Patents by Inventor Hideyasu Teramoto

Hideyasu Teramoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11987036
    Abstract: A method for separating and recovering a layered film laminated and adhered with a reactive adhesive, the method including a step 1 of immersing the layered film in an alkaline solution while stirring the layered film with heating at 20° C. to 90° C. or ultrasonically vibrating the layered film and a step 2 of recovering separated single-layered films that constitute the respective layers of the layered film. The reactive adhesive is preferably a reactive adhesive containing a polyisocyanate composition and a polyol composition and more preferably a reactive adhesive containing a polyisocyanate composition, a polyol composition, and a compound having an acidic group.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: May 21, 2024
    Assignee: DIC CORPORATION
    Inventors: Shin-ichi Ohara, Yutaka Hamasuna, Hideoki Iwanami, Hideyasu Teramoto, Takashi Tamaoka, Yoshitomo Nagata, Yasuhiro Sente
  • Publication number: 20210178744
    Abstract: A method for separating and recovering a layered film laminated and adhered with a reactive adhesive, the method including a step 1 of immersing the layered film in an alkaline solution while stirring the layered film with heating at 20° C. to 90° C. or ultrasonically vibrating the layered film and a step 2 of recovering separated single-layered films that constitute the respective layers of the layered film. The reactive adhesive is preferably a reactive adhesive containing a polyisocyanate composition and a polyol composition and more preferably a reactive adhesive containing a polyisocyanate composition, a polyol composition, and a compound having an acidic group.
    Type: Application
    Filed: September 12, 2019
    Publication date: June 17, 2021
    Applicant: DIC Corporation
    Inventors: Shin-ichi Ohara, Yutaka Hamasuna, Hideoki Iwanami, Hideyasu Teramoto, Takashi Tamaoka, Yoshitomo Nagata, Yasuhiro Sente