Abstract: A wire bonding apparatus includes a bonding tool having a pressing surface for pressing a wire onto a surface to be joined to the wire and a wire feeding hole open to the pressing surface; a wire feeder for feeding the wire outside of the bonding tool through the wire feeding hole; and a magnet for applying an attraction force to a wire tip end protruding from the wire feeding hole, to bend and hold the wire tip end towards the pressing surface.

Abstract: A semiconductor device of the present invention includes an inner lead, a first ball formed on the inner lead, a bonding pad formed on a semiconductor device, a second ball formed on the bonding pad, and a bonding wire connecting the first and second balls. The second ball is formed by mechanically deforming the bonding wire.

Abstract: A wire bonding apparatus includes a bonding tool having a pressing surface for pressing a wire onto a surface to be joined and a wire feeding hole being open to the pressing surface; a wire feeding means for feeding the wire to an outside of the bonding tool through the wire feeding hole; and an attracting and holding means for applying an attraction force to a wire tip end part that is protruded from the wire feeding hole, thereby to bend and hold the wire tip end part towards the pressing surface.

Abstract: A method for manufacturing expandable styrene type polymer particles is disclosed, which comprises the steps of adding a styrene type monomer to styrene type polymer seed particles suspended in an aqueous dispersing medium, continuously or intermittently to be polymerized while being absorbed thereby, and impregnating the resulting polymer particles with an easily volatile blowing agent to obtain expandable styrene type polymer particles, the improvement wherein styrene type polymer particles whose weight-average molecular weight (Mw.sub.1) is not more than 2/3 of the weight-average molecular weight (Mw.sub.2) of the resulting polymer particles are used as said styrene type polymer particles. The present invention provides expandable styrene type polymer particles excellent in moldability and foamed articles high in strength and fine in external appearance.

Abstract: A method of producing a polymer or copolymer solution of vinyl chloride series, wherein polymerization of 100 parts by weight of a monomer mixture of at least 50 weight percent of vinyl chloride and less than 50 weight percent of one or more monomers copolymerizable therewith is carried out in a solvent mixture consisting essentially of 30 to 55 weight percent water, remainder N,N-dimethyl formamide, in the presence of 0.5 to 5 parts by weight of a salt of a monomeric compound having a sulphonic acid group and using an initiator for radical polymerization.

Abstract: A modifier for vinylidene chloride resin which is produced by polymerizing 50 to 20 parts by weight of a vinyl monomer mixture comprising 0 to 60 weight percent methyl methacrylate, 0 to 30 weight percent acrylic acid ester and more than 20 weight percent aromatic vinyl monomer, in the presence of 50 to 80 parts by weight of a rubber latex consisting essentially of ethylene-vinyl acetate copolymer containing 50 to 80 weight percent vinyl acetate.