Patents by Inventor Hideyo Osanai
Hideyo Osanai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11919288Abstract: To provide a heat radiation member having high durability that can favorably retain the thermal conductivity under application of heat cycles, suitable for mounting a semiconductor element of a power module. The heat radiation member includes a laminated structure including metal materials 21 and 22 and a carbon material 10 having the following property (A) bonded to each other; (A) in pressurizing one principal surface of a plate specimen having a thickness of 11 mm of the carbon material with nitrogen gas of 200 kPa, the carbon material having a gas permeability of the nitrogen gas permeating to the other principal surface with a flow rate of 5 L/min or more and 30 L/min or less per 0.01 m2 in terms of area of the pressurized principal surface, the pressurized principal surface having an area of 0.005 m2 or more.Type: GrantFiled: September 8, 2021Date of Patent: March 5, 2024Assignee: DOWA METALTECH CO., LTD.Inventors: Hideyo Osanai, Akira Sugawara
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Publication number: 20220367316Abstract: There is provided an inexpensive metal/ceramic bonding substrate which has a metal circuit plate of aluminum or an aluminum alloy bonded directly to a ceramic substrate and which can prevent a large difference in level from being caused on portions corresponding to the grain boundaries of aluminum or the aluminum alloy even if heat cycles are repeatedly applied to the metal/ceramic bonding substrate, and a method for producing the same.Type: ApplicationFiled: June 11, 2020Publication date: November 17, 2022Applicant: DOWA METALTECH CO., LTD.Inventors: Hideyo Osanai, Akira Sugawara
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Publication number: 20220080704Abstract: To provide a heat radiation member having high durability that can favorably retain the thermal conductivity under application of heat cycles, suitable for mounting a semiconductor element of a power module. The heat radiation member includes a laminated structure including metal materials 21 and 22 and a carbon material 10 having the following property (A) bonded to each other; (A) in pressurizing one principal surface of a plate specimen having a thickness of 11 mm of the carbon material with nitrogen gas of 200 kPa, the carbon material having a gas permeability of the nitrogen gas permeating to the other principal surface with a flow rate of 5 L/min or more and 30 L/min or less per 0.01 m2 in terms of area of the pressurized principal surface, the pressurized principal surface having an area of 0.005 m2 or more.Type: ApplicationFiled: September 8, 2021Publication date: March 17, 2022Inventors: Hideyo Osanai, Akira Sugawara
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Publication number: 20220032580Abstract: There are provide a metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing the same. The metal/ceramic bonding substrate is produced by a method including the steps of: arranging a ceramic substrate 10 in a mold 20; putting the mold 20 in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to ?45° C.Type: ApplicationFiled: February 10, 2020Publication date: February 3, 2022Applicant: DOWA METALTECH CO., LTD.Inventor: Hideyo Osanai
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Publication number: 20220033317Abstract: There is provided an aluminum/ceramic bonding substrate having a ceramic substrate, an aluminum plate of an aluminum alloy which is bonded directly to one side of the ceramic substrate, an aluminum base plate of the aluminum alloy which is bonded directly to the other side of the ceramic substrate, and a plate-shaped reinforcing member which has a higher strength than that of the aluminum base plate and which is arranged in the aluminum base plate to be bonded directly to the aluminum base plate, wherein the aluminum alloy contains 0.01 to 0.2% by weight of magnesium, 0.01 to 0.1% by weight of silicon, and the balance being aluminum and unavoidable impurities.Type: ApplicationFiled: July 23, 2021Publication date: February 3, 2022Applicants: DOWA METALTECH CO, LTD., Mitsubishi Electric CorporationInventors: Koji Kobayashi, Takuma Tsubota, Hideyo Osanai, Daisuke Oya
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Patent number: 11162745Abstract: A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.Type: GrantFiled: October 29, 2019Date of Patent: November 2, 2021Assignee: DOWA METALTECH CO., LTD.Inventors: Satoru Ideguchi, Hideyo Osanai, Hirotaka Kotani
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Patent number: 10619948Abstract: A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.Type: GrantFiled: September 25, 2013Date of Patent: April 14, 2020Assignee: DOWA METALTECH CO., LTD.Inventors: Satoru Ideguchi, Hideyo Osanai, Hirotaka Kotani
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Publication number: 20200083062Abstract: An electronic part mounting substrate includes: a metal plate 10 (for mounting thereon electronic parts) of aluminum or an aluminum alloy having a substantially rectangular planar shape, one major surface of the metal plate 10 being surface-processed so as to have a surface roughness of not less than 0.2 micrometers; a plating film 20 of nickel or a nickel alloy formed on the one major surface of the metal plate 10; an electronic part 14 bonded to the plating film 20 by a silver bonding layer 12 (containing a sintered body of silver); a ceramic substrate having a substantially rectangular planar shape, one major surface of the ceramic substrate 16 being bonded to the other major surface of the metal plate 10; and a radiating metal plate (metal base plate) 18 bonded to the other major surface of the ceramic substrate 16.Type: ApplicationFiled: November 12, 2019Publication date: March 12, 2020Applicant: DOWA METALTECH CO., LTD.Inventors: Naoya Sunachi, Hideyo Osanai, Satoru Kurita
