Patents by Inventor Hideya KURODA

Hideya KURODA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170265343
    Abstract: In a board work machine that performs board work with reference to a reference mark provided on a board, in a case of performing board work with respect to a board provided with overall reference mark and local area reference mark that acts as a reference for a local area as reference marks, when recognizing the reference marks by imaging, checking is performed as to whether a recognized reference mark is recognized correctly. For this checking, when checking whether the position deviation amount from a normal position and the relative position deviation amount of an imaging target identified as a reference mark is within the range of a set tolerance, set tolerances for a local area reference mark are smaller than set tolerances for an overall reference mark.
    Type: Application
    Filed: December 18, 2014
    Publication date: September 14, 2017
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Hideya KURODA, Masahiro TAKEDA
  • Patent number: 8584350
    Abstract: In a component mounting apparatus, when one of first and second board transfer devices is performing the unloading and loading of boards, a controller operates a component placing device to mount components on a first or second board loaded by the other board transfer device. Thus, it is possible to effectively utilize the time which is taken for the unloading and the loading of either boards, for component mountings on the other board, so that the efficiency in producing boards can be enhanced. Further, since the controller executes a control so that while component mountings are performed on the first boards of M-sheets on the first board transfer device, component mountings are performed on the second boards of N-sheets on the second board transfer device, it is realized to suppress the occurrence of an intermediate stock of either boards where the first boards of the M-sheets and the second boards of the N-sheets are required.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: November 19, 2013
    Assignee: Fuji Machine Mfg. Co., Ltd.
    Inventors: Hideya Kuroda, Yoshihiro Yasui, Takayoshi Kawai, Hiroyuki Haneda
  • Publication number: 20120020765
    Abstract: In a component mounting apparatus, when one of first and second board transfer devices is performing the unloading and loading of boards, a controller operates a component placing device to mount components on a first or second board loaded by the other board transfer device. Thus, it is possible to effectively utilize the time which is taken for the unloading and the loading of either boards, for component mountings on the other board, so that the efficiency in producing boards can be enhanced. Further, since the controller executes a control so that while component mountings are performed on the first boards of M-sheets on the first board transfer device, component mountings are performed on the second boards of N-sheets on the second board transfer device, it is realized to suppress the occurrence of an intermediate stock of either boards where the first boards of the M-sheets and the second boards of the N-sheets are required.
    Type: Application
    Filed: June 14, 2011
    Publication date: January 26, 2012
    Applicant: Fuji Machine Mfg. Co., Ltd.
    Inventors: Hideya KURODA, Yoshihiro Yasui, Takayoshi Kawai, Hiroyuki Haneda