Patents by Inventor Hideyuki Kuri

Hideyuki Kuri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper filling-up method
    Patent number: 8273232
    Abstract: A method of filling copper in a non-through hole on a substrate that has been treated to render it conductive, which comprises plating said substrate in an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid and a filling additive that is a polymer having the activities of both of a brightener and a leveler.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: September 25, 2012
    Assignees: Osaka Prefecture University Public Corporation, Nitto Boseki Co., Ltd.
    Inventors: Naoki Okamoto, Kazuo Kondo, Hideyuki Kuri, Masaru Bunya, Minoru Takeuchi
  • COPPER FILLING-UP METHOD
    Publication number: 20100255269
    Abstract: [Problem to be Solved] To provide a method of well filling copper in a non-through hole on a conductivity-rendered substrate by using a copper plating bath containing fewer additives. [Means for Solving the Problem] A method of filling copper in a non-through hole on a substrate that has been treated to render it conductive, which comprises plating said substrate in an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid and a filling additive that is a polymer having the activities of both of a brightener and a leveler.
    Type: Application
    Filed: April 2, 2010
    Publication date: October 7, 2010
    Applicants: Osaka Prefecture University Public Corporation, Nitto Boseki Co., Ltd.
    Inventors: Naoki Okamoto, Kazuo Kondo, Hideyuki Kuri, Masaru Bunya, Minoru Takeuchi