Patents by Inventor Hideyuki Nagaishi
Hideyuki Nagaishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150346334Abstract: A speed sensor which aligns a normal direction of one patch antenna which is disposed on a mounted board, and an optical axis of a dielectric lens uses a frame for inclining a sensor module, in order to obtain a component cos ? in a traveling direction when the speed sensor is installed on a horizontally vertical surface of an automobile or a railway car. When beams are condensed by using the one patch antenna and the cannonball-shaped dielectric lens, the dielectric lens is inclined and a bottom surface portion of the lens is cut with a plane parallel with a surface of the antenna-mounted board. The one patch antenna is configured by one patch and a GND electrode and the gain center of radiation characteristics is a normal direction of the antenna board. However, the radiation characteristics have a substantially hemisphere surface wave shape.Type: ApplicationFiled: December 13, 2013Publication date: December 3, 2015Applicant: Hitachi Automotive Systems, Ltd.Inventors: Hideyuki NAGAISHI, Takafumi MATSUMURA
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Publication number: 20150253421Abstract: To provide a radar module used for a speed measuring device or the like, in which dispersion of intensity distribution of electromagnetic waves emitted from the radar module via a lens is small, the radar module using a substrate with a plane antenna formed on a surface of the substrate includes: a lens having one end face that is plane and another end face that is spherical. In the radar module, a plane side of the lens is disposed to contact the plane antenna, and a spherical side of the lens is disposed in a remote field of the plane antenna.Type: ApplicationFiled: October 4, 2013Publication date: September 10, 2015Inventors: Takafumi Matsumura, Hideyuki Nagaishi
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Patent number: 8755296Abstract: A wireless communication device includes a sensor processing unit that generates sensor data including a measurement result acquired by a sensor; a communication measurement unit that generates communication quality data including a communication state for transmitting a packet; a compression determination unit that determines compression rates of first sensor data and first communication quality data according to the contents of the first sensor data including the transmitted sensor data and the generated sensor data or the contents of the first communication quality data including the transmitted sensor data and the generated communication quality data; a compression unit that compresses the first sensor data and the first communication quality data according to the determined compression rates; and a wireless communication unit that transmits a packet including the compressed first sensor data and the compressed first communication quality data to another wireless communication device or the access point.Type: GrantFiled: December 1, 2011Date of Patent: June 17, 2014Assignee: Hitachi, Ltd.Inventors: Masayuki Miyazaki, Kenichi Mizugaki, Masaru Kokubo, Hideyuki Nagaishi, Nobuhisa Kobayashi
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Patent number: 8644367Abstract: An antenna beam scan unit includes: a Rotman lens that performs power division and synthesis between plural antenna ports and three or more beam ports; plural antenna elements which are connected to the respective antenna ports and to or from which radio waves are inputted or outputted; plural amplifiers that are connected to the respective beam ports of the Rotman lens and perform amplitude modulation on a signal; input paths for a transmission signal disposed in association with the amplifiers; switches for switching the input paths; and a beam control unit. The input paths include first paths and second paths on which a signal that is out of phase with a signal on the first paths is produced. The beam control unit selects two adjoining beam ports, and can switch the first paths and second paths as the input paths for the two beam ports.Type: GrantFiled: April 4, 2012Date of Patent: February 4, 2014Assignee: Hitachi Chemical Co., LtdInventors: Hideyuki Nagaishi, Nobuhiko Shibagaki, Yuichi Shimayama
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Publication number: 20130333617Abstract: A plasma processing apparatus is provided in which film formation to a part other than a process target is suppressed, and a film formation process to the process target can be uniformly performed. The plasma processing apparatus includes a high-frequency power supply for plasma generation, a surface discharge type discharge electrode including two kinds of electrodes in one dielectric surface of a dielectric layer. The process target is brought into close contact with a discharge-surface-side surface of the discharge electrode, and a plasma is generated in a vicinity of a front surface of the process target. When a height of a surface of the dielectric layer just above the electrode is H2, and a height of a surface of the dielectric layer between the electrode and the electrode is H1, H1>H2 is established.Type: ApplicationFiled: June 13, 2013Publication date: December 19, 2013Inventors: Hiroyuki KOBAYASHI, Tetsuya SUZUKI, Mayui NOBORISAKA, Hideyuki NAGAISHI, Hisanori MATSUMOTO
