Abstract: Vibration suppression pieces are provided at the same positions as elastic engagement pieces around an axis of the stud bolt so as to sandwich the stud bolt inserted into a body part, and each include a pressing surface. In an insertion and fixation state where the stud bolt is inserted into the body part, each vibration suppression piece is pushed out toward an outer peripheral side by the stud bolt to become elastically deformed such that the vibration suppression piece is displaced from an inner peripheral side toward the outer peripheral side to a greater extent than the elastic engagement piece. Accordingly, the pressing surface presses the stud bolt toward the inner peripheral side more strongly than the elastic engagement piece.

Abstract: A method of processing a workpiece includes: a frame unit preparing step of preparing a frame unit including a tape affixed to an undersurface of the workpiece; a protective film forming step of forming a protective film on a top surface of the workpiece; a cutting step of cutting the workpiece by applying a laser beam; an interval expanding step of widening intervals between chips formed in the cutting step by expanding the tape outward in a radial direction; and an etching step of removing altered regions formed in the respective chips.

Abstract: A fastener may include a plate-shaped connecting base, at least one pair of projecting portions respectively formed in the connecting base, and undercut portions formed in the at least one pair of projecting portions. The at least one pair of projecting portions oppositely project in a lateral direction of the connecting base. The at least one pair of projecting portions respectively have first surfaces sloped toward distal ends thereof. The undercut portions are defined by the first surfaces of the at least one pair of projecting portions.

Abstract: A fastener may include a plate-shaped connecting base, at least one pair of projecting portions respectively formed in the connecting base, and undercut portions formed in the at least one pair of projecting portions. The at least one pair of projecting portions oppositely project in a lateral direction of the connecting base. The at least one pair of projecting portions respectively have first surfaces sloped toward distal ends thereof. The undercut portions are defined by the first surfaces of the at least one pair of projecting portions.

Abstract: A method of processing a workpiece includes: a frame unit preparing step of preparing a frame unit including a tape affixed to an undersurface of the workpiece; a protective film forming step of forming a protective film on a top surface of the workpiece; a cutting step of cutting the workpiece by applying a laser beam; an interval expanding step of widening intervals between chips formed in the cutting step by expanding the tape outward in a radial direction; and an etching step of removing altered regions formed in the respective chips.

Abstract: This vehicle fixture component 1 to be fixed in a female screw hole 101H in an attachment member 100 includes a base end portion 2 at the upper side, and an anchor portion 3 at the lower side. The anchor portion 3 includes: a columnar portion 30 extending, from the base end portion 2, downwardly from a first side relative to a penetration portion 2H; an elastic inclined piece 32 having an elastic portion 32B that is thin and that extends in a second side opposite to the first side from the lower side of the columnar portion 30, and an inclined portion 32A that is thick and that extends upwardly from the leading end of the elastic portion 32B and toward a side away from the columnar portion 30; and a head portion 31 opposed to the elastic portion 32B at the lower side thereof.

Abstract: A clip 200 includes a locking portion 6 and an operation portion 9. The locking portion 6 of the clip 200 is inserted into the clip insertion hole 7 exposed while the protrusion 1a of the panel 1 is fitted into a protrusion insertion hole 5a of a panel attaching portion 5. An upper surface 12b of a locking main body portion 12 of the clip 200 presses an inner surface of the clip insertion hole 7 to bend the protrusion 1a. A rear side inclined surface 19b of a hook portion 13 of the clip 200 presses a front side horizontal edge 21b on a ceiling surface of the clip insertion hole 7, and both connecting portions 14 of the clip 200 press vertical edges 22 of an inner wall surface of the clip insertion hole 7. The clip can easily and reliably fix a vibration generating member.

Abstract: A clip may include a main body and a pin member. In the clip, an engagement condition of the anchor to an attaching hole formed in a plate member can be maintained by inserting an elastic shank portion of the pin member into the anchor of the main body. The elastic shank portion inserted into the anchor is received by a stopper of the anchor, so that the pin member can be locked in a temporary insertion position. An interfering portion of the elastic shank portion is exposed to an exterior portion the anchor. When the anchor is inserted into the attaching hole, the interfering portion of the elastic shank portion interferes with a periphery of the attaching hole, so that a condition in which the pin member is locked in the temporary insertion position can be released.

Abstract: In an organic field effect transistor with an electrical conductor-insulator-semiconductor structure, the semiconductor layer is made of an organic compound, and the insulator layer is made of a polymer obtained through polymerization or copolymerization of 2-cyanoethyl acrylate and/or 2-cyanoethyl methacrylate.

Abstract: An organic field effect transistor (OFET) having a structure of a conductor layer/an insulator layer/a semiconductor layer is provided. This OFET comprises an insulator layer formed by mixing a polymer compound produced by polymerizing or copolymerizing a monomer represented by the formula (1): CH2?CHCOO—(CH2)2—CN??(1) and/or a monomer represented by the formula (2): CH2?C(CH3)COO—(CH2)2—CN??(2) with a polymerizable and/or crosslinkable organic compound other than the monomer represented by the formula (1) or (2); and a semiconductor layer comprising an organic compound.

Abstract: A clip 200 includes a locking portion 6 and an operation portion 9. The locking portion 6 of the clip 200 is inserted into the clip insertion hole 7 exposed while the protrusion 1a of the panel 1 is fitted into a protrusion insertion hole 5a of a panel attaching portion 5. An upper surface 12b of a locking main body portion 12 of the clip 200 presses an inner surface of the clip insertion hole 7 to bend the protrusion 1a. A rear side inclined surface 19b of a hook portion 13 of the clip 200 presses a front side horizontal edge 21b on a ceiling surface of the clip insertion hole 7, and both connecting portions 14 of the clip 200 press vertical edges 22 of an inner wall surface of the clip insertion hole 7. The clip can easily and reliably fix a vibration generating member.

Abstract: A clip may include a main body and a pin member. In the clip, an engagement condition of the anchor to an attaching hole formed in a plate member can be maintained by inserting an elastic shank portion of the pin member into the anchor of the main body. The elastic shank portion inserted into the anchor is received by a stopper of the anchor, so that the pin member can be locked in a temporary insertion position. An interfering portion of the elastic shank portion is exposed to an exterior portion the anchor. When the anchor is inserted into the attaching hole, the interfering portion of the elastic shank portion interferes with a periphery of the attaching hole, so that a condition in which the pin member is locked in the temporary insertion position can be released.

Abstract: An organic field effect transistor (OFET) having a structure of a conductor layer/an insulator layer/a semiconductor layer is provided. This OFET comprises an insulator layer formed by mixing a polymer compound produced by polymerizing or copolymerizing a monomer represented by the formula (1): CH2?CHCOO—(CH2)2—CN ??(1) and/or a monomer represented by the formula (2): CH2?C(CH3)COO—(CH2)2—CN ??(2) with a polymerizable and/or crosslinkable organic compound other than the monomer represented by the formula (1) or (2); and a semiconductor layer comprising an organic compound.

Abstract: In an organic field effect transistor with an electrical conductor-insulator-semiconductor structure, the semiconductor layer is made of an organic compound, and the insulator layer is made of a polymer obtained through polymerization or copolymerization of 2-cyanoethyl acrylate and/or 2-cyanoethyl methacrylate.