Abstract: This invention provides a manufacturing method of printed wiring board which enables a plate-like substrate to be carried and processed without any contact to its product surface. End portions of plate-like copper clad laminates are overlapped vertically and then joined linearly by rotating an ultrasonic horn along the end portions. Consequently, copper foils can be metal-joined and a joining strength necessary for transportation with a roller is obtained. Because belt-like copper clad laminate is obtained by joining the plate-like copper clad laminates and after that, processed, thus, the belt-like copper clad laminate can be carried without any contact to its product surface as it is carried with the roller, and then processed.

Abstract: This invention provides a manufacturing method of printed wiring board which enables a plate-like substrate to be carried and processed without any contact to its product surface. End portions of plate-like copper clad laminates are overlapped vertically and then joined linearly by rotating an ultrasonic horn along the end portions. Consequently, copper foils can be metal-joined and a joining strength necessary for transportation with a roller is obtained. Because belt-like copper clad laminate is obtained by joining the plate-like copper clad laminates and after that, processed, thus, the belt-like copper clad laminate can be carried without any contact to its product surface as it is carried with the roller, and then processed.

Abstract: A device for inspecting a substrate, including a probe and a support member configured to hold the probe is disclosed. The probe comprises a compression spring and includes a conductive material to measure an electric property of a substrate under inspection.

Abstract: This invention provides a manufacturing method of printed wiring board which enables a plate-like substrate to be carried and processed without any contact to its product surface. End portions of plate-like copper clad laminates are overlapped vertically and then joined linearly by rotating an ultrasonic horn along the end portions. Consequently, copper foils can be metal-joined and a joining strength necessary for transportation with a roller is obtained. Because belt-like copper clad laminate is obtained by joining the plate-like copper clad laminates and after that, processed, thus, the belt-like copper clad laminate can be carried without any contact to its product surface as it is carried with the roller, and then processed.

Abstract: A ceramic structure includes a plurality of porous ceramic members each being warped, each of the plurality of porous ceramic members having a bonding portion and end portions at both ends of each of the plurality of porous ceramic members in a longitudinal direction of each of the plurality of porous ceramic members, and an adhesive provided only on the bonding portion between the plurality of porous ceramic members to connect the plurality of porous ceramic members except for the end portions of the plurality of ceramic members.

Abstract: A ceramic structure includes a plurality of porous ceramic members each being warped, each of the plurality of porous ceramic members having a bonding portion and end portions at both ends of each of the plurality of porous ceramic members in a longitudinal direction of each of the plurality of porous ceramic members, and an adhesive provided only on the bonding portion between the plurality of porous ceramic members to connect the plurality of porous ceramic members except for the end portions of the plurality of ceramic members.