Patents by Inventor Hideyuki Okumura

Hideyuki Okumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090169869
    Abstract: The present invention relates to a gas-absorbing substance that contains at least Li and a solid material having a hardness of 5 or more, and absorbs at least nitrogen or oxygen at 25° C.
    Type: Application
    Filed: January 13, 2006
    Publication date: July 2, 2009
    Inventors: Chie Hirai, Kazutaka Uekado, Akiko Yuasa, Akihiro Nozue, Hideyuki Okumura, Keiichi Ishihara, Eiji Yamasue
  • Publication number: 20080160291
    Abstract: The present invention relates to a gas-absorbing substance that contains at least Li and a solid material having a hardness of 5 or more, and absorbs at least nitrogen or oxygen at 25° C.
    Type: Application
    Filed: January 13, 2006
    Publication date: July 3, 2008
    Inventors: Chie Hirai, Kazutaka Uekado, Akiko Yuasa, Akihiro Nozue, Hideyuki Okumura, Keiichi Ishihara, Eiji Yamasue
  • Patent number: 5357913
    Abstract: A pair of embodiments of flame arrester arrangements for marine propulsion engines wherein the flame arrester is positioned vertically above the thermostat housing at one end of the engine and the plenum chamber for the intake manifold is disposed above the exhaust elbow of the engine so as to provide good induction efficiency and compact size. Different configurations of flame arresters are disclosed and they both provide very large effective inlet areas and, at the same time, good flame protection.
    Type: Grant
    Filed: April 12, 1993
    Date of Patent: October 25, 1994
    Assignee: Sanshin Kogyo Kabushiki Kaisha
    Inventors: Hideyuki Okumura, Masanori Urita
  • Patent number: 4814944
    Abstract: In this mounting structure and method for a surface mounted type electronic component, the component has at least one terminal which protrudes from its bottom surface and which terminates in a foot portion for being soldered to a printed circuit board. Also, a projection extends from this bottom surface of the electronic component for a distance somewhat less than the amounty by which the terminal projects from it. This projection is provisionally secured by adhesive to the printed circuit board with the foot portion of the terminal overlaying that circuit portion to which it is to be soldered, and then subsequently this terminal foot portion is soldered to this circuit portion. Thereby, during the soldering process, there is no risk of the terminal foot portion becoming displaced from the circuit portion and thus badly soldered thereto, because of the locating action of the adhered projection.
    Type: Grant
    Filed: July 13, 1988
    Date of Patent: March 21, 1989
    Assignee: Omron Tateisi Electronics Co.
    Inventors: Hiroyuki Sagawa, Hirofumi Koga, Shunichi Agatahama, Hideyuki Okumura, Kazushige Matsuoka, Ryuichi Sato