one surface of the above described film base in accordance with a dry process, and has a thickness of 1 nm to 30 nm and a relative index of refraction of 1.6 to 1.9; an SiO2 film which is provided on the above described SiOx film and has a thickness of 10 nm to 50 nm; and a transparent conductive thin film which is provided on the above described SiO2 film and has a thickness of 20 nm to 35 nm.Type: ApplicationFiled: August 16, 2006Publication date: April 26, 2007Applicant: NITTO DENKO CORPORATIONInventors: Tomotake Nashiki, Hideo Sugawara, Hidetoshi Yoshitake
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Publication number: 20060290409Abstract: A transparent conductive laminated body comprising: a transparent film substrate having a thickness of 2 to 200 ?m, and a first transparent dielectric thin film, a second transparent dielectric thin film and a transparent conductive thin film that are formed on one side of the substrate in this order from the side of the substrate, wherein the first transparent dielectric thin film is formed by vacuum deposition, sputtering or ion plating and comprises a complex oxide containing 0 to 20 parts by weight of tin oxide and 10 to 40 parts by weight of cerium oxide relative to 100 parts by weight of indium oxide, and the relationship: n2<n3?n1 is satisfied, where n1 is the refractive index of the first transparent dielectric thin film, n2 is the refractive index of the second transparent dielectric thin film, and n3 is the refractive index of the transparent conductive thin film, suppresses coloration of transmitted light and is produced with high productivity.Type: ApplicationFiled: June 8, 2006Publication date: December 28, 2006Applicant: NITTO DENKO CORPORATIONInventors: Tomonori Noguchi, Hideo Sugawara, Tomotake Nashiki, Hidetoshi Yoshitake