Abstract: When a cylinder unit is actuated to extent its rod upwardly, a chuck is lifted above an inner cup to receive a planar workpiece such as a semiconductor wafer or a glass substrate. The chuck is now disengaged from the inner cup, and a stopper locks the chuck against rotation. After the planar workpiece has been supported on the chuck, the cylinder unit is actuated to retract its rod, bringing the chuck into its lowered position. The chuck is now engaged by the inner cup for corotation. Energization of a motor rotates the inner cup, which then rotates the chuck. Since the inner cup, which has a relatively large rotational inertia, is driven by the motor, interengaging portions of the inner cup and the chuck are less susceptible to damage.

Abstract: A plurality of workpieces are supported on a workpiece holder disposed over an opening defined in a horizontal base plate and connected to an evacuating device. A reaction chamber, which is supported on an arm of a lifting and lowering device, is vertically movable with respect to the base plate between a lowered position in which the reaction chamber defines a closed space which accommodates the workpieces therein and a lifted position in which the workpieces are exposed out of the reaction chamber. A heating device, which is supported on an arm of another lifting and lowering device, is vertically movable with respect to the base plate between a lowered position in which the heating device surrounds the reaction chamber and a lifted position in which the reaction chamber is exposed out of the heating device.

Abstract: A coating apparatus comprises a spinning chuck rotatably supported within an enclosure and securely holding a substrate thereon. A coating material is applied onto the surface of the substrate and distributed over the substrate by centrifugal forces. An annular air duct is disposed in surrounding and spaced relation to the spinning chuck, and a disk is placed between the air duct and the spinning chuck and has a plurality of guide vanes. Fans are provided in the air duct to develop a positive flow of air over the substrate. The flow of air is guided by the guide vanes in a direction identical to the direction of rotation of the substrate so as to eliminate undesirable deposition from the end edges of the substrate.

Abstract: A coating apparatus comprises a spinning chuck rotatably supported within an enclosure and securely holding a substrate thereon. A coating material is applied onto the surface of the substrate and distributed over the substrate by centrifugal forces. An annular air duct is disposed in surrounding and spaced relation to the spinning chuck, and a disk is placed between the air duct and the spinning chuck and has a plurality of guide vanes. Fans are provided in the air duct to develop a positive flow of air over the substrate. The flow of air is guided by the guide vanes in a direction identical to the direction of rotation of the substrate so as to eliminate undesirable deposition from the end edges of the substrate.

Abstract: A thin-film coating apparatus rotates a member on which a coating solution is dropped to spread the coating solution over the member. The thin-film coating apparatus comprises a spinner for securely supporting the member, a casing firmly attached to the spinner in surrounding relation to the spinner and the member, and a lid for closing an opening in the casing through which the member can be brought into and out of the casing, thereby defining a closed processing chamber in the casing.

Abstract: A thin-film coating apparatus for coating a thin film on a material includes a casing, a spinner mounted in the casing for rotating the material, and a pipe disposed upwardly of the spinner and having in a lower end thereof a nozzle for dropping a film-forming coating solution onto the material. The casing comprises an annular upper plate, a cylindrical circumferential wall, and a bottom plate. The annular upper plate has defined therein gas flow passages for passage of an inert gas such as an N.sub.2 gas introduced from an exterior supply source, and gas ejector holes defined in the upper surface of the annular upper plate in communication with the gas flow passages for ejecting the inert gas toward the pipe.