Patents by Inventor Hideyasa Yamada

Hideyasa Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060281361
    Abstract: An FPC is electrically connected to a printed wiring board. The FPC includes an elongated substrate and a conductor part laminated on the face of the substrate. The conductor part includes a plurality of conductors extending along the axial direction of the substrate, and elastically deformable first contact terminals each of which extends from the face of the conductors toward the base end of the FPC. The printed wiring board includes an insertion opening formed at the edge surface thereof, and plural line connecting terminals which are formed on the internal wall surface of the insertion opening, and which extend in the inserting direction for inserting the FPC.
    Type: Application
    Filed: March 23, 2004
    Publication date: December 14, 2006
    Inventors: Shinji Uchida, Hideyasa Yamada, Akihito Funakoshi