Abstract: A semiconductor laser device includes a semiconductor layer that includes a light emitting region having a first width and a pad region formed in a region outside the light emitting region and having a second width exceeding the first width, an insulating layer that covers the light emitting region and the pad region, and a wiring electrode that has an internal connection region penetrating through the insulating layer and electrically connected to the light emitting region and an external connection region that covers the pad region across the insulating layer and is to be externally connected to a lead wire.

Abstract: A semiconductor device includes a substrate having a mounting surface, a plurality of internal terminals disposed on the mounting surface, a light-receiving element mounted on the mounting surface, a light-emitting element mounted on the mounting surface, a first bonding wire and a light-transmitting element. The light-receiving element has a light-receiving region that detects light and a plurality of element pad portions. At least one of the plurality of element pad portions is electrically connected to the light-receiving region. The light-emitting element is spaced apart from the light-receiving element along a first direction perpendicular to a thickness direction of the substrate. The first bonding wire connects one of the plurality of element pad portions of the light-receiving element to one of the plurality of internal terminals. The first bonding wire is located on a side of the light-receiving element opposite the light-emitting element along the first direction.

Abstract: A semiconductor device includes a substrate having a mounting surface, a plurality of internal terminals disposed on the mounting surface, a light-receiving element mounted on the mounting surface, a light-emitting element mounted on the mounting surface, a first bonding wire and a light-transmitting element. The light-receiving element has a light-receiving region that detects light and a plurality of element pad portions. At least one of the plurality of element pad portions is electrically connected to the light-receiving region. The light-emitting element is spaced apart from the light-receiving element along a first direction perpendicular to a thickness direction of the substrate. The first bonding wire connects one of the plurality of element pad portions of the light-receiving element to one of the plurality of internal terminals. The first bonding wire is located on a side of the light-receiving element opposite the light-emitting element along the first direction.

Abstract: A semiconductor device includes a substrate having a mounting surface, a plurality of internal terminals disposed on the mounting surface, a light-receiving element mounted on the mounting surface, a light-emitting element mounted on the mounting surface, a first bonding wire and a light-transmitting element. The light-receiving element has a light-receiving region that detects light and a plurality of element pad portions. At least one of the plurality of element pad portions is electrically connected to the light-receiving region. The light-emitting element is spaced apart from the light-receiving element along a first direction perpendicular to a thickness direction of the substrate. The first bonding wire connects one of the plurality of element pad portions of the light-receiving element to one of the plurality of internal terminals. The first bonding wire is located on a side of the light-receiving element opposite the light-emitting element along the first direction.

Abstract: An optical device includes a light-emitting unit and a light-receiving unit. The light-emitting unit emits light forward in a first direction. The light-emitting unit has a light-emitting-side through hole that causes light traveling backward in the first direction to pass through. The light-receiving unit is arranged backward in the first direction relative to the light-emitting unit. The light-receiving unit has a light receiver that receives light after the light has passed through the light-emitting-side through hole.

Abstract: One aspect of the present disclosure provides a semiconductor device. The semiconductor device includes a substrate, a plurality of internal terminals, a light-receiving element, a light-emitting element, a first bonding wire and a light-transmitting element. The substrate has a mounting surface and an attachment surface facing away from each other. The plurality of internal terminals are disposed on the mounting surface. The light-receiving element has a light-receiving region that detects light and a plurality of element pad portions. The light-receiving element is mounted on the mounting surface of the substrate. At least one of the plurality of element pad portions is electrically connected to the light-receiving region. The light-emitting element is mounted on the mounting surface of the substrate and spaced apart from the light-receiving element in a first direction perpendicular to a thickness direction of the substrate.

Abstract: An optical device includes a light-emitting unit and a light-receiving unit. The light-emitting unit emits light forward in a first direction. The light-emitting unit has a light-emitting-side through hole that causes light traveling backward in the first direction to pass through. The light-receiving unit is arranged backward in the first direction relative to the light-emitting unit. The light-receiving unit has a light receiver that receives light after the light has passed through the light-emitting-side through hole.