Abstract: A manufacture work machine for preforming a manufacture work, including: work-element performing apparatuses each configured to perform one of work elements of the manufacture work, and a central control device to control the apparatuses in a centralized manner, such that motion commands for one motion to be performed by one of the apparatuses are sequentially transmitted, wherein each apparatus has an individual control device to control an operation of said each apparatus and at least one operating device for performing a work element corresponding to said each apparatus, and wherein the individual control device is configured to recognize a matter of the motion command transmitted from the central control device and is configured to control an operation of each of the at least one operating device so as to permit one of the apparatuses to which the individual control device belongs to perform one motion corresponding to the motion command.

Abstract: A device attachment member used for a manufacture work machine equipped with: a device necessary for performing a manufacture work; a main frame on which the device is to be installed; and a controller configured to control the device, the device attachment member including a main body to be attached to the device, wherein the device attachment member includes an identification-information recording medium in which is recorded identification information, the device being identified by the controller based on the identification information, the identification-information recording medium being incorporated in the main body.

Abstract: A device attachment member used for a manufacture work machine equipped with: a device necessary for performing a manufacture work; a main frame on which the device is to be installed; and a controller configured to control the device, the device attachment member including a main body to be attached to the device, wherein the device attachment member includes an identification-information recording medium in which is recorded identification information, the device being identified by the controller based on the identification information, the identification-information recording medium being incorporated in the main body.

Abstract: A manufacture work machine for preforming a manufacture work, including: work-element performing apparatuses each configured to perform one of work elements of the manufacture work, and a central control device to control the apparatuses in a centralized manner, such that motion commands for one motion to be performed by one of the apparatuses are sequentially transmitted, wherein each apparatus has an individual control device to control an operation of said each apparatus and at least one operating device for performing a work element corresponding to said each apparatus, and wherein the individual control device is configured to recognize a matter of the motion command transmitted from the central control device and is configured to control an operation of each of the at least one operating device so as to permit one of the apparatuses to which the individual control device belongs to perform one motion corresponding to the motion command.

Abstract: The wireless base station notifies the missing to the transmitter upon detection of missing of a data segment received from the transmitter, and the transmitter controls the header compression state of the data segment addressed to the wireless terminal upon the reception of the notification of the missing.

Abstract: A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300° C. or above and (B) a platy inorganic filler incorporated in the resin and having the following properties; pH of aqueous dispersion: 5.5-8.0, amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below, maximum diameter a: 50 ?m or below, thickness b: 1.0 ?m or below, and aspect ratio (a/b): 20 or above.

Abstract: The wireless base station notifies the missing to the transmitter upon detection of missing of a data segment received from the transmitter, and the transmitter controls the header compression state of the data segment addressed to the wireless terminal upon the reception of the notification of the missing.

Abstract: A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300° C. or above and (B) a platy inorganic filler incorporated in the resin and having the following properties; pH of aqueous dispersion: 5.5-6.0, amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below, maximum diameter a: 50 ?m or below, thickness b: 1.0 ?m or below, and aspect ratio (a/b): 20 or above.

Abstract: A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300° C. or above and (B) a platy inorganic filler incorporated in the resin and having the following properties; pH of aqueous dispersion: 5.5-8.0, amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below, maximum diameter a: 50 ?m or below, thickness b: 1.0 ?m or below, and aspect ratio (a/b): 20 or above.

Abstract: A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300° C. or above and (B) a platy inorganic filler incorporated in the resin and having the following properties; pH of aqueous dispersion: 5.5-8.0, amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below, maximum diameter a: 50 ?m or below, thickness b: 1.0 ?m or below, and aspect ratio (a/b): 20 or above.

Abstract: Semiconductor wafers are cleaned by placing the semiconductor wafers in a processing vessel, forming a pure water film on the surfaces of the wafers, forming an ozonic water film by dissolving ozone gas in the pure water film, and removing resist films formed on the wafers by the agency of the ozonic water film. The pure water film is formed by condensing steam on the surfaces of the wafers. The resist films formed on the surfaces of the wafers can be removed by also using hydroxyl radicals produced by interaction between steam and ozone gas supplied into the processing vessel. Thus, the resist films can be removed highly effectively.

