Patents by Inventor Hideyuki Chaki

Hideyuki Chaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin molding material for sealing use and semiconductor device
    Patent number: 7397139
    Abstract: An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 ?m or less and a specific surface area of 3.0 m2/g or more.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: July 8, 2008
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Ryoichi Ikezawa, Naoki Nara, Hideyuki Chaki, Yoshihiro Mizukami, Yoshinori Endou, Takaki Kashihara, Fumio Furusawa, Masaki Yoshii, Shinsuke Hagiwara, Mitsuo Katayose
  • Epoxy resin molding material for sealing use and semiconductor device
    Publication number: 20060214153
    Abstract: 1. An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 ?m or less and a specific surface area of 3.0 m2/g or more.
    Type: Application
    Filed: April 7, 2004
    Publication date: September 28, 2006
    Inventors: Ryoichi Ikezawa, Naoki Nara, Hideyuki Chaki, Yoshihiro Mizukami, Yoshinori Endou, Takaki Kashihara, Fumio Furusawa, Masaki Yoshii, Shinsuke Hagiwara, Mitsuo Katayose