Abstract: A wafer holder 10 includes a resin adhesive layer 16 between a ceramic electrostatic chuck 12 and a metal cooling plate 14. The adhesive layer 16 includes a first layer 16a in contact with the electrostatic chuck 12, a second layer 16b in contact with the cooling plate 14, and an intermediate layer 16c located between the first layer 16a and the second layer 16b. Heat resistance of each of the first layer 16a and the intermediate layer 16c is higher than heat resistance of the second layer 16b, flexibility of the second layer 16b is higher than flexibility of each of the first layer 16a and the intermediate layer 16c, and the layers are in hermetic contact with each other.

Abstract: A wafer holder 10 includes a resin adhesive layer 16 between a ceramic electrostatic chuck 12 and a metal cooling plate 14. The adhesive layer 16 includes a first layer 16a in contact with the electrostatic chuck 12, a second layer 16b in contact with the cooling plate 14, and an intermediate layer 16c located between the first layer 16a and the second layer 16b. Heat resistance of each of the first layer 16a and the intermediate layer 16c is higher than heat resistance of the second layer 16b, flexibility of the second layer 16b is higher than flexibility of each of the first layer 16a and the intermediate layer 16c, and the layers are in hermetic contact with each other.

Abstract: A heating device has a ceramic base with a heating surface, and a heating body embedded in the ceramic base. The heating device includes a thermal conductive member positioned between the heating surface and the heating body in the ceramic base. The thermal conductive member has a thermal conductivity that is higher than the ceramic base and as such, the heating device achieves superior temperature uniformity of a heated object particularly in a semiconductor device manufacturing process.

Abstract: The power-supplying member comprises: a first rod-shaped member connected to at least one of a heating resistor and an electrode; a second rod-shaped member connected to a power supply; and a thermal-function member, which is disposed between the first rod-shaped member and the second rod-shaped member, and which has a smaller axial cross section area and a larger surface area as compared to the first and second rod-shaped members.

Abstract: A plasma processing member includes a ceramic base, a plasma generating electrode embedded in the ceramic base, and an electrode power supply member connected to the plasma generating electrode. The impedance of the plasma processing member when plasma is generated using high frequency power at a frequency higher than 13.56 MHz is adjusted to 25? or less.

Abstract: An electrostatic chuck includes a ceramic base having an electrode embedded in vicinity to a holding face for holding a substrate. On a back side of this ceramic base, provided are a terminal connected to the electrode, a wafer temperature control member, and an insulating member for insulating the temperature control member from the terminal. This insulating member has a flange portion on its end portion in contact with the ceramic base, and is made of highly thermal conductive ceramics.

Abstract: A heating apparatus 10 includes a ceramic base 11 having a heating surface 11a and provided with a resistance heating body 12 embedded therein, and a temperature adjusting member 21 fixedly fastened proximal to a back surface of the ceramic base 11. A heat conductive member 14 having a thermal conductivity higher than the ceramic base 11 is provided between the heating surface of the ceramic base 11 and the resistance heating body 12. A gas is introduced to an air gap 31 between the ceramic base 11 and the temperature adjusting member 21 while controlling the gas pressure.

Abstract: A power-supplying member comprises: a first rod-shaped member connected to power-supplied object; a second rod-shaped member connected to power supply; and a thermal-expansion absorbing member, which is disposed between the first rod-shaped member and the second rod-shaped member, and which shrinks in a longitudinal direction in response to changes in shape of the first rod-shaped member and the second rod-shaped member in the longitudinal direction due to thermal expansion.

Abstract: An electrostatic chuck includes; a base made of ceramics, in which an electrode generating electrostatic attractive force is embedded; a cooling member which contains metal; a bonding material which bonds the base and the cooling member to each other; a gas providing passage which penetrates the base, the bonding material, and the cooling member; and an engagement member and a bolt member, which are fixing members mechanically fixing the base and the cooling member to each other.

