Patents by Inventor Hidetsugu Hosomi

Hidetsugu Hosomi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Holder for electroless plating and method of electroless plating
    Patent number: 6572930
    Abstract: A holder for electroless plating to hold a plurality of ceramic elements for ceramic electronic parts during electroless plating treatment, each surface of said ceramic elements being to be electroless plated, said holder comprising a plurality of cells to house each of said plurality of ceramic elements separately, and each of said cells having such a structure as to permit the flow communication of a plating solution into the cell.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: June 3, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Mikiya Kobayashi, Yoshihiko Takano, Kiyomi Sasaki, Hiroyuki Ukai, Hidetsugu Hosomi, Akira Imamura
  • Holder for electroless plating and method of electroless plating
    Patent number: 6471777
    Abstract: A holder for electroless plating to hold a plurality of ceramic elements for ceramic electronic parts during electroless plating treatment, each surface of said ceramic elements being to be electroless plated, said holder comprising a plurality of cells to house each of said plurality of ceramic elements separately, and each of said cells having such a structure as to permit the flow communication of a plating solution into the cell.
    Type: Grant
    Filed: October 20, 1999
    Date of Patent: October 29, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Mikiya Kobayashi, Yoshihiko Takano, Kiyomi Sasaki, Hiroyuki Ukai, Hidetsugu Hosomi, Akira Imamura
  • Holder for electroless plating and method of electroless plating
    Publication number: 20020150693
    Abstract: A holder for electroless plating to hold a plurality of ceramic elements for ceramic electronic parts during electroless plating treatment, each surface of said ceramic elements being to be electroless plated, said holder comprising a plurality of cells to house each of said plurality of ceramic elements separately, and each of said cells having such a structure as to permit the flow communication of a plating solution into the cell.
    Type: Application
    Filed: June 14, 2002
    Publication date: October 17, 2002
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Mikiya Kobayashi, Yoshihiko Takano, Kiyomi Sadaki, Hiroyuki Ukai, Hidetsugu Hosomi, Akira Imamura