Abstract: The method for manufacturing a multilayer ceramic electronic component 1 includes a step of forming a discontinuous internal electrode pattern 6 having gaps Dv on a dielectric green sheet by using a vacuum film formation method, a step of stacking and applying pressure bonding to a plurality of dielectric green sheets such that the internal electrode patterns 6 overlap each other, a step of dividing the plurality of dielectric green sheets that have been bonded, into a plurality of laminates 2, and a step of firing the laminates 2 such that widths Lv of the gaps Dv shrink.

Abstract: A multilayer ceramic electronic device includes an element body in which a plurality of internal electrodes and a plurality of dielectric are alternately stacked in a first direction, each of the plurality of internal electrodes being alternately exposed to each of a pair of end faces of the element body, the pair of end faces facing each other in a second direction, and a pair of external electrodes each contacting each of the plurality of internal electrodes exposed from each of the pair of end faces and having a layer in contact with each of the plurality of internal electrodes, and of which a main component is copper. A molar ratio of copper to nickel in the first internal electrode in the end margin section is greater than the molar ratio in the first internal electrode in a capacity section.

Abstract: A capacitor includes a body, a first external electrode provided on the body, and a second external electrode provided on the body. The body has: a first internal electrode layer containing Fe at a first concentration; a second internal electrode layer; a dielectric layer disposed between the first and second internal electrode layers in a first direction; and a first intermediate layer disposed between the first internal electrode layer and the dielectric layer, the first intermediate layer containing Fe at a second concentration. The first external electrode is electrically connected to the first internal electrode layer, and the second external electrode is electrically connected to the second internal electrode layer. The first external electrode includes a Ni plating layer. The first concentration is 0.01 at % or greater. The second concentration is equal to or greater than three times the first concentration while being 2 at % or less.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure having a parallelepiped shape in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the multilayer structure, a main component of the plurality of dielectric layers being a ceramic; and a first cover layer and a second cover layer that sandwich the multilayer structure in a stacking direction of the multilayer structure, a main component of the first cover layer and the second cover layer being the same as that of the dielectric layers, wherein the first cover layer includes a first region spaced from the multilayer structure by at least 50 ?m, is thicker than the second cover layer, and has a thickness more than 50 ?m.

Abstract: A multilayer ceramic electronic component includes a ceramic main body including a functional part in which first internal electrodes and second internal electrodes are laminated in a vertical direction, end margin parts provided respectively between a first end surface of the ceramic main body and the second internal electrodes and between a second end surface of the ceramic main body and the first internal electrodes, and side margin parts that respectively cover the functional part from sides. The electronic component further includes external electrodes respectively provided on the first end surface and the second end surface. The end margin parts contain boron (B), and the side margin parts contain silicon (Si) and boron. A concentration of boron in the side margin parts is less than a concentration of boron in the end margin parts.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure having a parallelepiped shape in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the multilayer structure, a main component of the plurality of dielectric layers being a ceramic; and a first cover layer and a second cover layer that sandwich the multilayer structure in a stacking direction of the multilayer structure, a main component of the first cover layer and the second cover layer being the same as that of the dielectric layers, wherein the first cover layer includes a first region spaced from the multilayer structure by at least 50 ?m, is thicker than the second cover layer, and has a thickness more than 50 ?m.

Abstract: A multilayer ceramic electronic component includes a ceramic main body including a functional part in which first internal electrodes and second internal electrodes are laminated in a vertical direction, end margin parts provided respectively between a first end surface of the ceramic main body and the second internal electrodes and between a second end surface of the ceramic main body and the first internal electrodes, and side margin parts that respectively cover the functional part from sides. The electronic component further includes external electrodes respectively provided on the first end surface and the second end surface. The end margin parts contain boron (B), and the side margin parts contain silicon (Si) and boron. A concentration of boron in the side margin parts is less than a concentration of boron in the end margin parts.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which dielectric layers and internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the multilayer structure; and a first cover layer and a second cover layer that sandwich the multilayer structure, a main component of the first cover layer and the second cover layer being the same as that of the dielectric layers, wherein the first cover layer is thicker than the second cover layer, wherein a concentration of Mn of at least a part of the first cover layer is higher than a concentration of Mn of the dielectric layers in an effective capacity region in which a set of internal electrode layers exposed to a first edge face of the multilayer structure face with another set of internal electrode layers exposed to a second edge face of the multilayer structure.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which dielectric layers and internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the multilayer structure; and a first cover layer and a second cover layer that sandwich the multilayer structure, a main component of the first cover layer and the second cover layer being the same as that of the dielectric layers, wherein the first cover layer is thicker than the second cover layer, wherein a concentration of Mn of at least a part of the first cover layer is higher than a concentration of Mn of the dielectric layers in an effective capacity region in which a set of internal electrode layers exposed to a first edge face of the multilayer structure face with another set of internal electrode layers exposed to a second edge face of the multilayer structure.

Abstract: A multi-layer ceramic capacitor has a laminate of dielectric layers and internal electrode layers laminated alternately with one another, as well as cover layers formed as the outermost layers at the top and bottom of the laminate in the laminating direction, wherein the dielectric layers are constituted by a sintered compact containing a barium titanate and a silicon compound, and a fresnoite phase having an average grain size of 1 ?m or less is present in the dielectric layers.

Abstract: A multi-layer ceramic capacitor has a laminate of dielectric layers and internal electrode layers laminated alternately with one another, as well as cover layers formed as the outermost layers at the top and bottom of the laminate in the laminating direction, wherein the dielectric layers are constituted by a sintered compact containing a barium titanate and a silicon compound, and a fresnoite phase having an average grain size of 1 ?m or less is present in the dielectric layers.