Patents by Inventor Hideyuki Kishi

Hideyuki Kishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION, LAMINATE STRUCTURE, CABLE, TUBE, AND METHOD FOR MANUFACTURING RESIN COMPOSITION
    Publication number: 20240110077
    Abstract: A resin composition includes silicone rubber as a base material, silicone resin fine particles, metal oxide fine particles, and nanosilica fine particles. A laminate structure includes a first layer including silicone rubber as a base material, and a second layer laminated to the first layer and including the resin composition. A cable or tube is provided with the laminate structure. A method of manufacturing the resin composition includes adding nanosilica fine particles to a mixture of silicone rubber, titanium dioxide fine particles, and an organic solvent, followed by adding silicone resin fine particles.
    Type: Application
    Filed: September 19, 2023
    Publication date: April 4, 2024
    Inventors: Kanako SUGANUMA, Seiichi KASHIMURA, Hideyuki SUZUKI, Masamichi KISHI, Naoto TERAKI
  • Electrical connector
    Patent number: D444768
    Type: Grant
    Filed: September 7, 2000
    Date of Patent: July 10, 2001
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Hideyuki Kishi
  • Electrical connector
    Patent number: D444769
    Type: Grant
    Filed: September 7, 2000
    Date of Patent: July 10, 2001
    Assignee: Hirose Electric Co., Ltd.
    Inventor: Hideyuki Kishi