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Publication number: 20200064087Abstract: A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.Type: ApplicationFiled: October 29, 2019Publication date: February 27, 2020Applicant: DOWA METALTECH CO., LTD.Inventors: Satoru Ideguchi, Hideyo Osanai, Hirotaka Kotani
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Patent number: 10510557Abstract: An electronic part mounting substrate includes: a metal plate 10 (for mounting thereon electronic parts) of aluminum or an aluminum alloy having a substantially rectangular planar shape, one major surface of the metal plate 10 being surface-processed so as to have a surface roughness of not less than 0.2 micrometers; a plating film 20 of nickel or a nickel alloy formed on the one major surface of the metal plate 10; an electronic part 14 bonded to the plating film 20 by a silver bonding layer 12 (containing a sintered body of silver); a ceramic substrate 16 having a substantially rectangular planar shape, one major surface of the ceramic substrate 16 being bonded to the other major surface of the metal plate 10; and a radiating metal plate (metal base plate) 18 bonded to the other major surface of the ceramic substrate 16.Type: GrantFiled: November 22, 2013Date of Patent: December 17, 2019Assignee: DOWA METALTECH CO., LTD.Inventors: Naoya Sunachi, Hideyo Osanai, Satoru Kurita
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Patent number: 9944565Abstract: After a wet blasting treatment for jetting a slurry, which contains spherical alumina as abrasive grains in a liquid, to the surface of a ceramic substrate 10 of aluminum nitride sintered body so that the ceramic substrate 10 has a residual stress of not higher than ?50 MPa and so that the surface of the ceramic substrate 10 to be bonded to the metal plate 14 has an arithmetic average roughness Ra of 0.15 to 0.30 ?m, a ten-point average roughness Rz of 0.7 to 1.1 ?m and a maximum height Ry of 0.9 to 1.Type: GrantFiled: November 20, 2012Date of Patent: April 17, 2018Assignees: DOWA METALTECH CO., LTD., TOKUYAMA CORPORATIONInventors: Hideyo Osanai, Yukihiro Kitamura, Hiroto Aoki, Yukihiro Kanechika, Ken Sugawara, Yasuko Takeda
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Patent number: 9831157Abstract: In a method for producing an electronic part mounting substrate wherein an electronic part 14 is mounted on one major surface (a surface to which the electronic part 14 is to be bonded) of the metal plate 10 of copper, or aluminum or the aluminum alloy (when a plating film 20 of copper is formed on the surface), the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) is surface-machined to be coarsened so as to have a surface roughness of not less than 0.4 ?m, and then, a silver paste is applied on the surface-machined major surface (or the surface-machined surface of the plating film 20 of copper) to arrange the electronic part 14 thereon to sinter silver in the silver paste to form a silver bonding layer 12 to bond the electronic part 14 to the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) with the silver bonding layer 12.Type: GrantFiled: September 2, 2014Date of Patent: November 28, 2017Assignee: Dowa Metaltech Co., Ltd.Inventors: Naoya Sunachi, Hideyo Osanai, Satoru Kurita
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Patent number: 9713253Abstract: A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.Type: GrantFiled: March 29, 2011Date of Patent: July 18, 2017Assignee: DOWA METALTECH CO., LTD.Inventors: Hideyo Osanai, Takayuki Takahashi, Satoru Ideguchi, Hirotaka Kotani
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Patent number: 9474146Abstract: A metal circuit board and a metal base plate are bonded to a ceramic substrate to form a metal-ceramic bonded substrate, then the metal base plate is arranged on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator, a jig having a concave R surface is arranged on another surface of the radiator with the jig butting against the another surface of the radiator, a jig having a convex R surface protruding toward the metal-ceramic bonded substrate is brought into contact with another surface of the metal circuit board, and the metal-ceramic bonded substrate and the radiator are heat-bonded while they are pressurized by the radiator side jig and the metal-ceramic bonded substrate side jig, wherein a curvature radius R (mm) of the convex R surface and the concave R surface is 6500?R?surface pressure (N/mm2)×2000+12000.Type: GrantFiled: March 13, 2013Date of Patent: October 18, 2016Assignees: NIPPON LIGHT METAL COMPANY, LTD., DOW A METALTECH CO., LTD.Inventors: Hisashi Hori, Takanori Kokubo, Hideyo Osanai, Kunihiko Chihara
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Publication number: 20160211195Abstract: In a method for producing an electronic part mounting substrate wherein an electronic part 14 is mounted on one major surface (a surface to which the electronic part 14 is to be bonded) of the metal plate 10 of copper, or aluminum or the aluminum alloy (when a plating film 20 of copper is formed on the surface), the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) is surface-machined to be coarsened so as to have a surface roughness of not less than 0.4 ?m, and then, a silver paste is applied on the surface-machined major surface (or the surface-machined surface of the plating film 20 of copper) to arrange the electronic part 14 thereon to sinter silver in the silver paste to form a silver bonding layer 12 to bond the electronic part 14 to the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) with the silver bonding layer 12.Type: ApplicationFiled: September 2, 2014Publication date: July 21, 2016Applicant: DOWA METALTECH CO., LTD.Inventors: Naoya Sunachi, Hideyo Osanai, Satoru Kurita
