Patents by Inventor Hidevuki Umetsu

Hidevuki Umetsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6121388
    Abstract: A polyamide resin composition comprising 100 parts by weight of a polyamide resin, from 0.01 to 100 parts by weight of a liquid-crystalline resin, and from 0.01 to 5 parts by weight of an acid anhydride all the time has good fluidity even when it is left for a relatively long period of residence time in a cylinder of a molding machine while it is molded, and has good moldability. The amount of cushion resin needed for molding the composition fluctuates little, and the failure such as cobwebbing in molding the composition is reduced. The moldings of the composition have good impact resistance and good outward appearance. The composition is most suitable to producing box-type moldings with thin-wall parts.
    Type: Grant
    Filed: April 6, 1999
    Date of Patent: September 19, 2000
    Assignee: Toray Industries, Inc.
    Inventors: Hidevuki Umetsu, Masahiro Sugimura, Yoshiki Makabe