Patents by Inventor Hideyuki Katagi

Hideyuki Katagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10988585
    Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: April 27, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Tomoo Nishiyama, Yoshitaka Takezawa, Hideyuki Katagi, Kazuya Kiguchi
  • Patent number: 10941241
    Abstract: The present disclosure provides: an epoxy resin molding material including; an epoxy resin having a mesogen structure, a phenolic curing agent, an inorganic filler, and a curing accelerator having a quaternary phosphonium cation represented by the following Formula (I); a molded product and a molded cured product using the epoxy resin molding material; and a method for producing a molded cured product. In Formula (I), each of Ra to Rd independently represents an alkyl group having from 1 to 6 carbon atoms, or an aryl group, and the alkyl group and the aryl group may have a substituent.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: March 9, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Kenji Tanaka, Yuka Yoshida, Shinichi Kosugi, Shingo Tanaka, Hideyuki Katagi, Haruaki Sue, Yoshitaka Takezawa
  • Patent number: 10934387
    Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: March 2, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hideyuki Katagi, Kenji Tanaka, Yoshitaka Takezawa, Haruaki Sue, Shinichi Kosugi
  • Publication number: 20210054136
    Abstract: Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each R5 independently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3.
    Type: Application
    Filed: March 9, 2017
    Publication date: February 25, 2021
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Hideyuki KATAGI, Naoki MARUYAMA, Yuka YOSHIDA, Tomoko HIGASHIUCHI, Yoshitaka TAKEZAWA
  • Publication number: 20200392282
    Abstract: An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing.
    Type: Application
    Filed: February 18, 2019
    Publication date: December 17, 2020
    Inventors: Naoki MARUYAMA, Tomoko HIGASHIUCHI, Kazumasa FUKUDA, Hideyuki KATAGI, Yuki NAKAMURA, Yoshitaka TAKEZAWA
  • Publication number: 20200325398
    Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of ??2/??1 equal to 3 or less, wherein is an initial dynamic shear viscosity (Pa·s) and ??2 is a maximum value of dynamic shear viscosity (Pa·s), in a measurement of dynamic shear viscosity.
    Type: Application
    Filed: April 9, 2019
    Publication date: October 15, 2020
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Tomoko HIGASHIUCHI, Naoki MARUYAMA, Kazumasa FUKUDA, Yoshitaka TAKEZAWA, Hideyuki KATAGI, Yuki NAKAMURA
  • Publication number: 20200223994
    Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.
    Type: Application
    Filed: August 25, 2016
    Publication date: July 16, 2020
    Inventors: Tomoo NISHIYAMA, Yoshitaka TAKEZAWA, Hideyuki KATAGI, Kazuya KIGUCHI
  • Patent number: 10662279
    Abstract: Provided is an epoxy resin composition including an epoxy resin and a curing agent, in which the epoxy resin contains a multimeric compound having at least one selected from the group consisting of a structural unit represented by the following Formula (IA) and a structural unit represented by the following Formula (IB), the multimeric compound contains a dimeric compound containing two structural units represented by the following Formula (II) in one molecule, and a ratio of the dimeric compound is from 15% by mass to 28% by mass with respect to the epoxy resin as a whole.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: May 26, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yuka Yoshida, Kenji Tanaka, Hideyuki Katagi, Yoshihiro Amano, Shinichi Kosugi, Haruaki Sue, Yoshitaka Takezawa
  • Publication number: 20190256643
    Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
    Type: Application
    Filed: May 1, 2019
    Publication date: August 22, 2019
    Inventors: Hideyuki KATAGI, Kenji TANAKA, Yoshitaka TAKEZAWA, Haruaki SUE, Shinichi KOSUGI
  • Publication number: 20190055344
    Abstract: The present disclosure provides: an epoxy resin molding material including; an epoxy resin having a mesogen structure, a phenolic curing agent, an inorganic filler, and a curing accelerator having a quaternary phosphonium cation represented by the following Formula (I); a molded product and a molded cured product using the epoxy resin molding material; and a method for producing a molded cured product. In Formula (I), each of Ra to Rd independently represents an alkyl group having from 1 to 6 carbon atoms, or an aryl group, and the alkyl group and the aryl group may have a substituent.
    Type: Application
    Filed: August 25, 2016
    Publication date: February 21, 2019
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kenji TANAKA, Yuka YOSHIDA, Shinichi KOSUGI, Shingo TANAKA, Hideyuki KATAGI, Haruaki SUE, Yoshitaka TAKEZAWA
  • Publication number: 20190040183
    Abstract: Provided is an epoxy resin composition including an epoxy resin and a curing agent, in which the epoxy resin contains a multimeric compound having at least one selected from the group consisting of a structural unit represented by the following Formula (IA) and a structural unit represented by the following Formula (IB), the multimeric compound contains a dimeric compound containing two structural units represented by the following Formula (II) in one molecule, and a ratio of the dimeric compound is from 15% by mass to 28% by mass with respect to the epoxy resin as a whole.
