Patents by Inventor Hideyuki Ikenoya

Hideyuki Ikenoya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Phosphorized copper anode for electroplating
    Patent number: 6783611
    Abstract: A phosphorized copper anode used for electroplating, including: 20-800 ppm of phosphorus; between 0.1 and less than 2 ppm of oxygen, and the balance being high purity copper having a purity of 99.9999% by mass or higher, wherein the average grain size of the copper anode after recrystallization is in the range between about 10 and 50 &mgr;m.
    Type: Grant
    Filed: March 12, 2002
    Date of Patent: August 31, 2004
    Assignee: Mitsubishi Materials Corporation
    Inventors: Kenji Yajima, Akihiro Kakimoto, Hideyuki Ikenoya
  • Phosphorized copper anode for electroplating
    Publication number: 20030029527
    Abstract: A phosphorized copper anode used for electroplating, including: 20-800 ppm of phosphorus; between 0.1 and less than 2 ppm of oxygen, and the balance being high purity copper having a purity of 99.9999% by mass or higher, wherein the average grain size of the copper anode after recrystallization is in the range between about 10 and 50 &mgr;m.
    Type: Application
    Filed: March 12, 2002
    Publication date: February 13, 2003
    Inventors: Kenji Yajima, Akihiro Kakimoto, Hideyuki Ikenoya