Patents by Inventor Hideyuki Negishi

Hideyuki Negishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7781369
    Abstract: A mesoporous silica thick-film comprising a layer of mesoporous silica formed in a thickness of 10 ?m to 1 mm, and a process for producing a mesoporous silica thick-film, which comprises disposing a substrate in a solution containing mesoporous silica suspended therein and subsequently applying a voltage thereby to form a film having a thickness of 10 ?m to 1 mm by the electrophoretic deposition of the mesoporous silica on a surface of the substrate is provided.
    Type: Grant
    Filed: April 20, 2006
    Date of Patent: August 24, 2010
    Assignee: National Institute of Advanced Industrial Science and Technology
    Inventors: Hideyuki Negishi, Akira Endo, Masaru Nakaiwa, Hiroshi Yanagishita
  • Publication number: 20090082201
    Abstract: A mesoporous silica thick-film comprising a layer of mesoporous silica formed in a thickness of 10 ?m to 1 mm, and a process for producing a mesoporous silica thick-film, which comprises disposing a substrate in a solution containing mesoporous silica suspended therein and subsequently applying a voltage thereby to form a film having a thickness of 10 ?m to 1 mm by the electrophoretic deposition of the mesoporous silica on a surface of the substrate is provided.
    Type: Application
    Filed: April 20, 2006
    Publication date: March 26, 2009
    Inventors: Hideyuki Negishi, Akira Endo, Masaru Nakaiwa, Hiroshi Yanagishita