Abstract: The present invention is intended to realize an optical device in which an optical member and a sensor are directly bonded to each other while overflow of an adhesive onto light receiving elements is suppressed.

Abstract: Manufacturing of a high-resolution sensor device is enabled. An optical component mounting device (100) includes a pressing portion (3), which presses an optical component from a side on which a suction portion (1) is disposed after the suction portion (1) stops sucking.

Abstract: An optical element module according to the present invention is provided, in which: a plurality of optical elements are housed within a light shielding holder; a metal light shielding plate is interposed at least between respective planarized surfaces of a spacer section of an upper optical element and a spacer section of a lower optical element; the light shielding plate includes an opening formed at a position corresponding to an optical surface of the optical element; and the light shielding plate includes a cut section, which is formed by cutting a part of a peripheral edge of the light shielding plate.

Abstract: The present invention provides an optical element, comprising: a side surface where incident light undergoes diffuse reflection inside the optical element, between the outline of a top optical surface and a bottom optical surface; and an inclined surface for total reflection of diffuse reflection from the side surface, formed at least between the side surface and the bottom optical surface.

Abstract: The present invention provides an optical element, comprising: a side surface where incident light undergoes diffuse reflection inside the optical element, between the outline of a top optical surface and a bottom optical surface; and an inclined surface for total reflection of diffuse reflection from the side surface, formed at least between the side surface and the bottom optical surface.

Abstract: An optical element module according to the present invention is provided, in which: a plurality of optical elements are housed within a light shielding holder; a metal light shielding plate is interposed at least between respective planarized surfaces of a spacer section of an upper optical element and a spacer section of a lower optical element; the light shielding plate includes an opening formed at a position corresponding to an optical surface of the optical element; and the light shielding plate includes a cut section, which is formed by cutting a part of a peripheral edge of the light shielding plate.

Abstract: The object of the present invention is to provide a laminate for laser marking which is useful for forming displays or indications, for example, on the surface of sheet-like molded products made of thermoplastic resins, by suitably employing thermoplastic polymer resins for laser marking, and whose slipping property on the production process can be improved and whose blocking problem at the storage in the stacked condition can be solved. In an aspect of the present invention, there is provided a laminate for laser marking comprising a layer (A) and a layer (B) laminated on at least one side of layer (A), which layer (A) comprises a white or black coloring laser-marking thermoplastic resin, which layer (B) comprises a transparent thermoplastic resin and has a light transmittance of not less than 70% in the single layer, and the transparent thermoplastic resin in the layer (B) being subjected to anti-blocking treatment.

Abstract: A method for manufacturing an optical element wafer according to the present invention, in which a plurality of optical elements are arranged in two dimensions, includes: a replica forming step of forming a replica, in which an optical element shape is formed on a front surface side, in each of a plurality of recesses formed in a base; a stamper mold forming step of forming a stamper mold using the optical element shape of the replica; and an optical element wafer forming step of transferring the optical element shape to an optical element material using the stamper mold to form an optical element wafer.

Abstract: A low-heat accumulating thermoplastic resin composition containing 100 parts by mass of a thermoplastic resin [A] and 0.1 to 15 parts by mass of an inorganic pigment [B] having an infrared-reflecting property, and a molded product comprising the composition. The low-heat accumulating thermoplastic resin composition of the present invention is capable of providing a dark-colored molded product exhibiting a less heat accumulation as well as excellent weather resistance and impact resistance.

Abstract: The objective of the present invention is to provide a chromatic coloring agent for multicolor laser marking, capable of forming clear markings having two or more different color tones when two or more laser beams having different energy levels are irradiated onto different places of a molded article, a composition for multicolor laser marking, for example, capable of forming a chromatic marking derived from the chromatic coloring agent and a white marking on the surface of a molded article whose base color is black or dark-color based color, a laser marking method, a multicolor-marked molded article and the like. The present chromatic coloring agent has an exothermic peak in the range of 360° C. or higher and 590° C. or lower, as measured by differential thermal analysis.

Abstract: There is provided a laminate for laser marking which is useful for forming displays, for example, on the S-shaped surface of sheet-like molded products made of thermoplastic resins, by suitably employing a thermoplastic polymer composition for laser marking. The present invention relates to a laminate for laser marking, comprising: a layer A comprising a multi-color developing laser marking thermoplastic polymer composition capable of producing markings having two or more different color tones by irradiating thereto two or more laser lights having different energies from each other, the composition satisfying the following requirements (1) and (2): (1) comprising a chromatic colorant, a black substance capable of being dissipated by itself or discolored when exposed to the laser lights, and a thermoplastic polymer at the following mixing ratio, and (2) containing the chromatic colorant and the black substance in amounts of from 0.001 to 3 parts by weight and from 0.

Abstract: A low-heat accumulating thermoplastic resin composition containing 100 parts by mass of a thermoplastic resin [A] and 0.1 to 15 parts by mass of an inorganic pigment [B] having an infrared-reflecting property, and a molded product comprising the composition. The low-heat accumulating thermoplastic resin composition of the present invention is capable of providing a dark-colored molded product exhibiting a less heat accumulation as well as excellent weather resistance and impact resistance.

Abstract: A fabrication method of a semiconductor device according to the present invention includes the steps of: bonding a reinforcing plate with a front surface of a semiconductor wafer via a reinforcing plate, the reinforcing plate having holes and the semiconductor wafer bearing semiconductor devices; grinding a back surface of the semiconductor wafer; and detaching the reinforcing plate from the semiconductor wafer by injecting a solvent for dissolving an adhesive layer into the holes and by allowing the solvent to permeate through the adhesive layer. The method enables the reinforcing plate to be quickly detached from the semiconductor wafer without causing defects, such as bending and cracking, in the semiconductor wafer after the reinforcing plate is used to grind the semiconductor wafer.

Abstract: A semiconductor apparatus includes (i) a semiconductor substrate, (ii) a field oxide film, formed in a surface of the semiconductor substrate, having an aperture section, (iii) a electrode pad formed on the field oxide film, and (iv) a penetration electrode electrically connected to the electrode pad via the aperture section of the field oxide film and a hole formed in the semiconductor substrate. The hole is formed in the aperture section of the field oxide film, when perpendicularly viewing the semiconductor substrate.

Abstract: A fabrication method of a semiconductor device according to the present invention includes the steps of: bonding a reinforcing plate with a front surface of a semiconductor wafer via a reinforcing plate, the reinforcing plate having holes and the semiconductor wafer bearing semiconductor devices; grinding a back surface of the semiconductor wafer; and detaching the reinforcing plate from the semiconductor wafer by injecting a solvent for dissolving an adhesive layer into the holes and by allowing the solvent to permeate through the adhesive layer. The method enables the reinforcing plate to be quickly detached from the semiconductor wafer without causing defects, such as bending and cracking, in the semiconductor wafer after the reinforcing plate is used to grind the semiconductor wafer.