Patents by Inventor Hideya Ariga

Hideya Ariga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6025077
    Abstract: A composition of the present invention comprises organosiloxane partial hydrolyzate represented by a formula R.sub.2.sup.a SiO.sub.b (OR.sup.1).sub.c (OH).sub.d and having a weight-average molecular weight of 600-5,000 in polystylene conversion, (B) colloidal silica, (C) emulsifying agent and (D) water. Its manufacturing method comprises, for example, a step of mixing the mixed (A), (B) and (D) constituents with the (C) constituent, whereby the composition of silicone emulsion coating material which is stable as an emulsion for a long term and capable of being hardened at low temperatures and as heated and forming a hardened film excellent in the weatherability, durability and so on, as well as its manufacturing method can be provided.
    Type: Grant
    Filed: May 26, 1998
    Date of Patent: February 15, 2000
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Takeyuki Yamaki, Minoru Inoue, Kazuo Seto, Hideya Ariga, Akihiko Ohashi
  • Patent number: 5663256
    Abstract: A thermosetting aqueous-type emulsion of nadimide is disclosed. The emulsion comprises 1-70% by weight of an alkenyl-substituted nadimide, 0.1-20% by weight of protective colloid and/or surface-active agent and balance water. The emulsion is especially useful for making a paint, a coating material or an adhesive because the emulsion can easily be cured only by heating without forming any undesirable organic pollutants. In the past, various resins have been used together with organic solvents. However, because of the recent worldwide concern over the influence of organic solvents to pollution of the aerospace and underground environments, non-use or reduced-use of organic solvents is actively desired. Accordingly, developments of aqueous solution or aqueous-type emulsion of resins are desired. Until now there is no aqueous-type emulsion of a monomer of highly heat resistant polyimide.
    Type: Grant
    Filed: October 23, 1995
    Date of Patent: September 2, 1997
    Assignee: Maruzen Petrochemical Co., Ltd.
    Inventors: Hideya Ariga, Norio Futaesaku, Hiromitsu Baba