Patents by Inventor Hideyuki Ebine

Hideyuki Ebine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8346497
    Abstract: The invention provides a method for testing a semiconductor film, a manufacturing method of a semiconductor film, a laser crystallization method, a laser crystallization device, and a laser crystallization system, for testing a laser crystallized semiconductor film, which require less time, have sufficient reliability, are excellent in cost management and applicable to mass production. In the method for testing a semiconductor film having an improved crystallinity by irradiating an energy light, the tested semiconductor film is photographed in a dark field digital image and then the luminance of the digital image is calculated by a computer in a constant direction for testing.
    Type: Grant
    Filed: March 25, 2004
    Date of Patent: January 1, 2013
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Hidekazu Miyairi, Hideyuki Ebine
  • Patent number: 8207915
    Abstract: It is provided a display device that prevents, when applying a reverse bias, an anode line and a power supply line included in a signal line driver circuit from being short-circuited, and a driving method thereof. According to the invention, a reverse bias applying circuit is provided in a scan line driver circuit or a signal line driver circuit, a signal from the reverse bias applying circuit is supplied to a transistor disposed between a signal line and an anode line, and thereby the transistor is turned off. The reverse bias applying circuit comprises an analog switch or a clocked inverter and a biasing transistor, and drives so as to invert potentials of the anode line and a cathode line and apply a reverse bias to a light emitting element, while turn off the analog switch and turn on the biasing transistor. Then, a potential of the anode line becomes equal to that of a scan line, and thereby turning off the transistor between the anode line and the signal line assuredly.
    Type: Grant
    Filed: May 12, 2008
    Date of Patent: June 26, 2012
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Mitsuaki Osame, Aya Anzai, Tomoyuki Iwabuchi, Hideyuki Ebine
  • Patent number: 8044501
    Abstract: A contact that takes a structure to laminate a protective conductive film over a metal film has a high hardness of the protective conductive film; therefore, a damage of contact surface made by contacting with an electrode of an inspection apparatus can be prevented in an inspection before boding FPC. However, the protective conductive film has higher resistivity compared to the metal film; therefore, contact resistivity with FPC gets higher, and power consumption gets bigger in the condition of using the display device.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: October 25, 2011
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Hideyuki Ebine
  • Patent number: 7619258
    Abstract: In a light emitting device using a light emitting element, the invention provides a sealing structure capable of preventing ingress of moisture from the outside and obtaining adequate reliability. The light emitting device has a light emitting element comprising a light emitting layer formed between a first electrode and a second electrode and a pixel portion comprising the light emitting element. The entire surface of the pixel portion is covered with the second electrode. An impermeable insulating film is formed in contact with the first electrode of the light emitting element. The edge of the first electrode and the impermeable insulating film are covered with a partition wall. An opening is formed along the circumference of the pixel portion in the partition wall. The opening passes through the partition wall in the thickness direction, and the side wall and the bottom face thereof are covered with the second electrode.
    Type: Grant
    Filed: March 10, 2005
    Date of Patent: November 17, 2009
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kaoru Tsuchiya, Hideyuki Ebine, Masayuki Sakakura, Takeshi Nishi, Yoshiharu Hirakata
  • Publication number: 20090213045
    Abstract: It is provided a display device that prevents, when applying a reverse bias, an anode line and a power supply line included in a signal line driver circuit from being short-circuited, and a driving method thereof. According to the invention, a reverse bias applying circuit is provided in a scan line driver circuit or a signal line driver circuit, a signal from the reverse bias applying circuit is supplied to a transistor disposed between a signal line and an anode line, and thereby the transistor is turned off. The reverse bias applying circuit comprises an analog switch or a clocked inverter and a biasing transistor, and drives so as to invert potentials of the anode line and a cathode line and apply a reverse bias to a light emitting element, while turn off the analog switch and turn on the biasing transistor. Then, a potential of the anode line becomes equal to that of a scan line, and thereby turning off the transistor between the anode line and the signal line assuredly.
    Type: Application
    Filed: May 12, 2008
    Publication date: August 27, 2009
    Applicant: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Mitsuaki Osame, Aya Anzai, Tomoyuki Iwabuchi, Hideyuki Ebine
  • Publication number: 20080170196
    Abstract: A contact that takes a structure to laminate a protective conductive film over a metal film has a high hardness of the protective conductive film; therefore, a damage of contact surface made by contacting with an electrode of an inspection apparatus can be prevented in an inspection before boding FPC. However, the protective conductive film has higher resistivity compared to the metal film; therefore, contact resistivity with FPC gets higher, and power consumption gets bigger in the condition of using the display device.