Abstract: A resource assigning method and a diagnostic system of an arithmetic circuit using the same are provided, which can determine the normality of the arithmetic circuit in real time during system operation without increasing the scale of the apparatus. The method includes the steps of setting a rate b of diagnosis target resources depending on a rate a of resources used in actual operation; and setting a margin resource rate c in advance to accommodate to fluctuating resources thereby to obtain the rate b of diagnosis target resources as b %=100%?a %?c %.

Abstract: The present invention relates to a resin composition for reflector plates containing 30 to 95% by weight of a semi-aromatic polyamide having the ratio of aromatic monomers to all the monomer components being 20% by mole or more, and 5 to 70% by weight of potassium titanate fiber and/or wollastonite. Additionally, the present invention relates to a resin composition for reflector plates used for an ultraviolet-ray generating source, comprising a thermoplastic resin and at least one inorganic compound selected from the group consisting of fibrous and flaky inorganic compounds capable of reflecting ultraviolet rays as well as visible light.

Abstract: Semiconductor wafers are cleaned by placing the semiconductor wafers in a processing vessel, forming a pure water film on the surfaces of the wafers, forming an ozonic water film by dissolving ozone gas in the pure water film, and removing resist films formed on the wafers by the agency of the ozonic water film. The pure water film is formed by condensing steam on the surfaces of the wafers. The resist films formed on the surfaces of the wafers can be removed by also using hydroxyl radicals produced by interaction between steam and ozone gas supplied into the processing vessel. Thus, the resist films can be removed highly effectively.

Abstract: The present invention relates to a resin composition for reflector plates containing 30 to 95% by weight of a semi-aromatic polyamide having the ratio of aromatic monomers to all the monomer components being 20% by mole or more, and 5 to 70% by weight of potassium titanate fiber and/or wollastonite. Additionally, the present invention relates to a resin composition for reflector plates used for an ultraviolet-ray generating source, comprising a thermoplastic resin and at least one inorganic compound selected from the group consisting of fibrous and flaky inorganic compounds capable of reflecting ultraviolet rays as well as visible light.

Abstract: Semiconductor wafers are cleaned by placing the semiconductor wafers in a processing vessel, forming a pure water film on the surfaces of the wafers, forming an ozonic water film by dissolving ozone gas in the pure water film, and removing resist films formed on the wafers by the agency of the ozonic water film. The pure water film is formed by condensing steam on the surfaces of the wafers. The resist films formed on the surfaces of the wafers can be removed by also using hydroxyl radicals produced by interaction between steam and ozone gas supplied into the processing vessel. Thus, the resist films can be removed highly effectively.

Abstract: The present invention provides a resin composition comprising (A) at least one heat-resistant thermoplastic resin selected from the group consisting of a polyketone resin, a polyimide resin, polyethernitrile, polybenzimidazole, polyphenylene sulfide, polysulfone, polyethersulfone, polyarylate, a liquid crystal polyester resin, and 1,4-polyphenylene, and (B) a flaky inorganic filler that: (1) has a Mohs hardness of 3.0 or lower, (2) has a coefficient of linear expansion not higher than 5.0×10−5/K, (3) is chemically inert and retains a layer structure to at least 500° C., and (4) has an aspect ratio (the average particle diameter/thickness ratio) of 10 or higher; a formed article thereof; and a substrate film for printed circuit boards as use thereof.

Abstract: Semiconductor wafers are cleaned by placing the semiconductor wafers in a processing vessel, forming a pure water film on the surfaces of the wafers, forming an ozonic water film by dissolving ozone gas in the pure water film, and removing resist films formed on the wafers by the agency of the ozonic water film. The pure water film is formed by condensing steam on the surfaces of the wafers. The resist films formed on the surfaces of the wafers can be removed by also using hydroxyl radicals produced by interaction between steam and ozone gas supplied into the processing vessel. Thus, the resist films can be removed highly effectively.

Abstract: A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300° C.