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Publication number: 20120257653Abstract: An antenna beam scan unit includes: a Rotman lens that performs power division and synthesis between plural antenna ports and three or more beam ports; plural antenna elements which are connected to the respective antenna ports and to or from which radio waves are inputted or outputted; plural amplifiers that are connected to the respective beam ports of the Rotman lens and perform amplitude modulation on a signal; input paths for a transmission signal disposed in association with the amplifiers; switches for switching the input paths; and a beam control unit. The input paths include first paths and second paths on which a signal that is out of phase with a signal on the first paths is produced. The beam control unit selects two adjoining beam ports, and can switch the first paths and second paths as the input paths for the two beam ports.Type: ApplicationFiled: April 4, 2012Publication date: October 11, 2012Inventors: Hideyuki NAGAISHI, Nobuhiko SHIBAGAKI, Yuichi SHIMAYAMA
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Publication number: 20120155301Abstract: A wireless communication device includes a sensor processing unit that generates sensor data including a measurement result acquired by a sensor; a communication measurement unit that generates communication quality data including a communication state for transmitting a packet; a compression determination unit that determines compression rates of first sensor data and first communication quality data according to the contents of the first sensor data including the transmitted sensor data and the generated sensor data or the contents of the first communication quality data including the transmitted sensor data and the generated communication quality data; a compression unit that compresses the first sensor data and the first communication quality data according to the determined compression rates; and a wireless communication unit that transmits a packet including the compressed first sensor data and the compressed first communication quality data to another wireless communication device or the access point.Type: ApplicationFiled: December 1, 2011Publication date: June 21, 2012Applicant: Hitachi, Ltd.Inventors: Masayuki MIYAZAKI, Kenichi Mizugaki, Masaru Kokubo, Hideyuki Nagaishi, Nobuhisa Kobayashi
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Patent number: 7884682Abstract: When a microstrip line is connected with a waveguide, there is a limit to reducing the connection loss by using only a matching box. We have discovered that in a transmission mode line transducer for converting between the TEM waves of the microstrip line and the TE01 waves of the waveguide, if the cross-sections of the microstrip line and the waveguide are substantially the same size, in the case of a 50? microstrip line when the characteristic impedance of the waveguide is about 80%, i.e., 40?, the line conversion loss can be optimized. Therefore, according to the present invention, the microstrip line is connected with the waveguide using a ?/4 matching box by means of a ridged waveguide having a low impedance and a length of ?/16 or less.Type: GrantFiled: November 27, 2007Date of Patent: February 8, 2011Assignee: Hitachi, Ltd.Inventors: Hideyuki Nagaishi, Hiroshi Shinoda
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Patent number: 7804443Abstract: In a millimeter waveband transceiver using an antenna and a waveguide for a connection line, it is necessary to perform transmission mode line conversion between TEM waves of a microstrip line and VTE01 mode waves of the waveguide. There is a limit to reducing the conversion loss using only a matching box for connecting the microstrip line with the waveguide. In a transmission mode line transducer for converting between the TEM waves of the microstrip line and the VTE01 mode waves of the waveguide, if the cross-sections are substantially the same size, in the case of a 50? microstrip line when the characteristic impedance of the waveguide is about 80%, i.e., 40?, the line conversion loss can be optimized. Therefore, the microstrip line is connected with the waveguide using a ?/4 matching box via a ridged waveguide having a low impedance and a length of ?/16 or less.Type: GrantFiled: November 2, 2007Date of Patent: September 28, 2010Assignee: Hitachi, Ltd.Inventors: Hideyuki Nagaishi, Hiroshi Shinoda, Kazuo Matsuura
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Publication number: 20090101817Abstract: The present invention provides a highly sensitive, thin detector useful for observing low-voltage, high-resolution SEM images, and provides a charged particle beam application apparatus based on such a detector. The charged particle beam application apparatus includes a charged particle irradiation source, a charged particle optics for irradiating a sample with a charged particle beam emitted from the charged particle irradiation source, and an electron detection section for detecting electrons that are secondarily generated from the sample. The electron detection section includes a diode device that is a combination of a phosphor layer, which converts the electrons to an optical signal, and a device for converting the optical signal to electrons and subjecting the electrons to avalanche multiplication, or includes a diode device having an electron absorption region that is composed of at least a wide-gap semiconductor substrate with a bandgap greater than 2 eV.Type: ApplicationFiled: October 16, 2008Publication date: April 23, 2009Inventors: Takashi OHSHIMA, Michio Hatano, Hideyuki Nagaishi, Mitsugu Sato, Muneyuki Fukuda