    Type: Application
    Filed: March 20, 2008
    Publication date: July 17, 2008
    Inventor: Hideyuki Ebine
  • Patent number: 7385573
    Abstract: It is provided a display device that prevents, when applying a reverse bias, an anode line and a power supply line included in a signal line driver circuit from being short-circuited, and a driving method thereof. According to the invention, a reverse bias applying circuit is provided in a scan line driver circuit or a signal line driver circuit, a signal from the reverse bias applying circuit is supplied to a transistor disposed between a signal line and an anode line, and thereby the transistor is turned off. The reverse bias applying circuit comprises an analog switch or a clocked inverter and a biasing transistor, and drives so as to invert potentials of the anode line and a cathode line and apply a reverse bias to a light emitting element, while turn off the analog switch and turn on the biasing transistor. Then, a potential of the anode line becomes equal to that of a scan line, and thereby turning off the transistor between the anode line and the signal line assuredly.
    Type: Grant
    Filed: March 25, 2004
    Date of Patent: June 10, 2008
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Mitsuaki Osame, Aya Anzai, Tomoyuki Iwabuchi, Hideyuki Ebine
  • Patent number: 7361027
    Abstract: A contact that takes a structure to laminate a protective conductive film over a metal film has a high hardness of the protective conductive film; therefore, a damage of contact surface made by contacting with an electrode of an inspection apparatus can be prevented in an inspection before boding FPC. However, the protective conductive film has higher resistivity compared to the metal film; therefore, contact resistivity with FPC gets higher, and power consumption gets bigger in the condition of using the display device.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: April 22, 2008
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Hideyuki Ebine
  • Publication number: 20050218396
    Abstract: In a light emitting device using a light emitting element, the invention provides a sealing structure capable of preventing ingress of moisture from the outside and obtaining adequate reliability. The light emitting device has a light emitting element comprising a light emitting layer formed between a first electrode and a second electrode and a pixel portion comprising the light emitting element. The entire surface of the pixel portion is covered with the second electrode. An impermeable insulating film is formed in contact with the first electrode of the light emitting element. The edge of the first electrode and the impermeable insulating film are covered with a partition wall. An opening is formed along the circumference of the pixel portion in the partition wall. The opening passes through the partition wall in the thickness direction, and the side wall and the bottom face thereof are covered with the second electrode.
    Type: Application
    Filed: March 10, 2005
    Publication date: October 6, 2005
    Inventors: Kaoru Tsuchiya, Hideyuki Ebine, Masayuki Sakakura, Takeshi Nishi, Yoshiharu Hirakata
  • Publication number: 20050017928
    Abstract: It is provided a display device that prevents, when applying a reverse bias, an anode line and a power supply line included in a signal line driver circuit from being short-circuited, and a driving method thereof. According to the invention, a reverse bias applying circuit is provided in a scan line driver circuit or a signal line driver circuit, a signal from the reverse bias applying circuit is supplied to a transistor disposed between a signal line and an anode line, and thereby the transistor is turned off. The reverse bias applying circuit comprises an analog switch or a clocked inverter and a biasing transistor, and drives so as to invert potentials of the anode line and a cathode. line and apply a reverse bias to a light emitting element, while turn off the analog switch and turn on the biasing transistor. Then, a potential of the anode line becomes equal to that of a scan line, and thereby turning off the transistor between the anode line and the signal line assuredly.
    Type: Application
    Filed: March 25, 2004
    Publication date: January 27, 2005
    Applicant: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Mitsuaki Osame, Aya Anzai, Tomoyuki Iwabuchi, Hideyuki Ebine
  • Publication number: 20040254769
    Abstract: The invention provides a method for testing a semiconductor film, a manufacturing method of a semiconductor film, a laser crystallization method, a laser crystallization device, and a laser crystallization system, for testing a laser crystallized semiconductor film, which require less time, have sufficient reliability, are excellent in cost management and applicable to mass production. In the method for testing a semiconductor film having an improved crystallinity by irradiating an energy light, the tested semiconductor film is photographed in a dark field digital image and then the luminance of the digital image is calculated by a computer in a constant direction for testing.
    Type: Application
    Filed: March 25, 2004
    Publication date: December 16, 2004
    Applicant: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Hidekazu Miyairi, Hideyuki Ebine
  • Publication number: 20040135258
    Abstract: A contact that takes a structure to laminate a protective conductive film over a metal film has a high hardness of the protective conductive film; therefore, a damage of contact surface made by contacting with an electrode of an inspection apparatus can be prevented in an inspection before boding FPC. However, the protective conductive film has higher resistivity compared to the metal film; therefore, contact resistivity with FPC gets higher, and power consumption gets bigger in the condition of using the display device.
    Type: Application
    Filed: December 19, 2003
    Publication date: July 15, 2004
    Applicant: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Hideyuki Ebine