Abstract: A method to manufacture a liquid crystal display device including the steps of: forming contact holes 400, 401 in signal line-broken end portions 1020, 1021 of a signal line 102 in question with respect to a broken portion 20 lying in the signal line 102 in the condition where a center portion of each contact hole is made to deviate from a center portion of the signal line 102 in the direction of the width thereof; filling the contact holes with tungsten; and forming a tungsten line 50 to cover the tungsten-filled contact holes 500, 501 and the broken portion 20.

Abstract: A liquid crystal display device is equipped with an annular redundant wire that is formed to be nearer to the edge side of the array substrate than the respective outermost lines of plural scan lines and plural signal lines on the array substrate, surround all the scan lines and all the signal lines and cross each signal line through an insulating layer at two places. At least one of the signal lines has a wire-broken portion, and the redundant wire has recess portions at the two cross portions at which the redundant wire crosses the signal line having the wire-broken portion. The recess portions are embedded with a conductive material to thereby electrically connecting the redundant wire and the signal line having the wire-broken portion.

Abstract: A method to manufacture a liquid crystal display device including the steps of: forming contact holes 400, 401 in signal line-broken end portions 1020, 1021 of a signal line 102 in question with respect to a broken portion 20 lying in the signal line 102 in the condition where a center portion of each contact hole is made to deviate from a center portion of the signal line 102 in the direction of the width thereof; filling the contact holes with tungsten; and forming a tungsten line 50 to cover the tungsten-filled contact holes 500, 501 and the broken portion 20.

Abstract: A metal thin film by laser CVD, or an opaque film 30, by micro-jet application of an organic resin containing either one or both of black pigment and dye, is formed on the outer side of a substrate 200 or a substrate 900 at a position corresponding to a light point defect detected in image inspection after panel assembling step or after mounting step, to convert into a black point, and therefore by converting the light point defect into a black point, the yield is enhanced.