Abstract: A semiconductor device includes a semiconductor chip and a package. The semiconductor chip includes a signal processing circuit, a plurality of pads, and a first resistor which arc formed on a semiconductor substrate. On the semiconductor chip, there is no shot-circuiting between a first pad and a second pad of the plurality of pads. A signal input terminal of the signal processing circuit is connected to the second pad. The first resistor is provided between a reference potential supply terminal for supplying a power supply potential and the first pad. A specific terminal of the plurality of terminals of the package is connected to the first pad by a first bonding wire, and is connected to the second pad by a second bonding wire.

Abstract: A linear amplifier outputs differential signals corresponding to differential signals input to a first signal input terminal and a second signal input terminal, and includes a first resistor, a second resistor, a third resistor, a fourth resistor, a first capacitor, a second capacitor, a third transistor, a fourth transistor, a differential amplifier, and a signal processing circuit. The signal processing circuit includes a first transistor and a second transistor, and includes a resistor as a common voltage output part that outputs a common voltage. The differential amplifier receives the common voltage and a reference voltage, and applies a voltage corresponding to the voltage difference between the common voltage and the reference voltage to the control terminals of the transistors.

Abstract: A semiconductor device includes a semiconductor chip and a package. The semiconductor chip includes a signal processing circuit, a plurality of pads, and a first resistor which arc formed on a semiconductor substrate. On the semiconductor chip, there is no shot-circuiting between a first pad and a second pad of the plurality of pads. A signal input terminal of the signal processing circuit is connected to the second pad. The first resistor is provided between a reference potential supply terminal for supplying a power supply potential and the first pad. A specific terminal of the plurality of terminals of the package is connected to the first pad by a first bonding wire, and is connected to the second pad by a second bonding wire.

Abstract: A linear amplifier outputs differential signals corresponding to differential signals input to a first signal input terminal and a second signal input terminal, and includes a first resistor, a second resistor, a third resistor, a fourth resistor, a first capacitor, a second capacitor, a third transistor, a fourth transistor, a differential amplifier, and a signal processing circuit. The signal processing circuit includes a first transistor and a second transistor, and includes a resistor as a common voltage output part that outputs a common voltage. The differential amplifier receives the common voltage and a reference voltage, and applies a voltage corresponding to the voltage difference between the common voltage and the reference voltage to the control terminals of the transistors.

Abstract: The DC-DC converter includes a reference voltage generating circuit that generates a reference voltage. The DC-DC converter includes a modulation clock signal generating circuit that generates a modulation clock signal. The DC-DC converter includes a modulator that performs modulation of the reference voltage in synchronization with the modulation clock signal and outputs a resulting reference signal. The DC-DC converter includes a first comparator that compares the reference signal and a first feedback signal, which is based on the output voltage, and outputs a signal based on a result of the comparison. The DC-DC converter includes a driver that shapes a waveform of a PWM signal, which is based on the signal output from the first comparator, and outputs the PWM signal with the shaped waveform to the control node.

Abstract: The DC-DC converter includes a reference voltage generating circuit that generates a reference voltage. The DC-DC converter includes a modulation clock signal generating circuit that generates a modulation clock signal. The DC-DC converter includes a modulator that performs modulation of the reference voltage in synchronization with the modulation clock signal and outputs a resulting reference signal. The DC-DC converter includes a first comparator that compares the reference signal and a first feedback signal, which is based on the output voltage, and outputs a signal based on a result of the comparison. The DC-DC converter includes a driver that shapes a waveform of a PWM signal, which is based on the signal output from the first comparator, and outputs the PWM signal with the shaped waveform to the control node.

Abstract: According to an embodiment, a frequency converting device is provided with a duty adjusting unit that generates a 1/N local signal, which is a local signal with a duty ratio of 1/N, when N is an integral number not smaller than 3 and an N-th high-frequency component included in the local signal is a target of inhibition. Further, this is provided with a mixer that outputs difference or sum between/of the 1/N local signal and an input signal.

Abstract: According to an embodiment, a frequency converting device is provided with a duty adjusting unit that generates a 1/N local signal, which is a local signal with a duty ratio of 1/N, when N is an integral number not smaller than 3 and an N-th high-frequency component included in the local signal is a target of inhibition. Further, this is provided with a mixer that outputs difference or sum between/of the 1/N local signal and an input signal.

Abstract: A semiconductor integrated circuit includes a first input terminal configured to input a baseband signal, a second input terminal configured to input a local oscillation signal, an output terminal configured to output a modulating signal, a first amplifier circuit configured to receive the baseband signal through the first input terminal and to output a first amplified signal of the baseband signal, a 2-multiplying circuit configured to receive the local oscillation signal through the second input terminal and to output a 2-multiplied signal of the local oscillation signal, an adder configured to add the 2-multiplied signal and the first amplified signal and to output an addition signal, a second amplifier circuit configured to receive the addition signal and to output a second amplified signal of the addition signal, and a mixer configured to multiply the second amplified signal and the local oscillation signal and to output the modulating signal to the output terminal.

Abstract: A semiconductor integrated circuit includes a first input terminal configured to input a baseband signal, a second input terminal configured to input a local oscillation signal, an output terminal configured to output a modulating signal, a first amplifier circuit configured to receive the baseband signal through the first input terminal and to output a first amplified signal of the baseband signal, a 2-multiplying circuit configured to receive the local oscillation signal through the second input terminal and to output a 2-multiplied signal of the local oscillation signal, an adder configured to add the 2-multiplied signal and the first amplified signal and to output an addition signal, a second amplifier circuit configured to receive the addition signal and to output a second amplified signal of the addition signal, and a mixer configured to multiply the second amplified signal and the local oscillation signal and to output the modulating signal to the output terminal.