Abstract: A management device of the present disclosure is used in a mounting system including multiple mounting-related devices each including a display section configured to visually notify an operator of information and an attachment portion to which a member is attached and related to a process of mounting a component on a processing target object, and a moving work device configured to move between the multiple mounting-related devices to automatically attach and detach the member to and from the attachment portion. The management device includes a management control section configured to, when a mounting-related device is in a restriction state in which work of the operator on the mounting-related device is not accepted due to movement of the moving work device, display a display mode indicating the restriction state on the display section of the corresponding mounting-related device to notify the operator of the restriction state.

Abstract: A system includes feeder storage that stores feeders to be replenished to multiple component mounters and feeders removed from each component mounter, automatic exchanging device to replenish a feeder taken from the feeder storage to each component mounter and collect a feeder removed from each component mounter to the feeder storage, and feeder management section that manages whether each feeder stored in the feeder storage is a feeder to be replenished or a feeder to be collected. State display section, being provided with each feeder on an end face part on a removal direction side or an upper end face part, is configured to display a state of the feeder, and the feeder management section displays whether each feeder stored in the feeder storage is the feeder to be replenished or the feeder to be collected, on the state display section of each feeder.

Abstract: A supply head of a die supply apparatus is detachably held by a head holding unit of a head moving mechanism. The supply head held by the head holding unit is replaceable with a supply head having the same number of nozzles as the number of nozzles of a mounting head of a component mounting machine. A nozzle arrangement of the supply head of the die supply apparatus has the same arrangement as a nozzle arrangement of the mounting head of the component mounting machine.

Abstract: A wafer component supply device supplying a wafer component and a feeder, such as a tape feeder supplying an electronic component, are set in a component mounting machine. When the wafer component is to be inverted and mounted on a circuit substrate, the wafer component supply device allows the wafer component present on an inverted supply head to be sucked by a mounting head of the component mounting machine at a position where the supply head and a stage are moved down by a vertical movement mechanism.

Abstract: A supply head of a die supply apparatus is detachably held by a head holding unit of a head moving mechanism. The supply head held by the head holding unit is replaceable with a supply head having the same number of nozzles as the number of nozzles of a mounting head of a component mounting machine. A nozzle arrangement of the supply head of the die supply apparatus has the same arrangement as a nozzle arrangement of the mounting head of the component mounting machine.

Abstract: A wafer component supply device supplying a wafer component and a feeder, such as a tape feeder supplying an electronic component, are set in a component mounting machine. When the wafer component is to be inverted and mounted on a circuit substrate, the wafer component supply device allows the wafer component present on an inverted supply head to be sucked by a mounting head of the component mounting machine at a position where the supply head and a stage are moved down by a vertical movement mechanism.