Abstract: An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing.

Abstract: An epoxy resin includes a reaction product between an epoxy compound and a compound having a naphthalene structure and a functional group that is reactive with an epoxy group.

Abstract: Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each R5 independently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3.

Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of ??2/??1 equal to 3 or less, wherein ??1 is an initial dynamic shear viscosity (Pa·s) and ??2 is a maximum value of dynamic shear viscosity (Pa·s), in a measurement of dynamic shear viscosity.

Abstract: An epoxy resin includes a reaction product between: an epoxy compound having a mesogenic structure; and at least one selected from the group consisting of an aromatic hydroxycarboxylic acid having a carboxy group and a hydroxy group bonded to an aromatic ring and an aromatic dicarboxylic acid having two carboxy groups bonded to an aromatic group.

Abstract: An epoxy resin includes an epoxy compound having a mesogenic structure, a cured product of the epoxy resin having a flexural modulus of 3.0 GPa or more at 23° C., a fracture toughness of 1.0 MPa·m1/2 or more, and a glass transition temperature of 150° C. or higher.

Abstract: An epoxy resin includes a reaction product between an epoxy compound and a compound having a naphthalene structure and a functional group that is reactive with an epoxy group.

Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.

Abstract: The present disclosure provides: an epoxy resin molding material including; an epoxy resin having a mesogen structure, a phenolic curing agent, an inorganic filler, and a curing accelerator having a quaternary phosphonium cation represented by the following Formula (I); a molded product and a molded cured product using the epoxy resin molding material; and a method for producing a molded cured product. In Formula (I), each of Ra to Rd independently represents an alkyl group having from 1 to 6 carbon atoms, or an aryl group, and the alkyl group and the aryl group may have a substituent.

Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Abstract: Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each R5 independently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3.

Abstract: An epoxy resin, comprising an epoxy compound having two or more mesogenic structures, and having a loss tangent of 1 or more at 35° C. before curing.

Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of ??2/??1 equal to 3 or less, wherein is an initial dynamic shear viscosity (Pa·s) and ??2 is a maximum value of dynamic shear viscosity (Pa·s), in a measurement of dynamic shear viscosity.

Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.

Abstract: Provided is an epoxy resin composition including an epoxy resin and a curing agent, in which the epoxy resin contains a multimeric compound having at least one selected from the group consisting of a structural unit represented by the following Formula (IA) and a structural unit represented by the following Formula (IB), the multimeric compound contains a dimeric compound containing two structural units represented by the following Formula (II) in one molecule, and a ratio of the dimeric compound is from 15% by mass to 28% by mass with respect to the epoxy resin as a whole.

Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Abstract: The present disclosure provides: an epoxy resin molding material including; an epoxy resin having a mesogen structure, a phenolic curing agent, an inorganic filler, and a curing accelerator having a quaternary phosphonium cation represented by the following Formula (I); a molded product and a molded cured product using the epoxy resin molding material; and a method for producing a molded cured product. In Formula (I), each of Ra to Rd independently represents an alkyl group having from 1 to 6 carbon atoms, or an aryl group, and the alkyl group and the aryl group may have a substituent.

Abstract: Provided is an epoxy resin composition including an epoxy resin and a curing agent, in which the epoxy resin contains a multimeric compound having at least one selected from the group consisting of a structural unit represented by the following Formula (IA) and a structural unit represented by the following Formula (IB), the multimeric compound contains a dimeric compound containing two structural units represented by the following Formula (II) in one molecule, and a ratio of the dimeric compound is from 15% by mass to 28% by mass with respect to the epoxy resin as a whole.

Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.