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Publication number: 20080129409Abstract: When a microstrip line is connected with a waveguide, there is a limit to reducing the connection loss by using only a matching box. We have discovered that in a transmission mode line transducer for converting between the TEM waves of the microstrip line and the TE01 waves of the waveguide, if the cross-sections of the microstrip line and the waveguide are substantially the same size, in the case of a 50? microstrip line when the characteristic impedance of the waveguide is about 80%, i.e., 40?, the line conversion loss can be optimized. Therefore, according to the present invention, the microstrip line is connected with the waveguide using a ?/4 matching box by means of a ridged waveguide having a low impedance and a length of ?/16 or less.Type: ApplicationFiled: November 27, 2007Publication date: June 5, 2008Inventors: Hideyuki NAGAISHI, Hiroshi Shinoda
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Publication number: 20080129408Abstract: In a millimeter waveband transceiver using an antenna and a waveguide for a connection line, it is necessary to perform transmission mode line conversion between TEM waves of a microstrip line and VTE01 mode waves of the waveguide. There is a limit to reducing the conversion loss using only a matching box for connecting the microstrip line with the waveguide. In a transmission mode line transducer for converting between the TEM waves of the microstrip line and the VTE01 mode waves of the waveguide, if the cross-sections are substantially the same size, in the case of a 50? microstrip line when the characteristic impedance of the waveguide is about 80%, i.e., 40?, the line conversion loss can be optimized. Therefore, the microstrip line is connected with the waveguide using a ?/4 matching box via a ridged waveguide having a low impedance and a length of ?/16 or less.Type: ApplicationFiled: November 2, 2007Publication date: June 5, 2008Inventors: Hideyuki Nagaishi, Hiroshi Shinoda, Kazuo Matsuura
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Publication number: 20070159380Abstract: A millimeter-wave radar apparatus has a good heat radiation characteristic. The apparatus includes a multilayer substrate, an RF circuit, an antenna, a thermal via hole, a heat transmitting plate, and a casing. The RF circuit and the antenna are provided on the front and rear surfaces of the multilayer substrate respectively. The thermal via hole is provided within the multilayer substrate. The heat transmitting plate is formed therein with an opening so as to avoid deterioration of the wave radiation characteristic of the antenna. The plane of the antenna is contacted with the heat transmitting plate. Heat generated in an MMIC as an active circuit of the RF circuit is transmitted through the thermal via hole and laminated metallic layers, and is diffused onto the surface of the multilayer substrate. Heat reaching the antenna surface of the multilayer substrate is radiated from the heat transmitting plate.Type: ApplicationFiled: October 10, 2006Publication date: July 12, 2007Inventors: Hideyuki Nagaishi, Hiroshi Shinoda, Kazuo Matsuura
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Patent number: 7239222Abstract: A high frequency circuit module for use in an automotive radar or the like, in which RF circuit parts are mounted on both sides of a hard multilayer dielectric substrate, and a transmission line connecting the RF circuit parts provided on both sides is constructed by a via group including a periodical structure or a via having a coaxial structure perpendicular to faces of the multilayer dielectric substrate. As the multilayer dielectric substrate, a hard multilayer substrate using metallic layers as a microstrip line wiring layer, a DC/IF signal line layer, and grounding metal layers for shielding which are disposed on and under the DC/IF signal line is employed. By using the transmission line achieved by a through via having the periodical structure or the through via having the coaxial structure, an electromagnetic wave propagating in parallel between the grounding conductors is confined.Type: GrantFiled: September 1, 2004Date of Patent: July 3, 2007Assignee: Hitachi, Ltd.Inventors: Hideyuki Nagaishi, Hiroshi Kondoh
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Publication number: 20050030231Abstract: A high frequency circuit module for use in an automotive radar or the like, in which RF circuit parts are mounted on both sides of a hard multilayer dielectric substrate, and a transmission line connecting the RF circuit parts provided on both sides is constructed by a via group including a periodical structure or a via having a coaxial structure perpendicular to faces of the multilayer dielectric substrate. As the multilayer dielectric substrate, a hard multilayer substrate using metallic layers as a microstrip line wiring layer, a DC/IF signal line layer, and grounding metal layers for shielding which are disposed on and under the DC/IF signal line is employed. By using the transmission line achieved by a through via having the periodical structure or the through via having the coaxial structure, an electromagnetic wave propagating in parallel between the grounding conductors is confined.Type: ApplicationFiled: September 1, 2004Publication date: February 10, 2005Inventors: Hideyuki Nagaishi, Hiroshi Kondoh