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Patent number: 9320129Abstract: There is provided a liquid-cooled integrated substrate 1 in which a metal circuit board 15 made of aluminum or an aluminum alloy is bonded to one surface of a ceramic substrate 10, one surface of a plate-like metal base plate 20 made of aluminum or an aluminum alloy is bonded to another surface of the ceramic substrate 10, and a liquid-cooling type radiator 30 composed of a porous pipe composed of an extrusion material is bonded to another flat surface of the metal base plate 20 by brazing, wherein a relation between a thickness t1 of the metal circuit board 15 and a thickness t2 of the metal base plate 20 satisfies t2/t1?2 where the thickness t1 of the metal circuit board 15 is 0.4 to 3 mm and the thickness t2 of the metal base plate 20 is 0.8 to 6 mm.Type: GrantFiled: January 12, 2011Date of Patent: April 19, 2016Assignees: Dowa Metaltech Co., Ltd., Nippon Light Metal Company, Ltd.Inventors: Hisashi Hori, Takanori Kokubo, Hideyo Osanai, Takayuki Takahashi, Kunihiko Chihara
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Publication number: 20150284296Abstract: After a wet blasting treatment for jetting a slurry, which contains spherical alumina as abrasive grains in a liquid, to the surface of a ceramic substrate 10 of aluminum nitride sintered body so that the ceramic substrate 10 has a residual stress of not higher than ?50 MPa and so that the surface of the ceramic substrate 10 to be bonded to the metal plate 14 has an arithmetic average roughness Ra of 0.15 to 0.30 ?m, a ten-point average roughness Rz of 0.7 to 1.1 ?m and a maximum height Ry of 0.9 to 1.Type: ApplicationFiled: November 20, 2012Publication date: October 8, 2015Applicants: TOKUYAMA CORPORATION, DOWA METALTECH CO., LTDInventors: Hideyo Osanai, Yukihiro Kitamura, Hiroto Aoki, Yukihiro Kanechika, Ken Sugawara, Yasuko Takeda
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Publication number: 20150041187Abstract: A metal circuit board and a metal base plate are bonded to a ceramic substrate to form a metal-ceramic bonded substrate, then the metal base plate is arranged on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator, a jig having a concave R surface is arranged on another surface of the radiator with the jig butting against the another surface of the radiator, a jig having a convex R surface protruding toward the metal-ceramic bonded substrate is brought into contact with another surface of the metal circuit board, and the metal-ceramic bonded substrate and the radiator are heat-bonded while they are pressurized by the radiator side jig and the metal-ceramic bonded substrate side jig, wherein a curvature radius R (mm) of the convex R surface and the concave R surface is 6500?R?surface pressure (N/mm2)×2000+12000.Type: ApplicationFiled: March 13, 2013Publication date: February 12, 2015Applicant: Nippon Light Metal Company, Ltd.Inventors: Hisashi Hori, Takanori Kokubo, Hideyo Osanai, Kunihiko Chihara
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Patent number: 8927873Abstract: There is provide a manufacturing method of a fin-integrated substrate capable of producing by simple process a fin-integrated substrate with heat radiating fins at fine pitches by a processing method in which warpage of a metal base plate and corrugation (wavy shape) of the heat radiating fins are suppressed. There is provided a manufacturing method of a fin-integrated substrate in which bonding of the metal circuit board to the ceramic substrate is performed by a molten metal bonding method, and formation of the plurality of heat radiating fins at a cut part that is a part of the metal base plate is performed by fixing by a jig to apply a tensile stress on a surface of the cut part where the heat radiating fins are to be formed, and performing grooving processing of forming a plurality of grooves by moving a multi-cutter composed of a plurality of stacked disc-shaped cutters, on the surface to which the tensile stress is applied, while rotating the multi-cutter.Type: GrantFiled: January 12, 2011Date of Patent: January 6, 2015Assignees: Dowa Metaltech Co., Ltd, Nippon Light Metal Company, Ltd.Inventors: Hisashi Hori, Hideyo Osanai, Takayuki Takahashi
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Patent number: 8745841Abstract: There is provided an aluminum bonding member capable of being simply and inexpensively produced and capable of being used as a cooling member having a high cooling power. The aluminum bonding member 10 has an aluminum member 12 of aluminum or an aluminum alloy exposed to the outside, and a tubular member 14 of a material which does not melt at a temperature close to the melting point of aluminum or the aluminum alloy. Both of the opening end portions of the tubular member 14 are open to the outside of the aluminum member 12. A portion of the tubular member 14 between the opening end portions extends in the aluminum member 12, and the outer peripheral surface of the portion of the tubular member 14 extending in the aluminum member 12 is bonded directly to the aluminum member 12.Type: GrantFiled: February 24, 2012Date of Patent: June 10, 2014Assignee: Dowa Metaltech Co., Ltd.Inventor: Hideyo Osanai