Patents by Inventor Hideyasu Nikaido

Hideyasu Nikaido has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame for IC having a wire bonding part composed of multi-layer structure of iron containing alloy, refractory metal and aluminum
    Patent number: 4791031
    Abstract: In a lead frame for an IC which is provided on a wire bonding part of the inner lead unit thereof with an aluminum coating, possible detrimental diffusion of the component elements of the lead frame into the aluminum coating can be effectively precluded by having a layer of a high melting point metal interposed between the lead substrate and the aluminum coating in the wire bonding part without appreciably increasing the cost of production.
    Type: Grant
    Filed: October 28, 1987
    Date of Patent: December 13, 1988
    Assignee: Sumitomo Metal Mining Co. Ltd.
    Inventor: Hideyasu Nikaido
  • Method for manufacture of aluminum-coated lead frame
    Patent number: 4604291
    Abstract: A lead frame with an Al coating which enjoys satisfactory tightness of adhesion and sufficiently low hardness is manufactured by a method, comprising the steps of covering the lead frame with a mask sheet possessing an opening for exposing an inner lead part of the lead frame, keeping the lead frame at a temperature in the range of 100.degree. to 240.degree. C. under a high degree of vacuum exceeding the level of 10.sup.-5 Torr, and depositing aluminum on the inner lead part by arc-discharge type ion plating.
    Type: Grant
    Filed: August 26, 1985
    Date of Patent: August 5, 1986
    Assignees: Tokai University, Sumitomo Metal Mining Company Limited
    Inventors: Yen-Ching Huang, Hideyasu Nikaido