Abstract: A heating device has a ceramic base with a heating surface, and a heating body embedded in the ceramic base. The heating device includes a thermal conductive member between the heating surface and the heating body in the ceramic base. The thermal conductive member has thermal conductivity higher than the ceramic base. The present, heating device achieves superior temperature uniformity of a heated object, particularly in the semiconductor device manufacturing process.

Abstract: An electrostatic chuck includes a ceramic base having an electrode embedded in vicinity to a holding face for holding a substrate. On a back side of this ceramic base, provided are a terminal connected to the electrode, a wafer temperature control member, and an insulating member for insulating the temperature control member from the terminal. This insulating member has a flange portion on its end portion in contact with the ceramic base, and is made of highly thermal conductive ceramics.

Abstract: A substrate heating apparatus includes a ceramic base having a concave heating surface on which a substrate is placed, and a resistance heating element buried in the ceramic base. The central part of the concave heating surface defines the lowest point of the heating surface and the peripheral part of the concave heating surface defines the highest point of the heating surface.

Abstract: A substrate heating apparatus is provided, including a base group including a plurality of bases, which are arranged substantially into a plate with a gap interposed between the bases, and which form a substrate mounting surface. A resistance heating element provided for at least one of the bases.

Abstract: An electrostatic chuck includes: a base body; an electrode formed on the base body and generating coulomb force; and a dielectric layer formed on the base body and electrode, having a plurality of projections on a first main face on the side supporting a substrate attracted by the coulomb force, and supporting the substrate on the upper surfaces of these projections. The projections are arranged at substantially uniform intervals. The surface roughness (Ra) of the projection upper faces is 0.5 ?m or smaller. The height of the projections is 5 to 20 ?m. The relation A1/2×B2>200 is satisfied where A (number/100 cm2) is the number of the projections per unit area of 100 cm2 in the first main face, and B (?m) is the height of the projections.

Abstract: The present invention provides members that are provided around a susceptor for mounting a semiconductor in a chamber for a semiconductor production system. Each member has a function of independently generating heat to heat the semiconductor, at least by radiation, and preferably, a heat generating element is embedded in each member.

Abstract: A substrate heating device is provided, including a ceramic base plate having a heating surface on which a substrate is placed, resistance heating elements buried in the ceramic base plate corresponding to a plurality of zones into which the heating surface is divided, terminals respectively connected to the resistance heating elements, and lead wires respectively connected to the terminals and wired on an outer surface of the ceramic base plate other than the heating surface.

Abstract: A member provided around a susceptor for mounting a semiconductor in a chamber of a semiconductor production system. The member has a face opposing the susceptor and a center line average surface roughness of the face opposing the susceptor is 0.5 ?m or less. Alternatively, the face opposing the susceptor has a thermal emissivity ? of 0.5 or lower. The member can also be a liner [4] having a supported face [4] whose area is not more than 20 percent of that of the face [4] opposing the susceptor.

Abstract: An electrostatic chuck includes; a base made of ceramics, in which an electrode generating electrostatic attractive force is embedded; a cooling member which contains metal; a bonding material which bonds the base and the cooling member to each other; a gas providing passage which penetrates the base, the bonding material, and the cooling member; and an engagement member and a bolt member, which are fixing members mechanically fixing the base and the cooling member to each other.

Abstract: The power-supplying member comprises: a first rod-shaped member connected to power-supplied object; a second rod-shaped member connected to power supply; and a thermal-function member, which is disposed between the first rod-shaped member and the second rod-shaped member, and which has a smaller axial cross section area and a larger surface area as compared to the first and second rod-shaped members.

Abstract: An object of the present invention is to provide a heating system having a ceramic heater and a supporting member supporting the back face of the heater, so that the cost of the supporting member can be reduced, the design change of the heater is made easier and excellent flatness of the heating face on use can be maintained. The heating system has a ceramic substrate 1 having a heating face 1a and a back face 1b, a heating means 4 for generating heat from the heating face 1a of the substrate 1, a metal supporting member 6 supporting the back face 1b of the substrate 1, and a heat insulating plate 5 provided between the back face 1b of the substrate 1 and the supporting member 6.