Abstract: Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, and having a weak adhesive strength in a direction vertical to the surface. Also provided is a method of producing such adsorption temporary fixing sheet. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 20 hours at each of such different temperatures as ?40° C., 23° C., or 125° C. is represented by V1 (N/1 cm?), V2 (N/1 cm?), or V3 (N/1 cm?) and when a silicon chip shearing adhesive strength of the surface of the foam layer after 20 hours at each of the different temperatures (?40° C., 23° C., or 125° C.) is represented by H1 (N/1 cm?), H2 (N/1 cm?), or H3 (N/1 cm?), relationships of V1<H1, V2<H2, and V3<H3 are satisfied.

Abstract: Provided is a foam sheet that can raise an electrostatic capacitance at the time of compression, and hence can improve sensitivity when used for an electrostatic capacitance sensor. The foam sheet includes: a foam layer; and a pressure-sensitive adhesive layer arranged on at least one side of the foam layer, wherein the foam sheet has a dielectric constant increase amount Q-P at 10% compression of 0.2 (F/m) or more, where P (F/m) represents a dielectric constant of the foam sheet immediately after the foam sheet has been left at rest under conditions of a temperature of 23° C. and a humidity of 50% for 2 hours, and Q (F/m) represents a dielectric constant of the foam sheet at a time when the foam sheet is compressed by 10% immediately after being left at rest under the conditions of a temperature of 23° C. and a humidity of 50% for 2 hours.

Abstract: Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, having a weak adhesive strength in a direction vertical to the surface, and having excellent antistatic performance. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, and has a surface resistivity of from 1.0×104 to 1.0×1010?/?, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 18 hours at each of such different temperatures as ?30° C., 23° C., or 80° C. is represented by V1, V2, or V3 (N/1 cm2), and when a silicon chip shearing adhesive strength of the surface of the foam layer after 18 hours at each of such different temperatures as ?30° C., 23° C., or 80° C. is represented by H1, H2, or H3 (N/1 cm?), relationships of V1<H1, V2<H2, and V3<H3 are satisfied.

Abstract: There is provided a foamed sheet having the excellent impact absorbability and the excellent resistance to repetitive impacts. The foamed sheet of the present invention has an average cell diameter of 10 to 200 ?m, a resiliency of 6.0 N/cm2 or less when compressed to 50% of an original thickness thereof, and a thickness recovery rate defined by the following equation of 90% or more: thickness recovery rate (%)=(thickness 0.5 seconds after compressed state is released)/(original thickness)×100 original thickness: a thickness of the foamed sheet before a load is applied, thickness 0.5 seconds after compressed state is released: a thickness of the foamed sheet after a compressed state in which a load of 100 g/cm2 is applied to the foamed sheet is kept for 120 seconds followed by release of the foamed sheet from the compression and an elapse of 0.5 seconds from the release.

Abstract: Provided is a foam sheet that can raise an electrostatic capacitance at the time of compression, and hence can improve sensitivity when used for an electrostatic capacitance sensor. The foam sheet includes: a foam layer; and a pressure-sensitive adhesive layer arranged on at least one side of the foam layer, wherein the foam sheet has a dielectric constant increase amount Q-P at 10% compression of 0.2 (F/m) or more, where P (F/m) represents a dielectric constant of the foam sheet immediately after the foam sheet has been left at rest under conditions of a temperature of 23° C. and a humidity of 50% for 2 hours, and Q (F/m) represents a dielectric constant of the foam sheet at a time when the foam sheet is compressed by 10% immediately after being left at rest under the conditions of a temperature of 23° C. and a humidity of 50% for 2 hours.

Abstract: Provided is a foam sheet showing little change in dielectric constant even when exposed under a high-humidity condition. The foam sheet of the present invention includes: a foam layer; and a pressure-sensitive adhesive layer arranged on at least one side of the foam layer, wherein the foam sheet has an impact absorbability change amount [(Q?P)×100]/P of 10 (%) or less, where P (N) represents impact absorbability of the foam layer immediately after the foam sheet has been left at rest under conditions of a temperature of 23° C. and a humidity of 50% for 2 hours, and Q (N) represents impact absorbability of the foam layer immediately after the foam sheet has been left at rest under conditions of a temperature of 60° C. and a humidity of 95% for 24 hours.

Abstract: Provided is a foam sheet showing little change in dielectric constant even when exposed under a high-humidity condition. The foam sheet of the present invention includes: a foam layer; and a pressure-sensitive adhesive layer arranged on at least one side of the foam layer, wherein the foam sheet has a dielectric constant change amount [(Y?X)×100]/X of 10(%) or less, where X (F/m) represents a dielectric constant of the foam layer immediately after the foam sheet has been left at rest under conditions of a temperature of 23° C. and a humidity of 50% for 2 hours, and Y (F/m) represents a dielectric constant of the foam layer immediately after the foam sheet has been left at rest under conditions of a temperature of 60° C. and a humidity of 95% for 24 hours.

