Abstract: To provide phosphorus-containing epoxy resins and phosphorus-containing epoxy resin compositions having high levels of appearance, yield and economic efficiency and cured products thereof that are used for various applications. A phosphorus-containing phenol compound represented by Formula (3) obtained by reacting a compound represented by Formula (2) with a compound represented by Formula (1), wherein in the peak area (A) of the component represented by Formula (1) on a chromatogram measured under specific conditions by gel permeation chromatography, peak area (B) on the high-molecular-weight side of the component of Formula (1), and total area (C) of peak area (A) and peak area (B), the value obtained by dividing peak area (B) by total area (C) is 8 area % or less, and epoxy resin compositions and cured products comprising the phosphorus-containing phenol compound as an essential ingredient.

Abstract: To provide phosphorus-containing epoxy resins and phosphorus-containing epoxy resin compositions having high levels of appearance, yield and economic efficiency and cured products thereof that are used for various applications. A phosphorus-containing phenol compound represented by Formula (3) obtained by reacting a compound represented by Formula (2) with a compound represented by Formula (1), wherein in the peak area (A) of the component represented by Formula (1) on a chromatogram measured under specific conditions by gel permeation chromatography, peak area (B) on the high-molecular-weight side of the component of Formula (1), and total area (C) of peak area (A) and peak area (B), the value obtained by dividing peak area (B) by total area (C) is 8 area % or less, and epoxy resin compositions and cured products comprising the phosphorus-containing phenol compound as an essential ingredient.

Abstract: A process for production a high purity epoxy compound with total chlorine content of 500 ppm or less is characterized in that alkali metal hydroxide is added to a bifunctional epoxy compound represented by the general formula (I), in which content of the component with n=0 is not less than 70% and less than 100%, and that reaction is caused to take place at a temperature of 95-150° C.

Abstract: For the purpose to provide a method to crystallize organic oligomer of low crystallizing speed without using a specific apparatus and without wasting huge energy, and to provide epoxy resin composition suited as the sealing material for semi-conductor containing the organic oligomer obtained by said method following method is found out. That is, the method for crystallization of organic oligomers comprising, after fluidizing powdered or granulated seed crystals of organic oligomer in an apparatus with powder stirring mechanism, pouring liquid of same crystallizable organic oligomer continuously or by batch into said apparatus so that to mix and disperse, then growing up crystals of the organic oligomer in said apparatus.

Abstract: A process for production a high purity epoxy compound with total chlorine content of 500 ppm or less is characterized in that alkali metal hydroxide is added to a bifunctional epoxy compound represented by the general formula (I), in which content of the component with n=0 is not less than 70% and less than 100%, and that reaction is caused to take place at a temperature of 95-150° C. to produce a multi-functional epoxy compound represented by the general formula (II).

Abstract: An ink jet recording sheet having an excellent jet ink-fixing property and heat-sealing property and capable of recording thereon ink images having excellent water resistance and light fastness has an ink receiving layer formed on a surface of a support sheet and including a binder and fine particles of a water-insoluble, amino group-containing resin having a total amine value of 5 to 500 and preferably a glass transition temperature of 15 to 250° C.

Abstract: This invention relates to a semiconductor encapsulating novolac type epoxy resin with the reduced stress, which is obtained by an addition reaction 1 to 15% of a novolac type epoxy resin of the following formula with a monohydric or dihydric aliphatic alcohol: ##STR1## (wherein R.sub.1 is hydrogen, halogen, alkyl, or aryl; R.sub.2 is selected from the group consisting of hydrogen, alkyl, aryl, or aryl having a substituent which may be glycidylether; and n is an integer not less than 0.

Abstract: An epoxy resin composition comprising an epoxy resin component containing at least 5% by weight of an epoxy resin of Formula [I], an epoxy hardener, and an inorganic filler as essential constituents: ##STR1## [wherein R and R.sup.1 denote alkyl of C.sub.2 to C.sub.6, and n is an integer repetition unit from 0 to 10.]. The epoxy resin composition, when used as a molding material, is low in water absorption rate and flexural modulus (low stress).