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Patent number: 6794961Abstract: A high frequency circuit module for use in an automotive radar or the like, in which RF circuit parts are mounted on both sides of a hard multilayer dielectric substrate, and a transmission line connecting the RF circuit parts provided on both sides is constructed by a via group including a periodical structure or a via having a coaxial structure perpendicular to faces of the multilayer dielectric substrate. As the multilayer dielectric substrate, a hard multilayer substrate using metallic layers as a microstrip line wiring layer, a DC/IF signal line layer, and grounding metal layers for shielding which are disposed on and under the DC/IF signal line is employed. By using the transmission line achieved by a through via having the periodical structure or the through via having the coaxial structure, an electromagnetic wave propagating in parallel between the grounding conductors is confined.Type: GrantFiled: February 8, 2002Date of Patent: September 21, 2004Assignee: Hitachi, Ltd.Inventors: Hideyuki Nagaishi, Hiroshi Kondoh
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Patent number: 6747488Abstract: A multiple PLL oscillator for oscillating and outputting a plurality of frequencies having a predetermined step frequency, comprising a first and a second reference frequency sources, a switch for selecting the ore of outputs of the first and the second reference frequency sources alternatively and at predetermined time interval, and a PLL frequency synthesizer generating a millimeter wave oscillation output corresponding to each of the first and second reference frequency sources.Type: GrantFiled: August 19, 2002Date of Patent: June 8, 2004Assignee: Hitachi, Ltd.Inventors: Hideyuki Nagaishi, Naoyuki Kurita, Toshiyuki Nagasaku, Kazuhiro Nagaoka, Hiroshi Kondoh
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Publication number: 20040012447Abstract: One of outputs of reference frequency sources 11 and 12 is selected by a switch 13, as a reference frequency signal and compared with the phase of an output of a frequency divider 19 by a phase comparator 14. A voltage controlled oscillator 16 is controlled by a result of comparison. An output of the voltage controlled oscillator 16 and an output of another reference frequency source 18 are mixed by a mixer 17. An upper side band frequency signal of the mixer 17 is used as an output of the multiple PLL oscillator, and a lower side band frequency signal of the mixer 17 is supplied to the frequency divider 19. With the configuration, in the multiple millimeter PLL oscillator, even when the dividing number of frequency increases, lock-up time to reach a desired frequency can be shortened. Thus, stability of a PLL can be improved and specifications of the oscillation frequency of the millimeter wave band and a step frequency of hundreds kHz can be realized.Type: ApplicationFiled: August 19, 2002Publication date: January 22, 2004Applicant: Hitachi, Ltd.Inventors: Hideyuki Nagaishi, Naoyuki Kurita, Toshiyuki Nagasaku, Kazuhiro Nagaoka, Hiroshi Kondoh
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Publication number: 20030080836Abstract: A high frequency circuit module for use in an automotive radar or the like, in which RF circuit parts are mounted on both sides of a hard multilayer dielectric substrate, and a transmission line connecting the RF circuit parts provided on both sides is constructed by a via group including a periodical structure or a via having a coaxial structure perpendicular to faces of the multilayer dielectric substrate. As the multilayer dielectric substrate, a hard multilayer substrate using metallic layers as a microstrip line wiring layer, a DC/IF signal line layer, and grounding metal layers for shielding which are disposed on and under the DC/IF signal line is employed. By using the transmission line achieved by a through via having the periodical structure or the through via having the coaxial structure, an electromagnetic wave propagating in parallel between the grounding conductors is confined.Type: ApplicationFiled: February 8, 2002Publication date: May 1, 2003Applicant: Hitachi, Ltd.Inventors: Hideyuki Nagaishi, Hiroshi Kondoh
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Patent number: 6249242Abstract: A high-frequency transmitter-receiver apparatus includes a transceiver circuit realized in a planar structure by a dielectric substrate and a semiconductor chip and a planar antenna formed on a dielectric substrate are provided on front and rear surfaces, respectively, of a single electrically conductive base plate. Signal lines of the planar circuit and the planar antenna are electrically interconnected by a coaxial line which extends through said base plate.Type: GrantFiled: August 6, 1999Date of Patent: June 19, 2001Assignee: Hitachi, Ltd.Inventors: Kenji Sekine, Hiroshi Kondoh, Keigo Kamozaki, Hideyuki Nagaishi, Kazuo Matsuura, Terumi Nakazawa, Michio Tanimoto, Hideaki Sasaki, Yuzo Taniguchi