Abstract: Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, having a weak adhesive strength in a direction vertical to the surface, and having excellent antistatic performance. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, and has a surface resistivity of from 1.0×104 to 1.0×1010?/?, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 18 hours at each of such different temperatures as ?30° C., 23° C., or 80° C. is represented by V1, V2, or V3 (N/1 cm?), and when a silicon chip shearing adhesive strength of the surface of the foam layer after 18 hours at each of such different temperatures as ?30° C., 23° C., or 80° C. is represented by H1, H2, or H3 (N/1 cm?), relationships of V1<H1, V2<H2, and V3<H3 are satisfied.

Abstract: Provided is a temporary fixing sheet including a silicone foam layer and having excellent antistatic performance and a satisfactory appearance. A temporary fixing sheet includes a silicone foam layer, wherein the silicone foam layer is formed of a silicone resin composition including: an organopolysiloxane having at least two alkenyl groups in a molecule thereof; an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule thereof; a mixture including water and an inorganic thickener; 0.2 part by weight to 1.2 parts by weight of a nonionic surfactant having an HLB value of 3 or more with respect to 1 part by weight of a component; 0.01 part by weight to 0.14 part by weight of a nonionic surfactant having an HLB value of less than 3 with respect to 1 part by weight of the component; a hydrosilylation reaction catalyst; a curing retarder; and a conductive substance.

Abstract: Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, and having a weak adhesive strength in a direction vertical to the surface. Also provided is a method of producing such adsorption temporary fixing sheet. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 20 hours at each of such different temperatures as ?40° C., 23° C., or 125° C. is represented by V1 (N/1 cm?), V2 (N/1 cm?), or V3 (N/1 cm?) and when a silicon chip shearing adhesive strength of the surface of the foam layer after 20 hours at each of the different temperatures (?40° C., 23° C., or 125° C.) is represented by H1 (N/1 cm?), H2 (N/1 cm?), or H3 (N/1 cm?), relationships of V1<H1, V2<H2, and V3<H3 are satisfied.

Abstract: There is provided a foamed sheet which takes only a short time to recover the thickness thereof after being compressed, and even if being subjected to repeated impacts, hardly decreases in the impact absorption. The foamed sheet according to the present invention comprises a foamed body formed of a resin composition comprising: a thermoplastic resin a and a silicone-based compound b having not more than 2,000 siloxane bonds; and/or a thermoplastic resin a? having a silicone chain having not more than 2,000 siloxane bonds. The thermoplastic resin a is preferably at least one selected from the group consisting of acrylic polymers, rubbers, urethanic polymers and ethylene-vinyl acetate copolymers. The silicone-based compound b is preferably at least one selected from the group consisting of silicone oils, modified silicone oils and silicone resins.

Abstract: A foamed sheet according to the present invention has a thickness of 30 to 500 ?m and includes a foam. The foam has a density of 0.2 to 0.7 g/cm3, an average cell diameter of 10 to 150 ?m, and a peak top of loss tangent (tan ?) occurring in a temperature range of from ?30° C. to 30° C., where the loss tangent is defined as the ratio of a loss modulus to a storage modulus determined at an angular frequency of 1 rad/s in dynamic viscoelastic measurement of the foam. The foam preferably has a maximum of the loss tangent (tan ?) in the temperature range of from ?30° C. to 30° C. of 0.2 or more.

Abstract: There is provided a foamed sheet which takes only a short time to recover the thickness thereof after being compressed, and even if being subjected to repeated impacts, hardly decreases in the impact absorption. The foamed sheet according to the present invention comprises a foamed body formed of a resin composition comprising: a thermoplastic resin a and a silicone-based compound b having not more than 2,000 siloxane bonds; and/or a thermoplastic resin a? having a silicone chain having not more than 2,000 siloxane bonds. The thermoplastic resin a is preferably at least one selected from the group consisting of acrylic polymers, rubbers, urethanic polymers and ethylene-vinyl acetate copolymers. The silicone-based compound b is preferably at least one selected from the group consisting of silicone oils, modified silicone oils and silicone resins.

Abstract: The foamed sheet includes a foamed body having an average cell diameter of 10 to 200 ?m, and a compression set at 80° C. of not more than 80% and an impact absorption change rate of not more than ±20% defined by: Impact absorption change rate (%)={(an impact absorption rate b after high-temperature compression?an initial impact absorption rate a)/the initial impact absorption rate a}×100, where the impact absorption rate a is an impact absorption rate (%) of a test piece A and the impact absorption rate b (%) after high-temperature compression is an impact absorption rate (%) acquired by storing the test piece A at 80° C. for 72 hours in the state of being compressed by 60% with respect to the initial thickness of the test piece A, thereafter releasing the compression state, and thereafter conducting measurement after a lapse of 24 hours at 23° C.

Abstract: A foamed sheet according to the present invention has a thickness of 30 to 500 ?m and includes a foam. The foam has a density of 0.2 to 0.7 g/cm3, an average cell diameter of 10 to 150 ?m, and a peak top of loss tangent (tan ?) occurring in a temperature range of from ?30° C. to 30° C., where the loss tangent is defined as the ratio of a loss modulus to a storage modulus determined at an angular frequency of 1 rad/s in dynamic viscoelastic measurement of the foam. The foam preferably has a maximum of the loss tangent (tan ?) in the temperature range of from ?30° C. to 30° C. of 0.2 or more.