Patents by Inventor Hidetsugu Tazawa

Hidetsugu Tazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8283577
    Abstract: Intended is to provide an electromagnetic shielding material having a conductive layer pattern by transferring a conductive composite to a transparent base material, and an electromagnetic shielding material having a metal layer formed on the transferred conductive layer. The electromagnetic shielding material is free from the troubles such as the breaking of wire, the non-conforming shape or the low contact, which is based on the non-conforming transfer of the conductive composite. The electromagnetic shielding material comprises a transparent base material, a primer layer formed over the transparent base material, and a conductive layer formed in a predetermined pattern on the primer layer. In the primer layer, a portion having the conductive layer formed therein has a thickness larger than the thickness of a portion without the conductive layer.
    Type: Grant
    Filed: June 6, 2008
    Date of Patent: October 9, 2012
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Nobuo Naito, Hironori Kamiyama, Nozomi Kaga, Yuichi Miyazaki, Takeshi Nishizono, Hidetsugu Tazawa, Shinya Kiura
  • Patent number: 8252423
    Abstract: There is provided a resin laminate having a layer construction of a first inorganic material layer/insulating layer/second inorganic material layer or a layer construction of an inorganic material layer/insulating layer, wherein the insulating layer has a multi-layer structure of two or more resin layers of a core insulating layer and an adhesive insulating layer. In this case, the resin laminate has the adhesive insulating layer which can realize optimal etching, is suitable for etching by a wet process, and has excellent adhesion. At least one of the layers constituting the insulating layer is formed of a polyimide resin which comprises repeating units represented by formula (1) and has a glass transition point of 150 to 360° C. and is dissolvable in a basic solution at a rate of more than 3 ?m/min, preferably more than 5 ?m/min, and most preferably more than 8 ?m/min.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: August 28, 2012
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Shigeki Kawano, Hiroko Amasaki, Hidetsugu Tazawa, Kazunari Ikeda, Kouhei Ohno
  • Publication number: 20110076855
    Abstract: There is provided a resin laminate having a layer construction of a first inorganic material layer/insulating layer/second inorganic material layer or a layer construction of an inorganic material layer/insulating layer, wherein the insulating layer has a multi-layer structure of two or more resin layers of a core insulating layer and an adhesive insulating layer. In this case, the resin laminate has the adhesive insulating layer which can realize optimal etching, is suitable for etching by a wet process, and has excellent adhesion. At least one of the layers constituting the insulating layer is formed of a polyimide resin which comprises repeating units represented by formula (1) and has a glass transition point of 150 to 360° C. and is dissolvable in a basic solution at a rate of more than 3 ?m/min, preferably more than 5 ?m/min, and most preferably more than 8 ?m/min.
    Type: Application
    Filed: October 25, 2010
    Publication date: March 31, 2011
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya SAKAYORI, Shigeki KAWANO, Hiroko AMASAKI, Hidetsugu TAZAWA, Kazunari IKEDA, Kouhei OHNO
  • Publication number: 20100230154
    Abstract: Intended is to provide an electromagnetic shielding material having a conductive layer pattern by transferring a conductive composite to a transparent base material, and an electromagnetic shielding material having a metal layer formed on the transferred conductive layer. The electromagnetic shielding material is free from the troubles such as the breaking of wire, the non-conforming shape or the low contact, which is based on the non-conforming transfer of the conductive composite. The electromagnetic shielding material comprises a transparent base material, a primer layer formed over the transparent base material, and a conductive layer formed in a predetermined pattern on the primer layer. In the primer layer, a portion having the conductive layer formed therein has a thickness larger than the thickness of a portion without the conductive layer.
    Type: Application
    Filed: June 6, 2008
    Publication date: September 16, 2010
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Nobuo Naito, Hironori Kamiyama, Nozomi Kaga, Yuichi Miyazaki, Takeshi Nishizono, Hidetsugu Tazawa, Shinya Kiura
  • Publication number: 20070148762
    Abstract: A cell culture patterning substrate on which cells can be arranged regularly with high efficiency over a large area on a base material so as to attain formation of a tissue, etc. The cell culture patterning substrate includes: a base material; and a cell culture region which is formed on the base material, is a region for culturing a cell and contains a cell adhesive layer having adhesive properties to the cell. The cell culture region includes: a cell adhesion portion at which the cell adhesive layer is formed; and a cell adhesion auxiliary portion, formed in a pattern, which inhibits adhesion to the cell, and the cell adhesion auxiliary portion is formed such that, upon adhesion of the cell to the cell adhesion portion, the cells on two cell adhesion portions adjacent to the cell adhesion auxiliary portion can be bound to each other on the cell adhesion auxiliary portion.
    Type: Application
    Filed: February 18, 2005
    Publication date: June 28, 2007
    Inventors: Hideyuki Miyake, Hideshi Hattori, Hironori Kobayashi, Hidetsugu Tazawa
  • Publication number: 20040043232
    Abstract: A laminate having a layer structure of first inorganic layer-insulating layer-second inorganic layer or inorganic layer-insulating layer, characterized in that the insulating layer comprises two or more resin layers containing a core insulating layer and an adhesive insulating layer, and at least one layer constituting the insulating layer comprises a polyimide resin which has a recurring unit represented by the general formula (1), has a glass transition temperature of 150° C. to 360° C., and exhibits a rate of dissolution in a basic solution of 3 &mgr;/min or more, preferably 5 ?m/min or more, most preferably 8 &mgr;/min or more.
    Type: Application
    Filed: February 21, 2002
    Publication date: March 4, 2004
    Inventors: Katsuya Sakayori, Shigeki Kawano, Hiroko Amasaki, Hidetsugu Tazawa, Kazunari Ikeda, Kouhei Ohno