Patents by Inventor Hideyuki KOYANAGI

Hideyuki KOYANAGI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive composition using polyamide-imide resin
    Patent number: 10913249
    Abstract: The present invention provide an adhesive composition which is suitable for laminating a polyimide film with a copper foil in a double-sided flexible copper-clad laminate to be used for a flexible printed wiring board. The adhesive composition comprises a polyamide-imide resin, an epoxy resin, and a phosphorus-type flame retardant, wherein 15 to 40 parts by mass of the epoxy resin is compounded to 85 to 60 parts by mass of the polyamide-imide resin; a glass transition temperature of the polyamide-imide resin is 250° C. or higher; an acid value of the polyamide-imide resin is 50 to 150 mgKOH/g; the epoxy resin is liquid at 25° C.; 15 to 60 parts by mass of the phosphorus-type flame retardant is compounded to 100 parts by mass in total of the polyamide-imide resin and the epoxy resin; and 50% by mass or more of the phosphorus-type flame retardant is a phosphinic acid derivative of a phenanthrene type.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: February 9, 2021
    Assignees: TOYOBO CO., LTD., NIPPON MEKTRON, LTD.
    Inventors: Takehisa Yane, Hideyuki Koyanagi, Manabu Ohrui, Satoshi Ebihara
  • ADHESIVE COMPOSITION USING POLYAMIDE-IMIDE RESIN
    Publication number: 20180362815
    Abstract: The present invention provide an adhesive composition which is suitable for laminating a polyimide film with a copper foil in a double-sided flexible copper-clad laminate to be used for a flexible printed wiring board. The adhesive composition comprises a polyamide-imide resin, an epoxy resin, and a phosphorus-type flame retardant, wherein 15 to 40 parts by mass of the epoxy resin is compounded to 85 to 60 parts by mass of the polyamide-imide resin; a glass transition temperature of the polyamide-imide resin is 250° C. or higher; an acid value of the polyamide-imide resin is 50 to 150 mgKOH/g; the epoxy resin is liquid at 25° C.; 15 to 60 parts by mass of the phosphorus-type flame retardant is compounded to 100 parts by mass in total of the polyamide-imide resin and the epoxy resin; and 50% by mass or more of the phosphorus-type flame retardant is a phosphinic acid derivative of a phenanthrene type.
    Type: Application
    Filed: November 9, 2016
    Publication date: December 20, 2018
    Applicants: TOYOBO CO., LTD., NIPPON MEKTRON, LTD.
    Inventors: Takehisa YANE, Hideyuki KOYANAGI, Manabu OHRUI, Satoshi EBIHARA
  • ADHESIVE COMPOSITION USING POLYAMIDE-IMIDE RESIN
    Publication number: 20170002242
    Abstract: The present invention provides an adhesive composition for a flexible printed wiring board containing (A) an epoxy resin; (B) no phosphorus-containing epoxy resin; and (C) a polyamide-imide resin.
    Type: Application
    Filed: January 5, 2015
    Publication date: January 5, 2017
    Applicants: TOYOBO CO., LTD., NIPPON MEKTRON, LTD.
    Inventors: Takehisa YANE, Hideyuki KOYANAGI, Masami HAMANO, Hisae OBA, Kouji OKANO, Satoshi EBIHARA