    Type: Application
    Filed: August 25, 2016
    Publication date: February 7, 2019
    Inventors: Yuka YOSHIDA, Kenji TANAKA, Hideyuki KATAGI, Yoshihiro AMANO, Shinichi KOSUGI, Haruaki SUE, Yoshitaka TAKEZAWA
  • Publication number: 20180009979
    Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.
    Type: Application
    Filed: September 20, 2017
    Publication date: January 11, 2018
    Inventors: Tomoo NISHIYAMA, Haruaki SUE, Hideyuki KATAGI, Naoki HARA, Hiroyuki TAKAHASHI, Yasuo MIYAZAKI, Yoshitaka TAKEZAWA, Hiroyuki TANAKA, Kensuke YOSHIHARA, Masayoshi JOUMEN
  • Publication number: 20170349695
    Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
    Type: Application
    Filed: December 25, 2015
    Publication date: December 7, 2017
    Inventors: Hideyuki KATAGI, Kenji TANAKA, Yoshitaka TAKEZAWA, Haruaki SUE, Shinichi KOSUGI
  • Patent number: 9349931
    Abstract: The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, and the filler contains boron nitride particles having particle sizes of from 10 ?m to 100 ?m. In the general Formula (I), R1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R2 and R3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: May 24, 2016
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Tomoo Nishiyama, Atsushi Kuwano, Toshiaki Shirasaka, Naoki Hara, Kensuke Yoshihara, Hideyuki Katagi
  • Patent number: 9075307
    Abstract: The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, according to the invention, comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a phenol compound, (C) a compound having at least one ethylenically unsaturated group in each molecule, (D) a photopolymerization initiator and (E) inorganic fine particles.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: July 7, 2015
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kazuhiko Kurafuchi, Toshizumi Yoshino, Hideyuki Katagi, Masaya Ookawa, Yoshiaki Fuse
  • Publication number: 20140283972
    Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.
    Type: Application
    Filed: June 5, 2014
    Publication date: September 25, 2014
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomoo NISHIYAMA, Haruaki SUE, Hideyuki KATAGI, Naoki HARA, Hiroyuki TAKAHASHI, Yasuo MIYAZAKI, Yoshitaka TAKEZAWA, Hiroyuki TANAKA, Kensuke YOSHIHARA, Masayoshi JOUMEN
  • Publication number: 20140248504
    Abstract: The present invention provides a resin composition, including: a filler that includes alumina particles and boron nitride particles; an elastomer having a weight-average molecular weight of from 10,000 to 100,000; and a curable resin. The present invention also provides a resin sheet, a cured resin sheet, a resin-adhered metal foil and a heat dissipation device, which are formed by using the resin composition.
    Type: Application
    Filed: February 17, 2012
    Publication date: September 4, 2014
    Inventors: Shihui Song, Yukihiko Yamashita, Yoshitaka Takezawa, Hideyuki Katagi
  • Publication number: 20140015000
    Abstract: The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, and the filler contains boron nitride particles having particle sizes of from 10 ?m to 100 ?m. In the general Formula (I), R1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R2 and R3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.
    Type: Application
    Filed: March 28, 2012
    Publication date: January 16, 2014
    Inventors: Tomoo Nishiyama, Atsushi Kuwano, Toshiaki Shirasaka, Naoki Hara, Kensuke Yoshihara, Hideyuki Katagi
  • Publication number: 20130189514
    Abstract: A multilayer resin sheet including: a resin layer that includes an epoxy resin monomer, a curing agent, and a filler; and an adhesive layer positioned on at least one face of the resin layer, the filler having peaks in ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, respectively, in terms of particle size distribution as measured by laser diffractometry, and the filler having a particle size of from 10 ?m to 100 ?m including a boron nitride filler.
    Type: Application
    Filed: October 6, 2011
    Publication date: July 25, 2013
    Inventors: Tomoo Nishiyama, Yoshitaka Takezawa, Hideyuki Katagi, Naoki Hara, Yasuo Miyazaki, Kensuke Yoshihara
  • Publication number: 20120251830
    Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.
    Type: Application
    Filed: September 28, 2010
    Publication date: October 4, 2012
    Applicant: Hitachi Chemical Company, LTD
    Inventors: Tomoo Nishiyama, Haruaki Sue, Hideyuki Katagi, Naoki Hara, Hiroyuki Takahashi, Yasuo Miyazaki, Yoshitaka Takezawa, Hiroyuki Tanaka, Kensuke Yoshihara, Masayoshi Joumen