Patents by Inventor Hideyuki Tsujimura

Hideyuki Tsujimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150187977
    Abstract: To provide a solar cell module formed by a lamination structure in which a lower sealing portion (101) having a total light reflectance of 50% or more is arranged on a back sheet (106) side with respect to a solar cell device (103) and an upper sealing portion (102) having a total light transmittance of 50% or more is arranged on a solar-light irradiation surface side with respect to a solar cell device (103), and a porous body (104) is interposed between the lower sealing portion (101) and the solar cell device (103). To further provide a solar cell module in which an opening is formed in the porous body and the solar cell device is positioned in the opening.
    Type: Application
    Filed: June 18, 2013
    Publication date: July 2, 2015
    Inventors: Hideyuki Tsujimura, Naomichi Ohashi
  • Patent number: 8664773
    Abstract: A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity ?1 and a thixotropy index T1 at a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity ?2 and a thixotropy index T2 so that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30??2??1?300 (Pa·s) and 3?T2?T1?7, and sectional area S1 of the first adhesive part and sectional area S2 of the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S1?S2.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: March 4, 2014
    Assignee: Panasonic Corporation
    Inventors: Atsushi Yamaguchi, Hideyuki Tsujimura, Hiroe Kowada, Ryo Kuwabara, Naomichi Ohashi
  • Patent number: 8344268
    Abstract: An electronic component packaging structure includes a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or solubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.
    Type: Grant
    Filed: July 1, 2009
    Date of Patent: January 1, 2013
    Assignee: Panasonic Corporation
    Inventors: Hideyuki Tsujimura, Hidenori Miyakawa, Atsushi Yamaguchi, Hiroe Kowada, Koso Matsuno
  • Publication number: 20120299202
    Abstract: A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity ?1 and a thixotropy index T1 at a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity ?2 and a thixotropy index T2 so that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30??2??1?300 (Pa·s) and 3?T2?T1?7, and sectional area S1 of the first adhesive part and sectional area S2 of the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S1?S2.
    Type: Application
    Filed: May 22, 2012
    Publication date: November 29, 2012
    Applicant: Panasonic Corporation
    Inventors: Atsushi YAMAGUCHI, Hideyuki TSUJIMURA, Hiroe KOWADA, Ryo KUWABARA, Naomichi OHASHI
  • Patent number: 7785500
    Abstract: The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: August 31, 2010
    Assignee: Panasonic Corporation
    Inventors: Atsushi Yamaguchi, Hidenori Miyakawa, Takayuki Higuchi, Koso Matsuno, Hideyuki Tsujimura
  • Publication number: 20100002401
    Abstract: The electronic component packaging structure having, as the moisture-proof coating layer, a polymer material that has sufficient moisture-proof performance and can be relatively easily peeled off from a circuit board and/or electronic components when repairing can be provided. The electronic component packaging structure of the invention comprises a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or volubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.
    Type: Application
    Filed: July 1, 2009
    Publication date: January 7, 2010
    Inventors: Hideyuki TSUJIMURA, Hidenori MIYAKAWA, Atsushi YAMAGUCHI, Hiroe KOWADA, Koso MATSUNO
  • Publication number: 20090114885
    Abstract: The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.
    Type: Application
    Filed: October 31, 2006
    Publication date: May 7, 2009
    Inventors: Atsushi Yamaguchi, Hidenori Miyakawa, Takayuki Higuchi, Koso Matsuno, Hideyuki Tsujimura